prof.dr. GuoQi Zhang

Projects history

1. Review of Packaging Schemes for Power Modules
   Fengze Hou; W. Wang; L. Cao; M. Su; J. Li; GuoQi Zhang; J.A. Ferreira;
   IEEE Journal of Emerging and Selected Topics in Power Electronics,
   Volume 8, Issue 1, pp. 223-238, 2020.

2. Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
   Fengze Hou; W. Wang; R. Ma; Y. Li; Z. Han; M. Su; J. Li; Z. Yu; Y. Song; Q. Wang; M. Chen; L. Cao; GuoQi Zhang; J.A. Ferreira;
   IEEE Journal of Emerging and Selected Topics in Power Electronics,
   Volume 8, Issue 1, pp. 367-380, 2020.

3. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
   Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; Guoqi Zhang;
   IEEE Transactions on Power Electronics,
   Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117

4. Towards Multi-Functional SiO2@YAG:Ce Core–Shell Optical Nanoparticles for Solid State Lighting Applications
   Mahdi Kiani Khouzani; Abbas Bahrami; Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
   Nanomaterials,
   Volume 10, Issue 1, pp. 153, 2020. DOI: https://doi.org/10.3390/nano10010153

5. Maintaining Transparency of a Heated MEMS Membrane for Enabling Long-Term Optical Measurements on Soot-Containing Exhaust Gas
   Luke M. Middelburg; Mohammadamir Ghaderi; David Bilby; Jaco H. Visser; GuoQi Zhang; Per Lundgren; Peter Enoksson; Reinoud F. Wolffenbuttel;
   MDPI Sensors,
   Volume 20, 2020. DOI: https://doi.org/10.3390/s20010003

6. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
   Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
   Applied Surface Science,
   2020. DOI: https://doi.org/10.1016/j.apsusc.2020.145251

7. Degradation of optical materials in solid-state lighting systems
   M. Yazdan Mehr; A. Bahrami; W.D. van Driel; Xuejun Fan; J. L. Davis; GuoQi Zhang;
   International Materials Reviews,
   Volume 65, Issue 2, pp. 102-128, 2020.

8. Infrared absorbance of vertically-aligned multi-walled CNT forest as a function of synthesis temperature and time
   Amir Mirza Gheytaghia; Amir Ghaderi; Sten Vollebregt; Majid Ahmadic; Reinoud Wolffenbuttel; GuoQi Zhang;
   Materials Research Bulletin,
   2020. DOI: https://doi.org/10.1016/j.materresbull.2020.110821

9. Toward a Self-Sensing Piezoresistive Pressure Sensor for all-SiC Monolithic Integration
   L.M. Middelburg; H.W. van Zeijl; S. Vollebregt; B. Morana; GuoQi Zhang;
   IEEE Sensors,
   Volume 20, Issue 19, pp. 11265-11274, 2020. DOI: 10.1109/JSEN.2020.2998915

10. The Impact of Gate Recess on the H2 Detection Properties of Pt-AlGaN/GaN HEMT Sensors
    Robert Sokolovskij; Jian Zhang; Hongze Zheng; Wenmao Li; Yang Jiang; Gaiying Yang; Hongyu Yu; Pasqualina M. Sarro; Guoqi Zhang;
    IEEE Sensors,
    Volume 20, Issue 16, pp. 8947-8955, 2020.
    document

11. Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated
    Amir Mirza Gheitaghy; René H. Poelma; Leandro Sacco; Sten Vollebregt; GuoQi Zhang;
    MDPI Nanomaterials,
    Volume 10, Issue 6, pp. 1189, 2020. DOI: https://doi.org/10.3390/nano10061189

12. Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
    Jianwen Sun; Dong Hu; Zewen Liu; Luke Middelburg; Sten Vollebregt; Pasqualina M. Sarro; Guoqi Zhang;
    Sensors and Actuators A: Physical,
    Volume 314, pp. 112217, 2020.
    document

13. Surface-micromachined Silicon Carbide Pirani Gauges for Harsh Environments
    Jiarui Mo; L.M. Middelburg; B. Morana; H.W. Van Zeijl; S. Vollebregt; GuoQi Zhang;
    IEEE Sensors,
    2020.
    document

14. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

15. Recent advances in 2D/nanostructured metal sulfides-based gas sensors: mechanisms, applications, and perspectives
    Hongyu Tang; Leandro Sacco; Sten Vollebregt; Huaiyu Ye; Xuejun; Fan; Guoqi Zhang;
    Journal of Materials Chemistry A,
    2020.
    document

16. Ultraviolet Sensing in WBG: SiC
    Brahim el Mansouri; W.D. van Driel; GuoQi Zhang;
    Springer, , pp. 397-425, 2020.

17. From Si Towards SiC Technology for Harsh Environment Sensing
    L. M. Middelburg; W. D. van Driel; GuoQi Zhang;
    Springer, , 2020.

18. Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors
    Middelburg, L. M.; Ghaderi, M.; Bilby, D.; Visser, J. H.; GuoQi Zhang; Wolffenbuttel, R. F.;
    In IEEE 29th International Symposium on Industrial Electronics (ISIE),
    pp. 1099-1103, 2020. DOI: 10.1109/ISIE45063.2020.9152484

19. Implementation of General Coupling Model of Electromigration in ANSYS
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    In IEEE 70th Electronic Components and Technology Conference (ECTC),
    2020.
    document

20. A Reliability Prediction Methodology for LED Arrays
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang; Guohao Zhang;
    IEEE Access,
    Volume 7, pp. 8127-8134, 2019.

21. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    2019. DOI: https://doi.org/10.1109/TCPMT.2018.2884032

22. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
    Ruisheng Xu; Yang Liu; Hao Zhang; Zhao Li; Fenglian Sun; GuoQi Zhang;
    Journal of Electronic Materials,
    Volume 48, Issue 3, pp. 1758-1765, 2019. DOI: https://doi.org/10.1007/s11664-018-06865-1

23. Characterization of an Acetone Detector based on a Suspended WO3-Gate AlGaN/GaN HEMT Integrated with Micro-heater
    Jianwen Sun; Robert Sokolovskij; Elina Iervolino; Fabio Santagata; Zewen Liu; Pasqualina M. Sarro; GuoQi Zhang;
    IEEE Transactions on Electron Devices,
    2019. DOI: https://doi.org/10.1109/TED.2019.2936912
    document

24. First principles study of gas molecules adsorption on monolayered β-SnSe
    Liu, T.; Qin, H.; Yang, D.; GuoQi Zhang;
    Coatings,
    2019. DOI: https://doi.org/10.3390/COATINGS9060390

25. Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs
    Cai, M.; Liang, Y.; Yun, M.; Chen, X-Y.; Yan, H.; Yu, Z.; Yang, D.; GuoQi Zhang;
    IEEE Access,
    2019. DOI: https://doi.org/10.1109/ACCESS.2019.2900361

26. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer
    Venkatesh, M. R.; Sachdeva, S.; El Mansouri, B.; Wei, J.; Bossche, A.; Bosma, D.; de Smet; L. C. P. M.; Sudhölter, E. J. R.; GuoQi Zhang;
    Sensors (Basel, Switzerland),
    2019. DOI: https://doi.org/10.3390/s19040888

27. High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
    Brahim El Mansouri; Luke M. Middelburg; Rene H. Poelma; GuoQi Zhang; Henk W. van Zeijl; Jia Wei; Hui Jiang; Johan G. Vogel; Willem D. van Driel;
    Microsystems & Nanoengineering,
    Volume 5, 2019.
    document

28. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process
    Lin, P.; Xie, X.; Wang, Y.; Lian, B.; GuoQi Zhang;
    Microsystem Technologies,
    2019. DOI: https://doi.org/10.1007/s00542-018-4249-8

29. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer
    Niu, F.; Cai, M.; Pang, J.; Li, X.; GuoQi Zhang, G.; Yang, D.;
    Surface Science,
    2019. DOI: https://doi.org/10.1016/j.susc.2019.02.008

