prof.dr. GuoQi Zhang

Projects history

1. Investigation on fabrication of silicon nanoporesusing an electrochemical passivation etch-stopstrategy
   Hao Hong; Xin Lei; Jiangtao Wei; Wenjun Tang; Minjie Ye; Jianwen Sun; Guoqi Zhang; Pasqualina M. Sarro; Zewen Liu;
   Microsystems & Nanoengineering,
   2025. DOI: doi.org/10.1038/s41378-025-00973-9

2. A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting
   Xinling Yue; Jiarui Mo; Zhiyuan Chen; Sten Vollebregt; Guoqi Zhang; Sijun Du;
   IEEE Transactions on Power Electronics,
   Volume 39, Issue 6, pp. 7643-7653, 2024. DOI: 10.1109/TPEL.2024.3369728

3. Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
   Yaqian Zhang; Leiming Du; Olof Bäcke; Sebastian Kalbfleisch; Guoqi Zhang; Sten Vollebregt; Magnus Hörnqvist Colliander;
   Applied Physics Letters,
   Volume 124, pp. 083501-1-6, 2024. DOI: 10.1063/5.0192672

4. A high aspect ratio surface micromachined accelerometer based on a SiC-CNT composite material
   Jiarui Mo; Shreyas Shankar; Roberto Pezone; Guoqi Zhang; Sten Vollebregt;
   Microsystems & Nanoengineering,
   Volume 10, Issue 42, 2024. DOI: 10.1038/s41378-024-00672-x

5. An Analog to Digital Converter in a SiC CMOS Technology for High-temperature Applications
   Jiarui Mo; Yunfan Niu; Alexander May; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt;
   Applied Physics Letters,
   Volume 124, Issue 15, 2024. DOI: 10.1063/5.0195013

6. Rectification in Ionic Field Effect Transistors Based on Single Crystal Silicon Nanopore
   Hao Hong; Xin Lei; Jiangtao Wei; Yang Zhang; Yulong Zhang; Jianwen Sun; Guoqi Zhang; Pasqualina M. Sarro; Zewen Liu;
   Advanced Electronic Materials,
   pp. 2300782, 2024. DOI: 10.1002/aelm.202300782

7. High-Performance Flexible Strain Sensor Fabricated Using Laser Transmission Pyrolysis
   S. Wang; Huiru Yang; Qihang Zong; Qianming Huang; Chunjia Tan; Chenshan Gao; Shinzhen Li; Huaiyu Yem; Guoqi Zhang; Paddy French;
   IEEE Sensors Journal,
   Volume 24, pp. 7521-7529, 2024. DOI: doi: 10.1109/JSEN.2023.3337233
   
   Keywords: ...

   Laser transmission pyrolysis (LTP), metal film, polydimethylsiloxane (PDMS) pattering, stretchable strain sensors, ultraviolet (UV) laser..
   
   
   Abstract: ...

   n recent years, metal crack-based stretchable flexible strain sensors have attracted significant attention in wearable device applications due to their extremely high sensitivity. However, the tradeoff between sensitivity and detection range has been an intractable dilemma, severely limiting their practical applications. Herein, we propose a laser transmission pyrolysis (LTP) technology for fabricating high-performance flexible strain sensors based on (Au) metal cracks with the microchannel array on the polydimethylsiloxane (PDMS) surface. The fabricated flexible strain sensors exhibit high sensitivity [gauge factor (GF) of 2448], wide detection range (59% for tensile strain), precise strain resolution (0.1%), fast response and recovery times (69 and 141 ms), and robust durability (over 3000 cycles). In addition, experiment and simulation results reveal that introducing a microchannel array enables the stress redistribution strategy on the sensor surface, which significantly improves the sensing sensitivity compared to conventional flat surface sensors. Based on the excellent performance, the sensors are applied to detect subtle physiological signals, such as pulse and swallowing, as well as to monitor large-scale motion signals, such as knee flexion and finger bending, demonstrating their potential applications in health monitoring, human–machine interactions, and electronic skin.

8. Effects of Current Filaments on IGBT Avalanche Robustness: A Simulation Study
   Jingping Zhang; Houcai Luo; Huan Wu; Bofeng Zheng; Xianping Chen; Guoqi Zhang; Paddy French; Shaogang Wang;
   Electronics,
   2024. DOI: https://doi.org/10.3390/electronics13122347
   
   Keywords: ...

   IGBT; avalanche; current filament; robustness; SOA.
   
   
   Abstract: ...

   With the increase in voltage level and current capacity of the insulated gate bipolar transistor (IGBT), the avalanche effect has become an important factor limiting the safe operating area (SOA) of the device. The hole injection into the p/n junction on the backside of the IGBT after avalanche is the main feature that distinguishes the avalanche effect from other devices. In this paper, the avalanche breakdown characteristics of IGBT and the nature of current filament are investigated using theoretical analysis and numerical simulation, and the underlying physical mechanism controlling the nature of current filaments is revealed. The results show that the hole injection on the backside of the IGBT leads to an additional negative differential resistance (NDR) branch on the avalanche breakdown curve. The device’s common-base current gain, αpnp, is a crucial factor in determining the current filament. As αpnp increases, the avalanche-induced current filament becomes stronger and slower, resulting in weaker avalanche robustness of the device.

9. Temperature Sensing Elements for Harsh Environments in a 4H-SiC CMOS Technology
   Jiarui Mo; Jinglin Li; Alexander May; Mathias Rommel; Sten Vollebregt; Guoqi Zhang;
   IEEE Transactions on Electron Devices,
   Volume 71, Issue 10, pp. 5881-5887, 2024. DOI: 10.1109/TED.2024.3450828

10. Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
    Jiarui Mo; Gerald J.K. Schaffar; Leiming Du; Verena Maier-Kiener; Daniel Kiener; Sten Vollebregt; Guoqi Zhang;
    In IEEE 37th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2024),
    2024. DOI: 10.1109/MEMS58180.2024.10439455

11. Chitosan Oligosaccharide Laser Lithograph: A Facile Route to Porous Graphene Electrodes for Flexible On-Chip Microsupercapacitors
    Qian-Ming Huang; Huiru Yang; Shaogang Wang; Guoqi Zhang; Paddy French; Huaiyu Ye;
    In Proceedings IEEE NEMS 2024,
    IEEE, IEEE, May 2024.

12. Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation
    Xu Liu; Shaogang Wang; Dong Hu; Chenshan Gao; Qianming Huang; Huaiyu Ye; Paddy French; Guoqi Zhang;
    In IEEE 74th Electronic Components and Technology Conference (ECTC),
    Denver, Colorado, IEEE, IEEE, May 2024.

13. In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques
    Yaqian Zhang; Yixin Yan; Sten Vollebregt; GuoQi Zhang;
    In Proceedings - IEEE 74th Electronic Components and Technology Conference (ECTC),
    pp. 1317-1321, 2024. DOI: 10.1109/ECTC51529.2024.00214

14. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
    R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

15. Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
    Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
    Journal of the Mechanics and Physics of Solids,
    Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257

16. Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
    Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
    Journal of the Mechanics and Physics of Solids,
    Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256

17. Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics
    Joost Romijn; Sten Vollebregt; Vincent G. de Bie; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
    Sensors and Actuators A: Physical,
    Volume 354, pp. 114268, 2023. DOI: 10.1016/j.sna.2023.114268

18. A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology
    Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt;
    IEEE Electron Device Letters,
    Volume 44, Issue 6, pp. 995-998, 2023. DOI: 10.1109/LED.2023.3268334

19. Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method
    Hao Hong; Jiangtao Wei; Xin Lei; Haiyun Chen; Pasqualina M. Sarro; Guoqi Zhang; Zewen Liu;
    Microsystems & Nanoengineering,
    Volume 9, pp. 63, 2023. DOI: 10.1038/s41378-023-00532-0

20. Nanostructured Thermoelectric Films Synthesised by Spark Ablation and Their Oxidation Behaviour
    Joost van Ginkel; Lisa Mitterhuber; Marijn Willem van de Putte; Mark Huijben; Sten Vollebregt; Guoqi Zhang;
    Nanomaterials,
    Volume 13, Issue 11, pp. 1778, 2023. DOI: 10.3390/nano13111778

21. Reverse Recovery Optimization of Multiepi Superjunction MOSFET Based on Tunable Doping Profile
    Ke Liu; Chunjian Tan; Shizhen Li; Wucheng Yuan; Xu Liu; Guoqi Zhang; Paddy French; Huaiyu Ye; Shaogang Wang;
    Electronics,
    Volume 12, Issue 2977, 2023. DOI: https://doi.org/10.3390/electronics12132977
    
    Keywords: ...

    superjunction; MOSFET; doping profile; reverse recovery; body diode.
    
    
    Abstract: ...

    This paper proposes and simulates research on the reverse recovery characteristics of two novel superjunction (SJ) MOSFETs by adjusting the doping profile. In the manufacturing process of the SJ MOSFET using multilayer epitaxial deposition (MED), the position and concentration of each Boron bubble can be adjusted by designing different doping profiles to adjust the resistance of the upper half P-pillar. A higher P-pillar resistance can slow down the sweep out speed of hole carriers when the body diode is turned off, thus resulting in a smoother reverse recovery current and reducing the current recovery rate (dir/dt) from a peak to zero. The simulation results show that the reverse recovery peak current (Irrm) of the two proposed devices decreased by 5% and 3%, respectively, compared to the conventional SJ. Additionally, the softness factor (S) increased by 64% and 55%, respectively. Furthermore, this study also demonstrates a trade-off relationship between static and reverse recovery characteristics with the adjustable doping profile, thus providing a guideline for actual application scenarios.

22. Rapid Fabrication of High-Performance Flexible Pressure Sensors Using Laser Pyrolysis Direct Writing
    Shaogang Wang; Qihang Zong; Huiru Yang; Chunjian Tan; Qianming Huang; Xu Liu; Guoqi Zhang; Paddy French; Huaiyu Ye;
    Applied Materials and Interfaces,
    2023. DOI: https://doi.org/10.1021/acsami.3c04290
    
    Keywords: ...

    flexible pressure sensor, UV laser, laser direct writing, continuous laser pyrolysis, PDMS, micro-truncated pyramid.
    
    
    Abstract: ...

    The fabrication of flexible pressure sensors with low cost, high scalability, and easy fabrication is an essential driving force in developing flexible electronics, especially for high-performance sensors that require precise surface microstructures. However, optimizing complex fabrication processes and expensive microfabrication methods remains a significant challenge. In this study, we introduce a laser pyrolysis direct writing technology that enables rapid and efficient fabrication of high-performance flexible pressure sensors with a microtruncated pyramid array. The pressure sensor demonstrates exceptional sensitivities, with the values of 3132.0, 322.5, and 27.8 kPa−1 in the pressure ranges of 0−0.5, 0.5−3.5, and 3.5−10 kPa, respectively. Furthermore, the sensor exhibits rapid response times (loading: 22 ms, unloading: 18 ms) and exceptional reliability, enduring over 3000 pressure loading and unloading cycles. Moreover, the pressure sensor can be easily integrated into a sensor array for spatial pressure distribution detection. The laser pyrolysis direct writing technology introduced in this study presents a highly efficient and promising approach to designing and fabricating high-performance flexible pressure sensors utilizing micro-structured polymer substrates.

23. Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
    Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066

24. Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications
    Yunfan Niu; Jiarui Mo; Alexander May; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt;
    In Proc. of IEEE Sensors,
    2023. DOI: 10.1109/SENSORS56945.2023.10325061

25. Silicon carbide reinforced vertically aligned carbon nanotube composite for harsh environment MEMS
    Jiarui Mo; Shreyas Shankar; Guoqi Zhang; Sten Vollebregt;
    In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
    2023. DOI: 10.1109/MEMS49605.2023.10052162

26. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100771

27. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
    Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100810

28. Effect of Thermomigration on Electromigration in SWEAT Structures
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100774

29. Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating
    Zhuorui Tang; Jing Tian; Chaobin Mao; Nan Zhang; Jiyu Huang; Jiajie Fan; Guoqi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100813

30. Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
    Minzhen Wen; Baotong Guo; Shanghuan Chen; Xiao Hu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100750

31. Electromigration-induced local dewetting in Cu films
    Yaqian Zhang; Jiarui Mo; Zhen Cui; Sten Vollebregt; GuoQi Zhang;
    In Proc. of the IEEE International Interconnect Technology Conference,
    2023. DOI: 10.1109/IITC/MAM57687.2023.10154761

32. Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
    Xuejun Fan; Zhen Cui; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

33. Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
    Xinrui Ji; Henk Van Zeijl; Weiping Jiao; Shan He; Leiming Du; Guoqi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

34. Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
    Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

35. A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

36. Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
    Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

37. Thermal-Mechanical-Electrical Co-Design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-Objective Optimization Algorithm
    Wei Chen; Xuyang Yan; Jiajie Fan; Mesfin S. Ibrahim; Jing Jiang; Xuejun Fan; Guoqi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

38. Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications
    Varun Thukral; Irene Bacquet; Michiel Soestbergen; Jeroen Zaal; Romuald Roucou; Rene Rongen; Willem van Driel; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

39. Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
    Henry Antony Martin; Marcia Reintjes; Xiao Tang; Dave Reijs; Sander Dorrestein; Martien Kengen; Sebastien Libon; Edsger Smits; Marco Koelink; Rene Poelma; Willem Van Driel; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

40. High-Temperature Creep Properties of a Novel Solder Material and Its Thermal Fatigue Properties Under Potting Material
    Leiming Du; Guoqi Zhang; Xiujuan Zhao; Willem Van Driel; Rene Poelma;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

41. High-performance Silicon Carbide-on-insulator Thermoresistive High-temperature Sensor Up To 750 C
    Baoyun Sun; Jiarui Mo; Willem D. van Driel; GuoQi Zhang;
    In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
    2023.
    document

42. MOSFET-based And P-N Diode Based Temperature Sensors In A 4H-sSiC CMOS Technology
    Jiarui Mo; Jinglin Li; Yaqian Zhang; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt;
    In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
    2023.
    document

43. Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application
    Baoyun Sun; Jiarui Mo; Hemin Zhang; Henk W. van Zeijl; Willem D. van Driel; GuoQi Zhang;
    In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
    2023. DOI: 10.1109/MEMS49605.2023.10052401

44. Time Dependent Dielectric Breakdown of 4H-SiC MOSFETs in CMOS technology
    Yaqian Zhang; Jiarui Mo; Sten Vollebregt; GuoQi Zhang;
    In 24th International Conference on Electronic Packaging Technology (ICEPT),
    2023. DOI: 10.1109/ICEPT59018.2023.10492218

45. Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology
    Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Guoqi Zhang; Pasqualina M. Sarro;
    IEEE Transactions on Electron Devices,
    Volume 69, Issue 1, pp. 4-10, 2022. DOI: 10.1109/TED.2021.3125279

46. Mass and density determination of porous nanoparticle films using a quartz crystal microbalance
    Hendrik Joost van Ginkel; Sten Vollebregt; GuoQi Zhang; Andreas Schmidt-Ott;
    IOP Nanotechnology,
    Volume 33, Issue 48, 2022. DOI: 10.1088/1361-6528/ac7811

47. Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
    Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
    Journal of Physics: Condensed Matter,
    Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f

48. Angle Sensitive Optical Sensor for Light Source Tracker Miniaturization
    Joost Romijn; Secil Sanseven; Guoqi Zhang; Sten Vollebregt; Pasqualina M. Sarro;
    IEEE Sensors Letters,
    Volume 6, Issue 6, pp. 1-4, 2022. DOI: 10.1109/LSENS.2022.3175607

49. Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges
    V. Thukral; M. van Soestbergen; J.J.M. Zaal; R. Roucou; R.T.H. Rongen; W.D. van Driel; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 139, pp. 114830, 2022. DOI: 10.1016/j.microrel.2022.114830

50. Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology
    Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
    Nature Microsystems & Nanoengineering,
    Volume 8, pp. 114, 2022. DOI: 10.1038/s41378-022-00446-3

51. Reliability of Organic Compounds in Microelectronics and Optoelectronics
    Willem Dirk van Driel; Maryam Yazdan Mehr; Xuejun Fan; GuoQi Zhang (Ed.);
    Springer, , 2022. DOI: 10.1007/978-3-030-81576-9