30. Degradation of optical materials in solid-state lighting systems
    Yazdan Mehr, M.; Bahrami, A.; van Driel, W. D.; Fan, X. J.; Davis, J. L.; GuoQi Zhang;
    International Materials Reviews,
    2019. DOI: https://doi.org/10.1080/09506608.2019.1565716

31. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages
    Fengze Hou; Wang, W.; Zhang, H.; Chen, C.; Chen, C.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
    Applied Thermal Engineering,
    Volume 163, pp. 114338, 2019. DOI: https://doi.org/10.1016/j.applthermaleng.2019.1143

32. First-principles investigation of the adsorption behaviors of CH 2 O on BN, AlN, GaN, InN, BP, and P monolayers
    Feng, C.; Qin, H.; Yang, D.; GuoQi Zhang;
    Materials,
    2019. DOI: https://doi.org/10.3390/ma12040676

33. SnSe monolayer: A promising candidate of SO 2 sensor with high adsorption quantity
    Ye, H.; Liu, L.; Xu, Y.; Wang, L.; Chen, X.; Zhang, K.; Liu, Y.; Koh, S.; GuoQi Zhang;
    Applied Surface Science,
    2019. DOI: https://doi.org/10.1016/j.apsusc.2019.03.346

34. High moisture accelerated mechanical behavior degradation of phosphor/silicone composites used in white light-emitting diodes
    Fan, J.; Wang, Z.; Zhang, X.; Deng, Z.; Fan, X.; GuoQi Zhang;
    Polymers,
    2019. DOI: https://doi.org/10.3390/polym11081277

35. Terahertz radiation enhancement in dipole photoconductive antenna on LT-GaAs using a gold plasmonic nanodisk array
    Bashirpour, M.; Poursafar, J.; Kolahdouz, M.; Hajari, M.; Forouzmehr, M.; Neshat, M.; Hajihoseini, H.; Fathipour, M.; Kolahdouz, Z.; GuoQi Zhang;
    Optics and Laser Technology,
    2019. DOI: https://doi.org/10.1016/j.optlastec.2019.105726

36. Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance
    Hongyu Tang; Qu, Z.,; Wang, L.; Ye, H.; GuoQi Zhang; Fan, X.;
    Physical Chemistry Chemical Physics,
    2019. DOI: https://doi.org/10.1039/c9cp03381e

37. Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method
    Chen, W.; Fan, J.; Qian, C.; Pu, B.; Fan, X.; GuoQi Zhang;
    IEEE Access,
    2019. DOI: https://doi.org/10.1109/ACCESS.2019.2916878

38. Continuous shock-free termination of atrial fibrillation by local optogenetic therapy and arrhythmia-triggered activation of an implanted light source
    E C A Nyns; R H Poelma; L Volkers; C I Bart; T J Van Brakel; K Zeppenfeld; M J Schalij; GuoQi Zhang; A A F De Vries; D A Pijnappels;
    European Heart Journal,
    Volume 40, Issue 1, 2019. DOI: https://doi.org/10.1093/eurheartj/ehz748.0090

39. An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation
    Emile C. A. Nyns; René H. Poelma; Linda Volkers; Jaap J. Plomp; Cindy I. Bart; Annemarie M. Kip; Thomas J. van Brakel; Katja Zeppenfeld; Martin J. Schalij; GuoQi Zhang; Antoine A. F. de Vries; Daniël A. Pijnappels;
    Science Translational Medicine,
    Volume 11, Issue 481, 2019. DOI: 10.1126/scitranslmed.aau6447

40. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu− Ag Nanoflakes for Electrically Conductive Pastes
    Yu Zhang; Pengli Zhu; Gang Li; Zhen Cui; Chengqiang Cui; Kai Zhang; Jian Gao; Xin Chen; GuoQi Zhang; Rong Sun; Chingping Wong;
    ACS Applied Materials & Interfaces,
    2019.