52. Degradation and Failures of Polymers Used in Light-Emitting Diodes
    Maryam Yazdan Mehr; W. D. van Driel; GuoQi Zhang;
    Springer, , 2022. DOI: 10.1007/978-3-030-81576-9_8

53. Outlook: From Physics of Failure to Physics of Degradation
    W. D. van Driel; Maryam Yazdan Mehr; X. J. Fan; GuoQi Zhang;
    Springer, , 2022. DOI: 10.1007/978-3-030-81576-9_17

54. Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
    Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
    In Proc. IEEE Nano,
    pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705

55. Visible Blind Quadrant Sun Position Sensor in a Silicon Carbide Technology
    Joost Romijn; Sten Vollebregt; Alexander May; Tobias Erlbacher; Henk W. van Zeijl; Johan Leijtens; GuoQi Zhang; Pasqualina M. Sarro;
    In 35th Intl. Conf. on Micro Electro Mechanical Systems (MEMS 2022),
    2022. DOI: 10.1109/MEMS51670.2022.9699533

56. ZnO Nanoparticle Printing for UV Sensor Fabrication
    Hendrik Joost van Ginkel; Mattia Orvietani; Joost Romijn; GuoQi Zhang; Sten Vollebregt;
    In Proc. of IEEE Sensors,
    2022. DOI: 10.1109/SENSORS52175.2022.9967053

57. In-situ reliability monitoring of power packages using a Thermal Test Chip
    H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
    In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2022. DOI: 10.1109/EuroSimE54907.2022.9758913

58. Surface-micromachined Silicon Carbide Pirani Gauges for Harsh Environments
    Jiarui Mo; Luke Middelburg; Bruno Morana; H.W. Van Zeijl; Sten Vollebregt; GuoQi Zhang;
    IEEE Sensors Letters,
    Volume 21, Issue 2, pp. 1350-1358, 2021. DOI: 10.1109/JSEN.2020.3019711

59. A Review of Modification Methods of Solid Electrolytes for All-Solid-State Sodium-Ion Batteries
    Dai, Hanqing; Chen, Yuanyuan; Xu, Wenqian; Hu, Zhe; Gu, Jing; Wei, Xian; Xie, Fengxian; Zhang, Wanlu; Wei, Wei; Guo, Ruiqian; Zhang, Guoqi;
    Energy Technology,
    Volume 9, Issue 1, pp. 2000682, 2021. DOI: 10.1002/ente.202000682
    document

60. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
    Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    Corrosion Science,
    pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

61. Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model
    Emile C. A. Nyns; Tianyi Jin; Magda S Fontes; Titus van den Heuvel; Vincent Portero; Catilin Ramsey; Cindy I. Bart; Katja Zeppenfeld; Martin J. Schalij; Thomas J. van Brakel; Arti A. Ramkisoensing; GuoQi Zhang; René H. Poelma; Balazs Ördög; Antoine A. F. de Vries; Daniël A. Pijnappels;
    Cardiovascular Research,
    September 2021. DOI: 10.1093/cvr/cvab294

62. Enhanced Sensitivity Pt/AlGaN/GaN Heterostructure NO₂ Sensor Using a Two-Step Gate Recess Technique
    Jianwen Sun; Teng Zhan; Robert Sokolovskij; Zewen Liu; Pasqualina M. Sarro; Guoqi Zhang;
    IEEE Sensors Journal,
    Volume 21, Issue 15, pp. 16475-16483, 2021. DOI: 10.1109/JSEN.2021.3082205

63. Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network
    Qian, Yichen; Hou, Fengze; Fan, Jiajie; Lv, Quanya; Fan, Xuejun; Zhang, Guoqi;
    IEEE Transactions on Electron Devices,
    Volume 68, Issue 7, pp. 3460-3467, 2021. DOI: 10.1109/TED.2021.3077209

64. Room temperature ppt-level NO2 gas sensor based on SnOx/SnS nanostructures with rich oxygen vacancies
    Hongyu Tang; Chenshan Gao; Huiru Yang; Leandro Nicolas Sacco; Robert Sokolovskij; Hongze Zheng; Huaiyu Ye; Sten Vollebregt; Hongyu Yu; Xuejun Fan; Guoqi Zhang;
    2D Materials,
    2021. DOI: 10.1088/2053-1583/ac13c1

65. System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K.C. Yung; Zhou Jing; Xuejun Fan; Willem van Driel; Guoqi Zhang;
    Measurement,
    Volume 176, pp. 109191, 2021. DOI: 10.1016/j.measurement.2021.109191
    document

66. Low Leakage and High Forward Current Density Quasi-Vertical GaN Schottky Barrier Diode With Post-Mesa Nitridation
    X. Kang; Y. Sun; Y. Zheng; K. Wei; H. Wu; Y. Zhao; Xu Liu; GuoQi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 68, Issue 3, pp. 1369-1373, 2021. DOI: 10.1109/TED.2021.3050739

67. Investigating the Electrochemical Performance of Smart Self-Powered Bionic Skin Fragment Based on Bioelectricity Generation
    Dai, H.; Chen, Y.; Dai, W.; Hu, Z.; Xie, F.; Xu, W.; Cui, Z.; Wei, X.; Chen, Z.; Yang, B.; Zhang, W.; Wei, W.; Guo, R.; Zhang, GuoQi;
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68. Facile Synthesis of Ag Nanowire/TiO2 and Ag Nanowire/TiO2/GO Nanocomposites for Photocatalytic Degradation of Rhodamine B
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69. Correction: The inactivation mechanism of chemical disinfection against SARS-CoV-2: from MD and DFT perspectives
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70. Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
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71. Resistive and PTAT Temperature Sensors in a Silicon Carbide CMOS Technology
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72. Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model
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73. High step coverage interconnects by printed nanoparticles
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74. Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
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75. Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
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76. Review of Packaging Schemes for Power Module
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77. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
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78. Towards Multi-Functional SiO2@YAG:Ce Core–Shell Optical Nanoparticles for Solid State Lighting Applications
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79. Maintaining Transparency of a Heated MEMS Membrane for Enabling Long-Term Optical Measurements on Soot-Containing Exhaust Gas
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80. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
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81. Infrared absorbance of vertically-aligned multi-walled CNT forest as a function of synthesis temperature and time
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82. Toward a Self-Sensing Piezoresistive Pressure Sensor for all-SiC Monolithic Integration
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83. Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated
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84. The Impact of Gate Recess on the H2 Detection Properties of Pt-AlGaN/GaN HEMT Sensors
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85. Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
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86. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
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87. Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives
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88. A high responsivity and controllable recovery ultraviolet detector based on a WO3 gate AlGaN/GaN heterostructure with an integrated micro-heater
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89. An effective optics-electrochemistry approach to random packing density of non-equiaxed ellipsoids
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90. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model
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91. Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints
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92. Blue light therapy to treat candida vaginitis with comparisons of three wavelengths: An in vitro study
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93. Effective Approaches of Improving the Performance of Chalcogenide Solid Electrolytes for All-Solid-State Sodium-Ion Batteries
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94. Entropy generation methodology for defect analysis of electronic and mechanical components-A review
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95. Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging
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96. Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes
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97. Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode
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98. Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network
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99. Optimization of Mesa Etch for a Quasi-Vertical GaN Schottky Barrier Diode (SBD) by Inductively Coupled Plasma (ICP) and Device Characteristics
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100. The inactivation mechanism of chemical disinfection against SARS-CoV-2: from MD and DFT perspectives
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101. P-type β-Ga2O3 metal-semiconductor-metal solar-blind photodetectors with extremely high responsivity and gain-bandwidth product
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102. Recent Advances in the Critical Heat Flux Amelioration of Pool Boiling Surfaces Using Metal Oxide Nanoparticle Deposition
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103. Ultraviolet Sensing in WBG: SiC
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104. From Si Towards SiC Technology for Harsh Environment Sensing
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105. Research On FOPLP Package of multi-chip Power Module
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106. FET-based charge sensor for organs-on-chip with in-situ electrode decoration
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107. Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration
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108. A DFT Model Study about Structure Sensitivity for Benzotriazole Adsorption on Copper Surfaces and Nano Cluster
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109. 3D-impaction printing of porous layers
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110. Implementation of General Coupling Model of Electromigration in ANSYS
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111. Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors
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112. Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties
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113. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
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114. A Reliability Prediction Methodology for LED Arrays
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115. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
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116. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
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117. Characterization of an Acetone Detector based on a Suspended WO3-Gate AlGaN/GaN HEMT Integrated with Micro-heater
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118. First principles study of gas molecules adsorption on monolayered β-SnSe
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119. Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs
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120. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer
     Venkatesh, M.R.; Sachdeva, S.; El Mansouri, B.; Wei, J.; Bossche, A.; Bosma, D.; de Smet; L. C. P. M.; Sudhölter, E. J. R.; GuoQi Zhang;
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121. High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
     Brahim El Mansouri; Luke M. Middelburg; Rene H. Poelma; GuoQi Zhang; Henk W. van Zeijl; Jia Wei; Hui Jiang; Johan G. Vogel; Willem D. van Driel;
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122. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer
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123. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process
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124. Degradation of optical materials in solid-state lighting systems
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125. First-principles investigation of the adsorption behaviors of CH 2 O on BN, AlN, GaN, InN, BP, and P monolayers
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126. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages
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127. SnSe monolayer: A promising candidate of SO 2 sensor with high adsorption quantity
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128. High moisture accelerated mechanical behavior degradation of phosphor/silicone composites used in white light-emitting diodes
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129. Terahertz radiation enhancement in dipole photoconductive antenna on LT-GaAs using a gold plasmonic nanodisk array
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130. Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method
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131. Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance
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132. Continuous shock-free termination of atrial fibrillation by local optogenetic therapy and arrhythmia-triggered activation of an implanted light source
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133. Impact of high temperature H2 pre-treatment on Pt-AlGaN/GaN HEMT sensor for H2S detection
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134. An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation
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135. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu− Ag Nanoflakes for Electrically Conductive Pastes
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136. Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
     Hongyu Tang; Yutao Li; Robert Sokolovskij; Leandro Sacco; Hongze Zheng; Huaiyu Ye; Hongyu Yu; Xuejun Fan; He Tian; Tian-Ling Ren; GuoQi Zhang;
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137. 循环电载荷下大功率LED金引线疲劳断裂寿命预测
     Fan, J.; Li, L.; Qian, C.; Hu, A.; Fan, X.; GuoQi Zhang;
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138. Characterization of PCB Embedded Package Materials for SiC MOSFETs
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139. Suspended tungsten trioxide (WO3) gate AlGaN/GaN heterostructure deep ultraviolet detectors with integrated micro-heater
     Jianwen Sun; Teng Zhan; Zewen Liu; Junxi Wang; Xiaoyan Yi; Lina Sarro; GuoQi Zhang;
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140. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response
     Chenshan Gao; Yingying Zhang; Huiru Yang; Yang Liu; Yufei Liu; Jihe Dua; Huaiyu Ye; GuoQi Zhang;
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141. Suspended AlGaN/GaN HEMT NO2 Gas Sensor Integrated with Micro-heater
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142. Stress analysis of pressure-assisted sintering for the double-side assembly of power module
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143. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
     Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
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144. High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring
     Hongyu Tang; Yutao Li; Huaiyu Ye; Fafei Hu; Chenshan Gao; Luqi Tao; Tao Tu; Guangyang Gou; Xianping Chen; Xuejun Fan; Tianling Ren; GuoQi Zhang;
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145. General coupling model for electromigration and one-dimensional numerical solutions
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146. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
     Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
     In 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE,
     2019. DOI: 10.1109/TRANSDUCERS.2019.8808192

147. Degradation Prediction of Electronic Packages using Machine Learning
     Prisacaru, A.; Guerrero, E. O.; Gromala, P. J.; Han, B.; GuoQi Zhang;
     In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019,
     2019. DOI: 10.1109/EuroSimE.2019.8724523

148. Compressive response of pristine and superconductor coated MWCNT pillars
     A. M. Gheytaghi; S. Vollebregt; R.H. Poelma; H. W. Zeijl; GuoQi Zhang;
     In IEEE MEMS,
     2019.

149. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability
     Wang, S.; Tan, C.; Wang, L.; Luo, H.; GuoQi Zhang; Chen, X.;
     In Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE,
     2019. DOI: 10.1109/EDTM.2019.8731110

150. A SPICE-based transient thermal-electronic model for LEDs
     Bo Sun; Fan, J.; Fan, X.; GuoQi Zhang;
     In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE,
     2019. DOI: 10.1109/EuroSimE.2019.8724555

151. Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions
     Mehr, M. Y.; Van Driel, W.; GuoQi Zhang;
     In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019,
     2019. DOI: 10.1109/EuroSimE.2019.8724524

152. Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap
     Zhang, Y.; Tao, L.; Li, X.; GuoQi Zhang; Chen, X.;
     In Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE,
     IEEE, 2019. DOI: 10.1109/EDTM.2019.8731255

153. Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process
     Jing, Z.; Ibrahim, M. S.; Fan, J.; Fan, X.; GuoQi Zhang;
     In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE,
     2019. DOI: 10.1109/EuroSimE.2019.8724571

154. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances
     Zuopeng Qu; Hongyu Tang; Huaiyu Ye; Xuejun Fan; GuoQi Zhang;
     In EurosimE,
     IEEE, IEEE, 2019. DOI: 10.1109/EuroSimE.2019.8724549

155. A review on discoloration and high accelerated testing of optical materials in LED based-products
     M. Yazdan Mehr; M.R. Toroghinejad; F. Karimzadeh; W.D. van Driel; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 81, pp. 136-142, 2018.

156. Thermal Management on IGBT Power Electronic Devices and Modules
     Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; GuoQi Zhang;
     IEEE Access,
     Volume 6, pp. 12868-12884, 2018.

157. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
     Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 84, pp. 140-148, 2018.

158. Tomorrow’s advanced packaging; for electronics and heterogeneous system integration
     H. Yi; A. M. Gheytaghi; B. El Mansouri; L.M. Middelburg; GuoQi Zhang;
     ETV Maxwell,
     Volume 21.2, 2018.

159. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation
     Amir Mirza Gheytaghi; Hamid Saffari; GuoQi Zhang;
     Heat Transfer Engineering,
     2018.

160. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating
     Liangbiao Chen; Jiang Zhou; Hsing-Wei Chu; GuoQi Zhang; Xuejun Fan;
     Applied Mechanics Reviews,
     Volume 70, Issue 2, pp. 020803-1-16, 2018.

161. A new hermetic sealing method for ceramic package using nanosilver sintering technology
     Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 81, pp. 143-149, 2018.

162. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
     Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
     IEEE Transactions on Device and Materials Reliability,
     Volume 18, Issue 2, pp. 240-246, 2018.

163. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
     Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
     IEEE Transactions on Components, Packaging and Manufacturing Technology,
     Volume 8, Issue 7, pp. 1254-1262, 2018.

164. Germanene on single layer ZnSe substrate: Novel electronic and optical properties
     H. Y. Ye; F. F. Hu; Hongyu Tang; L. W. Yang; X. P. Chen; L. G. Wang; GuoQi Zhang;
     Physical Chemistry Chemical Physics,
     Volume 20, Issue 23, pp. 16067-16076, 2018.

165. A stochastic process based reliability prediction method for LED driver
     Bo Sun; Xuejun Fan; Willem van Driel; Chengqiang Cui; GuoQi Zhang;
     Reliability Engineering and System Safety,
     Volume 178, pp. 140-146, 2018.