41. 循环电载荷下大功率LED金引线疲劳断裂寿命预测
    Fan, J.; Li, L.; Qian, C.; Hu, A.; Fan, X.; GuoQi Zhang;
    Journal of Beijing University of Aeronautics and Astronautics,
    2019. DOI: https://doi.org/10.13700/j.bh.1001-5965.2018.0401

42. Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
    Hongyu Tang; Yutao Li; Robert Sokolovskij; Leandro Sacco; Hongze Zheng; Huaiyu Ye; Hongyu Yu; Xuejun Fan; He Tian; Tian-Ling Ren; GuoQi Zhang;
    ACS Applied Materials and Interfaces,
    pp. 40850-40859, 2019. DOI: https://doi.org/10.1021/acsami.9b13773

43. Characterization of PCB Embedded Package Materials for SiC MOSFETs
    Fengze Hou; Wang, W.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 9, Issue 6, pp. 1054-1061, 2019. DOI: https://doi.org/10.1109/TCPMT.2019.2904533

44. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
    Jiajie Fan; Ling Zhou; Zhen Cui; Shanghuan Chen; Xuejun; GuoQi Zhang;
    Journal of Luminescence,
    2019. DOI: https://doi.org/10.1016/j.jlumin.2019.116874

45. Suspended tungsten trioxide (WO3) gate AlGaN/GaN heterostructure deep ultraviolet detectors with integrated micro-heater
    Jianwen Sun; Teng Zhan; Zewen Liu; Junxi Wang; Xiaoyan Yi; Lina Sarro; GuoQi Zhang;
    Optics Express,
    Volume 27, Issue 25, 2019.
    document

46. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response
    Chenshan Gao; Yingying Zhang; Huiru Yang; Yang Liu; Yufei Liu; Jihe Dua; Huaiyu Ye; GuoQi Zhang;
    Applied Surface Science,
    2019. DOI: https://doi.org/10.1016/j.apsusc.2019.07.067

47. Suspended AlGaN/GaN HEMT NO2 Gas Sensor Integrated with Micro-heater
    Jianwen Sun; Robert Sokolovskija; Elina Iervolino; Zewen Liu; Pasqualina M. Sarro; GuoQi Zhang;
    Journal of Microelectromechanical Systems,
    2019.
    document

48. Impact of high temperature H2 pre-treatment on Pt-AlGaN/GaN HEMT sensor for H2S detection
    Jian Zhang; Robert Sokolovskij; Ganhui Chen; Yumeng Zhu; Yongle Qi; Xinpeng Lin; Wenmao Li; GuoQi Zhang; Yu-Long Jiang; Hongyu Yu;
    Sensors and Actuators, B: Chemical,
    Volume 280, pp. 138-143, 2019. DOI: https://doi.org/10.1016/j.snb.2018.10.052

49. Stress analysis of pressure-assisted sintering for the double-side assembly of power module
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
    Soldering and Surface Mount Technology,
    2019. DOI: https://doi.org/10.1108/SSMT-01-2018-0005

50. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
    Results in Physics,
    Volume 12, pp. 712-717, 2019. DOI: https://doi.org/10.1016/j.rinp.2018.12.026

51. General coupling model for electromigration and one-dimensional numerical solutions
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    Journal of Applied Physics,
    Volume 125, pp. 105101-1-9, 2019. DOI: https://doi.org/10.1063/1.5065376

52. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
    Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
    In 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE,
    2019. DOI: https://doi.org/10.1109/TRANSDUCERS.2019.8808192

53. Degradation Prediction of Electronic Packages using Machine Learning
    Prisacaru, A.; Guerrero, E. O.; Gromala, P. J.; Han, B.; GuoQi Zhang;
    In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019,
    2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724523

54. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability
    Wang, S.; Tan, C.; Wang, L.; Luo, H.; GuoQi Zhang; Chen, X.;
    In Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE,
    2019. DOI: https://doi.org/10.1109/EDTM.2019.8731110

55. Compressive response of pristine and superconductor coated MWCNT pillars
    A. M. Gheytaghi; S. Vollebregt; R.H. Poelma; H. W. Zeijl; GuoQi Zhang;
    In IEEE MEMS,
    2019.