166. High Selective Gas Detection for small molecules based on Germanium selenide monolayer
     Liu, L.; Yang, Q.; Wang, Z.; Ye, H.; Chen, X.; Fan, X.; GuoQi Zhang;
     Applied Surface Science,
     pp. 575-581, 2018. DOI: 10.1016/j.apsusc.2017.10.084

167. Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor
     Sokolovskij, R.; Zhang, J.; Iervolino, E.; Zhao, C.; Santagata, F.; Wang, F.; Yu, H.; Sarro, P. M.; GuoQi Zhang;
     Sensors and Actuators B: Chemical,
     2018. DOI: 10.1016/j.snb.2018.08.015

168. In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor
     Prisacaru, A.; Palczynska, A.; Theissler, A.; Gromala, P.; Han, B.; GuoQi Zhang;
     IEEE Transactions on Components, Packaging and Manufacturing Technology,
     Volume 750-763, 2018. DOI: 10.1109/TCPMT.2018.2816259

169. Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende gaN crystals
     Qin, H.; Kuang, T.; Luan, X.; Li, W.; Xiao, J.; Zhang, P.; Yang, D.; GuoQi Zhang;
     Crystals,
     2018. DOI: 10.3390/cryst8110428

170. The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene
     Yang, N.; Yang, D.; GuoQi Zhang; Chen, L.; Liu, D.; Cai, M.; Fan, X.;
     Sensors,
     2018. DOI: 10.3390/s18020422

171. Study on the Degradation of Optical Silicone Exposed to Harsh Environments
     Yazdan Mehr, M.; van Driel, W.; De Buyl, F.; GuoQi Zhang;
     Materials,
     2018. DOI: 10.3390/ma11081305

172. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates
     Li, S.; Yang Liu; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
     Results in Physics,
     2018. DOI: 10.1016/j.rinp.2018.10.005

173. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
     Yang Liu; Li, S.; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
     Journal of Materials Science: Materials in Electronics,
     pp. 13167-13175, 2018. DOI: 10.1007/s10854-018-9440-2

174. Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study
     Yang, H.; Wang, Z.; Ye, H.; Zhang, K.; Chen, X.; GuoQi Zhang;
     Applied Surface Science,
     pp. 554-561, 2018. DOI: 10.1016/j.apsusc.2018.08.014

175. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting
     Yuan Gao; Jianfei Dong; Olindo Isabella; Rudi Santbergen; Hairen Tan; Miro Zeman; GuoQi Zhang;
     Applied Energy,
     Volume 228, pp. 1454-1472, 2018.

176. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
     Cinzia Silvestri; Michele Riccio; René H. Poelma; Aleksandar Jovic; Bruno Morana; Sten Vollebregt; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
     Small,
     Volume 14, Issue 20, pp. 1800614, 2018. DOI: 10.1002/smll.201800614

177. Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers
     Bo Sun; Fan, X.; van Driel, W. D. (ed.); GuoQi Zhang;
     Springer, , 2018. DOI: 10.1007/978-3-319-58175-0_16

178. LED-Based Luminaire Color Shift Acceleration and Prediction
     Lu, G.; van Driel, W. D. (ed.); Fan, X.; Fan, J.; GuoQi Zhang;
     Springer, , pp. 201-219, 2018. DOI: 10.1007/978-3-319-58175-0_9

179. Reliability and Lifetime Assessment of Optical Materials in LED-Based Products
     Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
     In Solid State Lighting Reliability Part 2,
     Springer, 2018.

180. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology
     Fengze Hou; Xueping Guo; Qidong Wang; Wenbo Wang; Tingyu Lin; Liqiang Cao; GuoQi Zhang; J.A. Ferreira;
     In Proc. IEEE Electronic Components and Technol. Conf. (ECTC),
     pp. 1365- 1370, 2018.

181. Designing a 100 [aF/nm] capacitive transducer
     L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; GuoQi Zhang; W. D. van Driel;
     In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
     2018.

182. Modeling of two-dimensional hyperbolic heat conduction in silicon-on-insulator transistor by equivalent RLC network
     Amir Mirza Gheytaghi; Huaiyu Ye; GuoQi Zhang;
     In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     2018.

183. Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
     Z. Huang; R.H. Poelma; S. Vollebregt; M.H. Koelink; E. Boschman; R. Kropf; M. Gallouch; GuoQi Zhang;
     In IEEE Electronics System-Integration Technology Conference (ESTC),
     pp. 1-5, 2018.

184. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
     Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
     In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
     2018.

185. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
     Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
     In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
     2018.

186. SiC MOSFET Threshold-Voltage Instability under High Temperature Aging
     Liu, Y.; Chen, X.; Zhao, Z.; Li, Z.; Lu, C.; Zhang, J.; Ye, H.; Koh, S. W.; Wang, L.; GuoQi Zhang;
     In Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
     2018. DOI: 10.1109/ICEPT.2018.8480781

187. The performance of sintered nanocopper interconnections for high temperature device
     Liu, Q.; Chen, X.; Zhu, J.; Zhang, H.; Zhang, J. S.; Zhang, J. G.; Wang, L.; Ye, H.; Koh, S. W.; GuoQi Zhang;
     In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
     IEEE, 2018. DOI: 10.1109/ICEPT.2018.8480591

188. Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
     Middelburg, L. M.; Mansouri, B. E.; Poelma, R.; GuoQi Zhang; Van Zeijl, H.; Wei, J.;
     In Proc. IEEE Sensors,
     2018. DOI: 10.1109/ICSENS.2018.8589630

189. Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs
     Wang, Z.; Fan, J.; Liu, J.; Hu, A.; Qian, C.; Fan, X.; GuoQi Zhang;
     In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
     IEEE, pp. 525-530, 2018. DOI: 10.1109/ICEPT.2018.8480566

190. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
     Zhen Cui; Yingying Zhang; Qun Yang; GuoQi Zhang; Xianping Chen;
     In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
     2018. DOI: 10.1109/EDTM.2018.8421434

191. Shining light on cardiac tachyarrhythmias
     Nyns E CA; Bingen B O; Bart C I; Kip A; Poelma R H; Volkers L; Plomp J J; Jangsangthong W; Engels M C; Schalij M J; GuoQi Zhang; de Vries A AF; Pijnappels D A;
     In Changing the Face of Modern Medicine: Stem Cell and Gene Therapy,
     2018. DOI: 10.1089/hum.2018.29077.abstracts

192. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor
     Prisacaru, A.; Sun, Y.; Gromala, P. J.; Han, B.; GuoQi Zhang;
     In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE,
     IEEE, pp. 1-3, 2018. DOI: 10.1109/EuroSimE.2018.8369955

193. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation
     Fan, J.; Hu, A.; Pecht, M.; Chen, W.; Fan, X.; Xu, D.; GuoQi Zhang;
     In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
     IEEE, pp. pp. 1642-1648, 2018. DOI: 10.1109/ICEPT.2018.8480748

194. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
     Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
     Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.

195. First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer
     HC Luo; RS Meng; H Gao; X Sun; J Xiao; HY Ye; GuoQi Zhang; XP Chen;
     IEEE Electron Device Letters,
     Volume 38, Issue 8, pp. 1139-1142, 2017.

196. Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors
     Maryam Yazdan Mehr; S. Vollebregt; W. D. van Driel; GuoQi Zhang;
     Journal of Electronic Materials,
     Volume 46, Issue 10, pp. 5866--5872, 2017. DOI: 10.1007/s11664-017-5592-8
     
     Keywords: ...

     graphene, Light-emitting diode, reliability, remote phosphor.

197. Color shift acceleration on mid-power LED packages
     Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
     
     Keywords: ...

     Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

198. Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
     Yazdan Mehr, M.; M.R. Toroghinejad; F. Karimzadeh; van Driel, W.D.; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 78, pp. 143--147, 2017. DOI: 10.1016/j.microrel.2017.08.014
     
     Keywords: ...

     BPA-PC, LED-based products, Optics, Oxidation, Yellowing.

199. Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes
     Y Liu; H Fu; H Zhang; F Sun; X Wang; GuoQi Zhang;
     Journal of Materials Science: Materials in Electronics,
     Volume 28, Issue 24, pp. 19113-19120, 2017.

200. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
     Hongyu Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 78, pp. 197-204, 2017.

201. Phosphor–silicone interaction effects in high power white light emitting diode packages
     J Fan; M Zhang; X Luo; C Qian; X Fan; A Ji; GuoQi Zhang;
     Journal of Materials Science: Materials in Electronics,
     Volume 28, Issue 23, pp. 17557-17569, 2017.

202. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
     C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; GuoQi Zhang;
     Materials,
     Volume 10, Issue 10, pp. 1181, 2017.

203. Modeling nonlinear moisture diffusion in inhomogeneous media
     L Chen; J Zhou; H Chu; GuoQi Zhang; X Fan;
     Microelectronics Reliability,
     Volume 75, pp. 162-170, 2017.

204. Humidity sensor based on the ionic polymer metal composite
     E Esmaeli; M Ganjian; H Rastegar; M Kolahdouz; Z Kolahdouz; GuoQi Zhang;
     Sensors and Actuators B: Chemical,
     Volume 247, pp. 498-504, 2017.

205. Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process
     Zahra Kolahdouz; T Ma; H Abdy; M Kolahdouz; H van Zeijl; GuoQi Zhang;
     Sensors and Actuators A: Physical,
     Volume 263, pp. 622-632, 2017.

206. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
     Sumit Sachdeva; Manjunath R. Venkatesh; Brahim El Mansouri; Jia Wei; Andre Bossche; Freek Kapteijn; GuoQi Zhang; Jorge Gascon; Louis C. P. M. de Smet; Ernst J. R. Sudhölter;
     Small,
     Volume 13, Issue 29, pp. 1604150, 2017.

207. Hybrid plasmonics slot THz waveguide for subwavelength field confinement and crosstalk between two waveguides
     J Xiao; QQ Wei; DG Yang; P Zhang; N He; GuoQi Zhang; XP Chen;
     IEEE Journal of Selected Topics in Quantum Electronics,
     Volume 23, Issue 4, 2017.

208. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
     Fengze Hou; T Lin; L Cao; F Liu; J Li; X Fan; GuoQi Zhang;
     IEEE Transactions on Components, Packaging and Manufacturing Technology,
     Volume 7, Issue 10, pp. 1721-1728, 2017.

209. Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study
     FF Hu; Hongyu Tang; CJ Tan; HY Ye; XP Chen; GuoQi Zhang;
     IEEE Electron Device Letters,
     Volume 38, Issue 7, pp. 983-986, 2017.

210. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
     J Fan; C Yu; C Qian; X Fan; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 74, pp. 179-185, 2017.

211. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
     Bo Sun; X Fan; L Li; H Ye; W van Driel; GuoQi Zhang;
     IEEE Transactions on Components and Packaging and Manufacturing Technology,
     Volume 7, Issue 7, pp. 1081-1088, 2017.

212. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
     C Qian; Y Li; J Fan; X Fan; J Fu; L Zhao; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 74, pp. 173-178, 2017.

213. Integrated virtual impactor enabled PM 2.5 sensor
     Mingzhi Dong; E Iervolino; F Santagata; G Zhang; GuoQi Zhang;
     IEEE Sensors Journal,
     Volume 17, Issue 9, pp. 2814-2821, 2017.

214. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
     Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; GuoQi Zhang;
     Reliability Engineering & System Safety,
     Volume 163, pp. 14-21, 2017.

215. Sulfur Dioxide and Nitrogen Dioxide Gas Sensor Based on Arsenene: A First-Principle Study
     XP Chen; LM Wang; X Sun; RS Meng; J Xiao; HY Ye; GuoQi Zhang;
     IEEE Electron Device Letters,
     Volume 38, Issue 5, pp. 661-664, 2017.

216. Color shift modeling of light-emitting diode lamps in step-loaded stress testing
     M Cai; D Yang; J Huang; M Zhang; X Chen; C Liang; S Koh; GuoQi Zhang;
     IEEE Photonics Journal,
     Volume 9, Issue 1, pp. 1-14, 2017.

217. Monolithically integrated light feedback control circuit for blue/UV LED smart package
     Zahra K Esfahani; M Tohidian; H van Zeijl; M Kolahdouz; GuoQi Zhang;
     IEEE Photonics Journal,
     Volume 9, Issue 2, pp. 1-13, 2017.

218. Identification and robust control of the nonlinear photoelectrothermal dynamics of LED systems
     J Dong; GuoQi Zhang;
     IEEE Transactions on Industrial Electronics,
     Volume 64, Issue 3, pp. 2215-2225, 2017.

219. Prediction of lumen depreciation and color shift for phosphor-converted white light-emitting diodes based on a spectral power distribution analysis method
     C Qian; J Fan; X Fan; GuoQi Zhang;
     IEEE Access,
     Volume 5, pp. 24054-24061, 2017.

220. Color shift failure prediction for phosphor-converted white LEDs by modeling features of spectral power distribution with a nonlinear filter approach
     J Fan; MG Mohamed; C Qian; X Fan; GuoQi Zhang; M Pecht;
     Materials 10,
     Volume 7, pp. 819, 2017.

221. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
     Hongy Tang; HY Ye; XP Chen; C Qian; XJ Fan; GuoQi Zhang;
     IEEE Access,
     Volume 5, Issue 5, pp. 16459-16468, 2017.

222. High aspect ratio spiral resonators for process variation investigation and MEMS applications
     L. Middelburg; B. El Mansouri; H. van Zeijl; GuoQi Zhang; R. H. Poelma;
     In Proc. IEEE Sensors,
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223. An AlAs/germanene heterostructure with outstanding tunability of electronic properties
     C Tan; Q Yang; H Ye; X Chen; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

224. Smart Systems Integration in the era of Solid State Lighting
     GuoQi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M.R. Venkatesh; L. Middelburg; B. El Mansouri;
     In Smart System Integration conference (SSI),
     2017.

225. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity
     Cinzia Silvestri; Federico Marciano; Bruno Morana; Violeta Podranovic; Sten Vollebregt; GuoQi Zhang; Pasqualina M Sarro;
     In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
     pp. 266-269, 2017.

226. Optimization of reflow soldering process for white LED chip-scale-packages on substrate
     C Jiang; W Guo; J Fan; C Qian; X Fan; GuoQi Zhang;
     In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
     2017.

227. Luminous flux modeling for high power LED automotive headlamp module
     C Yu; J Fan; C Qian; X Fan; GuoQi Zhang;
     In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
     2017.

228. Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units
     A Prisacaru; A Palczynska; PJ Gromala; B Han; GuoQi Zhang;
     In Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,
     2017.

229. Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
     R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; GuoQi Zhang;
     In Proceedings of Eurosensors,
     pp. 463, 2017.

230. A PoF and statistics combined reliability prediction for LED arrays in lamps
     B Sun; X Fan; J Fan; C Qian; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

231. Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
     Y Zhang; K Zheng; X Chen; GuoQi Zhang; C Tan; Q Yang; J Jiang; H Ye;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

232. SnS monolayer as gas sensors: Insights from a first-principles investigation
     F Hu; C Tan; H Ye; X Chen; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

233. In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
     I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; GuoQi Zhang; X Fan;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

234. Adsorption of gases on monolayer GeSe: A first principle study
     L Liu; Q Yang; H Ye; X Chen; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

235. First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
     K Zheng; H Ye; GuoQi Zhang; Y Zhang; L Liu; J Jiang; Q Yang; C Tan; X Chen;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

236. The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
     Q Yang; C Tan; H Ye; X Chen; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

237. Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
     J Fan; C Xie; C Qian; X Fan; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

238. Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
     C Qian; LL Luo; JJ Fan; XQ Li; XJ Fan; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

239. Prognostics and health monitoring of electronic system: A review
     A Prisacaru; PJ Gromala; MB Jeronimo; B Han; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

240. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
     Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; GuoQi Zhang;
     In EurosimE,
     2017.

241. An accelerated test method of luminous flux depreciation for LED luminaires and lamps
     C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; GuoQi Zhang;
     Reliability Engineering and System Safety,
     Volume 147, pp. 84-92, 2016.

242. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
     Bo Sun; Xuejun Fan; Cheng Qian; GuoQi Zhang;
     IEEE Transactions on Industrial Electronics,
     pp. 99, 2016.

243. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
     Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; GuoQi Zhang;
     IEEE Electron Device Letters,
     Volume 37, Issue 4, 2016.

244. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
     Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
     IEEE Transactions on Electron Devices,
     Volume 63, pp. 2807-2814, 2016.

245. Output blue light evaluation for phosphor based smart white LED wafer level packages
     Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; GuoQi Zhang;
     Optics Express,
     Volume 24, Issue 4, pp. 174-177, 2016.

246. Silicon microfabrication based particulate matter sensor
     Mingzhi Dong; Elina Iervolino; Fabio Santagata; GuoQi Zhang;
     Sensors and Actuators A: Physical,
     Volume 247, pp. 115-124, 2016.

247. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
     A. M. Gheytaghi; S.H. Tabatabaie; H. Saffari; GuoQi Zhang;
     Micro and Nano Letters,
     Volume 11, Issue 8, pp. 412, 2016.

248. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
     Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
     Nanoscale,
     Volume 8, pp. 8266-8275, 2016.
     document

249. Stretchable Binary Fresnel Lens for Focus Tuning
     Xueming Li; Lei Wei; Ren� H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; GuoQi Zhang;
     Scientific Reports,
     Volume 6, pp. 25348, 2016.

250. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
     R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; GuoQi Zhang;
     Advanced Functional Materials,
     Volume 26, Issue 8, pp. 1233-1242, 2016.

251. A review of small heat pipes for electronics
     Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; GuoQi Zhang;
     Applied Thermal Engineering,
     Volume 96, pp. 1-17, 2016.

252. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
     Bo Sun; Xuejun Fan; van Driel, Willem; GuoQi Zhang;
     United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387
     
     Keywords: ...

     Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.

253. Lumen Decay Prediction in LED Lamps
     Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; GuoQi Zhang;
     United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391
     
     Keywords: ...

     Reliability, LED Lamp, Lumen Decay Prediction.

254. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
     Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
     In 13th China International Forum on Solid State Lighting (SSLChina),
     2016.
     document

255. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
     Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; GuoQi Zhang;
     In IEEE 66th Electronic Components and Technology Conference (ECTC),
     2016.
     document

256. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
     Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; GuoQi Zhang;
     In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
     2016.
     document

257. 3D interconnect technology based on low temperature copper nanoparticle sintering
     Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
     In 17th International Conference on Electronic Packaging Technology (ICEPT),
     2016.
     document

258. Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
     R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; GuoQi Zhang;
     In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
     pp. 1094-1097, 2016.

259. Solving the Nonlinear Heat Conduction in a Spherical Coordinate with Electrical Simulation
     A. M. Gheitaghy; H. Saffari; GuoQi Zhang;
     In 18th International Conference on Thermal Engineering,
     2016.

260. Thermal analysis and optimization of IGBT power electronic module based on layout model
     Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; GuoQi Zhang;
     In ICEPT,
     2016.

261. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
     R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; GuoQi Zhang;
     Journal of Micromechanics and Microengineering,
     Volume 25, Issue 5, pp. 055017, 2015.

262. Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints
     H. Wu; J. Dong; G. Qi; GuoQi Zhang;
     Journal of the Optical Society of America A,
     Volume 32, Issue 7, pp. 1262-1270, 2015.

263. Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
     Chuen Yung; Xuejun Fan; GuoQi Zhang; Michael Pecht;
     IEEE Transactions on Device and Materials Reliability,
     Volume 15, Issue 4, pp. 576-587, 2015.

264. Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
     Xian-Ping Chen; Ning Yang; Jun-Ke Jiang; Qiu-Hua Liang; Dao-Guo Yang; GuoQi Zhang;
     IEEE Electron Device Letters,
     Volume 36, Issue 6, 2015.

265. Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
     Jianlin Huang, D. S. Golubovic, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
     IEEE Transactions on Device and Materials Reliability,
     Volume 15, Issue 4, pp. 478-485, 2015.

266. Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
     F. Karegar; M. Kolahdouz; F. D. Nayeri; R. Soleimanzadeh; M. Hosseini; Z Kolahdouz; GuoQi Zhang;
     IEEE Photonics Technology Letters,
     Volume 27, Issue 13, pp. 1430-1433, 2015.

267. Degradation modeling of mid-power white-light LEDs by using Wiener process
     Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
     Optics Express,
     Volume 23, pp. A966-A978, 2015.

268. Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
     R. Soleimanzadeh; M. S. S. Mousavi; A. Mehrfar; Z. Kolahdouz; M. Kolahdouz; GuoQi Zhang;
     Journal of Crystal Growth,
     Volume 426, pp. 228-233, 2015.

269. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
     Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 55, Issue 2654-2662, 2015.

270. Highly selective and responsive ultra-violet detection using an improved phototransistor
     R. Soleimanzadeh; M. Kolahdouz; M. A. Charsooghi; Z. Kolahdouz; GuoQi Zhang;
     Applied Physics Letters,
     Volume 106, Issue 23, pp. 231102, 2015.

271. Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
     Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
     IEEE Transactions on Device and Materials Reliability,
     Volume 15, Issue 2, pp. 220-228, 2015.

272. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
     Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
     Optical Materials,
     Volume 49, pp. 79-84, 2015.

273. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
     Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
     Optical Materials,
     Volume 45, pp. 37-41, 2015.

274. 3D system-in-package design using stacked silicon submount technology
     Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
     Microelectronics International,
     Volume 32, Issue 2, pp. 63-72, 2015.

275. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
     R. H. Poelma; GuoQi Zhang;
     In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
     Springer, 2015.

276. Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
     Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; GuoQi Zhang;
     In Transducers,
     pp. 2041-2044, 2015.

277. Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
     X. J. Fan; R. H. Poelma; L. Chen; GuoQi Zhang;
     In ASME International Mechanical Engineering Congress and Exposition,
     2015.

278. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
     Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 6-7, pp. 1338-1343, 2014.

279. Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
     Maryam Yazdan Mehr; W. D. van Driel; H. Udono; GuoQi Zhang;
     Optical Materials,
     Volume 37, pp. 155-159, 2014.

280. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
     Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
     Applied Thermal Engineering,
     Volume 63, Issue 2, pp. 588-597, 2014.

281. Thermal and mechanical effects of voids within flip chip soldering in LED packages
     Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; GuoQi Zhang; Fenglian Sun; Liangliang Luo;
     Microelectronics Reliability,
     Volume 54, Issue 9-10, pp. 2028-2033, 2014.

282. Reliability and optical properties of LED lens plates under high temperature stress
     Maryam Yazdan Mehr; van Driel, WD; Koh, SW; GuoQi Zhang;
     Microelectronics Reliability,
     2014.

283. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
     Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
     Advanced Functional Materials,
     Volume 24, Issue 36, pp. 5737-5744, 2014.
     document

284. Accelerated life time testing and optical degradation of remote phosphor plates
     Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 8, pp. 1544-1548, 2014.

285. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
     Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 6-7, pp. 1355-1362, 2014.

286. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
     Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 1, pp. 138-142, 2014.

287. Multi-physics reliability simulation for solid state lighting drivers
     Tarashioon, S; van Driel, WD; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 6-7, pp. 1212-1222, 2014.

288. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
     Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; GuoQi Zhang;
     Journal of Materials Science: Materials in Electronics,
     Volume 25, Issue 11, pp. 4954-4959, 2014.

289. Fracture toughness of Cu-EMC interfaces in pressurized steam
     Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; GuoQi Zhang;
     International Journal of Adhesion and Adhesives,
     Volume 49, pp. 73-79, 2014.

290. Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
     Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; GuoQi Zhang;
     In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
     Springer, 2014.

291. Reliability of LED-based Products is a Matter of Balancing Temperatures
     Maryam Yazdan Mehr; W.D. van Driel; GuoQi Zhang;
     In Therminic Conference,
     2014.

292. Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
     H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; GuoQi Zhang;
     In nanoFIS 2014 - Functional Integrated nanoSystems,,
     2014.

293. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
     Guangjun Lu; Yuan, C; Fan, X; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-3, 2014.

294. A novel design of heatsink-less LED base fluorescent lamp retrofit
     Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; GuoQi Zhang;
     In ICEPT2014,
     2014.

295. Numerical modeling of flexible actuator for dynamic lighting
     Teng Ma; Xueming Li; Jia Wei; GuoQi Zhang; P. M. Sarro;
     In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,
     2014.

296. High Accelerated Optical Remote Phosphor Aging Studies for LED Luminaire Applications
     W. D. v. Driel; Maryam Yazdan Mehr; GuoQi Zhang;
     In 11th China SSL conference,
     2014.

297. Blue Selective Photodiodes for Optical Feedback in LED Wafer Level Packages
     Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. V. Zeijl; GuoQi Zhang;
     In Solid-State Device Research Conference (ESSDERC), 2014 Proceedings of the European,
     pp. 174-177, 2014.

298. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
     C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; GuoQi Zhang; P.M. Sarro;
     In IEEE Sensors,
     pp. 827-830, 2014.
     document

299. Miniaturized particulate matter sensor for portable air quality monitoring devices
     Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; GuoQi Zhang;
     In IEEE Sensors,
     pp. 2151-2154, 2014.

300. Colour shift in remote phosphor based LED products
     Maryam Yazdan Mehr; Driel, WD van; GuoQi Zhang;
     In Proceedings - 64th Electronic Components and Technology Conference,
     pp. 1477-1481, 2014.

301. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
     Hongyu Tang; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; GuoQi Zhang;
     In Proceedings of the 15th International Conference on Electronic Packaging Technology,
     pp. 1198-1201, 2014.

302. Investigation of lumen degradation mechanisms of mid-power LED by HAST
     Jianlin Huang; Koh, SW; Xueming Li; GuoQi Zhang;
     In Proceedings of the 15th International Conference on Electronic Packaging Technology,
     pp. 1437-1441, 2014.

303. Reliability and accelerated test methods for plastic materials in LED-based products
     Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-5, 2014.

304. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
     Venkatesh, MR; Liu, P; van Zeijl, HW; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-6, 2014.

305. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
     Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-4, 2014.

306. Thermal performance of embedded heat pipe in high power density LED streetlight module
     Hongyu Tang; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-6, 2014.

307. High aspect ratio lithography for litho-defined wire bonding
     Esfahani, ZK; van Zeijl, HW; GuoQi Zhang;
     In Proceedings - 64th Electronic Components and Technology Conference,
     pp. 1556-1561, 2014.

308. CNT bundles growth on microhotplates for direct measurement of their thermal properties
     C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; GuoQi Zhang; P.M. Sarro;
     In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
     San Francisco, USA, Jan. 2014.
     document

309. Investigation of color shift of LEDs-based lighting products
     Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-5, 2014.

310. Novel system-in-package design and packaging solution for solid state lighting systems
     Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
     In Proceedings - 64th Electronic Components and Technology Conference,
     pp. 1192-1197, 2014.

311. Adapting LED lighting to compensate the influence of ambient light on the light color
     J.D.H. Wu; GuoQi Zhang;
     In 11th China SSL conference,
     2014.

312. Through-polymer via (TPV) and method to manufacture such a via
     H.W. van Zeijl; R.H. Poelma; GuoQi Zhang;
     Dutch patent, 2014.

313. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
     Maryam Yazdan Mehr; W. D. van Driel; K. M. B. Jansen; P. Deeben; M. Boutelje; GuoQi Zhang;
     Optical Materials,
     Volume 35, pp. 504-508, 2013.

314. Thermal Analysis of Remote Phosphor in LED Modules
     Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
     Journal of Semiconductors,
     Volume 34, Issue 5, pp. 053007-1-3, 2013.

315. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
     F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; GuoQi Zhang; P.M. Sarro;
     Journal of Micromechanics and Microengineering,
     2013.

316. Cause analysis on highly depreciated indoor LED product in CSA020
     Guangjun Lu; Yuan C; Hongyu Tang; Wong C; Fan XJ; GuoQi Zhang;
     In Proceedings of China Solid State Lighting Forum,
     2013.

317. Validation of the methodology of lumen depreciation acceleration of LED lighting
     Guangjun Lu; Yuan C; Sun B; Li B; Fan XJ; GuoQi Zhang;
     In Proceedings of China Solid State Lighting Forum,
     2013.

318. Thermal Analysis for Silicon-based Integration of LED Systems
     Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
     In 10th China International Forum on Solid State Lighting,
     2013.

319. Carbon Nanotube based heat-sink for solid state lighting
     F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; GuoQi Zhang; P.M. Sarro;
     In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
     pp. 1214-1217, Apr 2013. DOI 10.1109/NEMS.2013.6559937.

320. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
     X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; GuoQi Zhang;
     Sensors and Actuators B: Chemical,
     Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.

321. Effects of single vacancy defect position on the stability of carbon nanotubes
     R.H. Poelma; H. Sadeghian; S. Koh; GuoQi Zhang;
     Microelectronics Reliability Journal,
     Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.

322. An approach to �Design for Reliability� in solid state lighting systems at high temperatures
     S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.

323. Diagnosing lumen depreciation in LED lighting systems: An estimation approach
     J. Dong; A. Pandharipande; W. van Driel; GuoQi Zhang;
     IEEE Transactions on Signal Processing,
     Volume 60, Issue 7, pp. 3796-3808, Jul. 2012. DOI 10.1109/TSP.2012.2192114.

324. Analytical large deflection method for carbon nanotube young�s modulus determination
     N. Tolou; A. Khiat; GuoQi Zhang; J.L. Herder;
     International Journal of Nonlinear Sciences and Numerical Simulation,
     Volume 12, Issue 1-8, pp. 51-58, Feb. 2012. DOI 10.1515/ijnsns.2011.300.

325. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
     C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
     Journal of Applied Physics,
     Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.

326. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
     A. Khiat; R.H. Poelma; GuoQi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
     Microelectronic Engineering,
     Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.

327. The mechanical properties modeling of nano-scale materials by molecular dynamics
     C. Yuan; W.D. Driel; R.H Poelma; GuoQi Zhang;
     In Molecular Modeling and Multiscaling for Electronic Material Applications,
     Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.

328. Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
     S. Koh; A. Saxena; W.D. van Driel; GuoQi Zhang; R. Tummala;
     In Molecular Modeling and Multiscaling for Electronic Material Applications,
     Springer, 2012. DOI 10.1007/978-1-4614-1728-6_5.

329. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
     J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; GuoQi Zhang;
     In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
     Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

330. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
     F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; GuoQi Zhang; P.M. Sarro;
     In Proc. 11th IEEE Sensors Conference,
     Taipei, Taiwan, pp. 668-671, Oct 2012.

331. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
     D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; GuoQi Zhang;
     In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.

332. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
     J. Wei; C. Yue; GuoQi Zhang; J.F. Dijksman; P.M. Sarro;
     In Proc. 11th IEEE Sensors Conference,
     Taipei, Taiwan, pp. 2172-2175, Oct 2012.

333. Thermal and moisture degradation in SSL system
     S. Koh; W.D. van Driel; GuoQi Zhang;
     In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Lisbon, Portugal, pp. 1-6, Apr. 2012. DOI 10.1109/ESimE.2012.6191806.

334. System approach for reliability of low-power power electronics: How to break down into their constructed parts
     S. Tarashioon; W.D. van Driel; GuoQi Zhang;
     In 7th International Conference on Integrated Power Electronics Systems (CIPS 2012),
     Nuremberg, Germany, pp. 1-5, Mar. 2012.

335. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
     H. Ye; S. Koh; J. Wei; H.W. van Zeijl; GuoQi Zhang;
     In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

336. Establishment of the mesoscale parameters for epoxy-copper interfacial separation
     C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
     In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.

337. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
     X. Chen; C. Yuan; C. Wong; GuoQi Zhang;
     In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.

338. A review of passive thermal management of LED module
     H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; GuoQi Zhang;
     Journal of Semiconductors,
     Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.

339. Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
     X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; GuoQi Zhang;
     Molecular Simulation,
     Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.

340. Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
     X.P. Chen; C.A. Yuan; C.K.. Wong; GuoQi Zhang;
     Journal of Molecular Modeling,
     pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.

341. A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
     R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; GuoQi Zhang;
     Journal of Micromechanics and Microengineering,
     Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.

342. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
     X.P. Chen; C.K.Y. Wong; C.A. Yuan; GuoQi Zhang;
     In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
     Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.

343. Buckling analysis of carbon nanotubes and the influence of defect position
     R.H. Poelma; H. Sadeghian; S.W. Koh; GuoQi Zhang;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.

344. Thermal analysis of HB LED packages and advanced materials
     H. Ye; A.W.J. Gielen; H.W. vanZeijl; GuoQi Zhang;
     In ChinaSSL 2012, China,
     2011.

345. Co-design of wafer level thin film package assembly
     J.J.M. Zaal; F. Santagata; W.D. van Driel; GuoQi Zhang; J.F. Creemer; P.M. Sarro;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
     document

346. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
     H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; GuoQi Zhang;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845.

347. Degradation of epoxy lens materials in LED systems
     S. Koh; W.D. van Driel; GuoQi Zhang;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850.

348. Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
     C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; GuoQi Zhang;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

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