56. A SPICE-based transient thermal-electronic model for LEDs
    Bo Sun; Fan, J.; Fan, X.; GuoQi Zhang;
    In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE,
    2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724555

57. Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions
    Mehr, M. Y.; Van Driel, W.; GuoQi Zhang;
    In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019,
    2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724524

58. Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap
    Zhang, Y.; Tao, L.; Li, X.; GuoQi Zhang; Chen, X.;
    In Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE,
    IEEE, 2019. DOI: https://doi.org/10.1109/EDTM.2019.8731255

59. Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process
    Jing, Z.; Ibrahim, M. S.; Fan, J.; Fan, X.; GuoQi Zhang;
    In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE,
    2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724571

60. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances
    Zuopeng Qu; Hongyu Tang; Huaiyu Ye; Xuejun Fan; GuoQi Zhang;
    In EurosimE,
    IEEE, IEEE, 2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724549

61. A review on discoloration and high accelerated testing of optical materials in LED based-products
    M. Yazdan Mehr; M.R. Toroghinejad; F. Karimzadeh; W.D. van Driel; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 136-142, 2018.

62. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
    Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 84, pp. 140-148, 2018.

63. Thermal Management on IGBT Power Electronic Devices and Modules
    Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; GuoQi Zhang;
    IEEE Access,
    Volume 6, pp. 12868-12884, 2018.

64. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation
    Amir Mirza Gheytaghi; Hamid Saffari; GuoQi Zhang;
    Heat Transfer Engineering,
    2018.

65. Tomorrow’s advanced packaging; for electronics and heterogeneous system integration
    H. Yi; A. M. Gheytaghi; B. El Mansouri; L.M. Middelburg; GuoQi Zhang;
    ETV Maxwell,
    Volume 21.2, 2018.

66. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating
    Liangbiao Chen; Jiang Zhou; Hsing-Wei Chu; GuoQi Zhang; Xuejun Fan;
    Applied Mechanics Reviews,
    Volume 70, Issue 2, pp. 020803-1-16, 2018.

67. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
    Cinzia Silvestri; Michele Riccio; René H. Poelma; Aleksandar Jovic; Bruno Morana; Sten Vollebregt; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
    Small,
    Volume 14, Issue 20, pp. 1800614, 2018. DOI: 10.1002/smll.201800614

68. A new hermetic sealing method for ceramic package using nanosilver sintering technology
    Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 143-149, 2018.

69. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
    IEEE Transactions on Device and Materials Reliability,
    Volume 18, Issue 2, pp. 240-246, 2018.

70. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
    Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 8, Issue 7, pp. 1254-1262, 2018.

71. A stochastic process based reliability prediction method for LED driver
    Bo Sun; Xuejun Fan; Willem van Driel; Chengqiang Cui; GuoQi Zhang;
    Reliability Engineering and System Safety,
    Volume 178, pp. 140-146, 2018.

72. Germanene on single layer ZnSe substrate: Novel electronic and optical properties
    H. Y. Ye; F. F. Hu; Hongyu Tang; L. W. Yang; X. P. Chen; L. G. Wang; GuoQi Zhang;
    Physical Chemistry Chemical Physics,
    Volume 20, Issue 23, pp. 16067-16076, 2018.

73. High Selective Gas Detection for small molecules based on Germanium selenide monolayer
    Liu, L.; Yang, Q.; Wang, Z.; Ye, H.; Chen, X.; Fan, X.; GuoQi Zhang;
    Applied Surface Science,
    pp. 575-581, 2018. DOI: https://doi.org/10.1016/j.apsusc.2017.10.084

74. Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor
    Sokolovskij, R.; Zhang, J.; Iervolino, E.; Zhao, C.; Santagata, F.; Wang, F.; Yu, H.; Sarro, P. M.; GuoQi Zhang;
    Sensors and Actuators B: Chemical,
    2018. DOI: https://doi.org/10.1016/j.snb.2018.08.015

75. In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor
    Prisacaru, A.; Palczynska, A.; Theissler, A.; Gromala, P.; Han, B.; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 750-763, 2018. DOI: https://doi.org/10.1109/TCPMT.2018.2816259

76. Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende gaN crystals
    Qin, H.; Kuang, T.; Luan, X.; Li, W.; Xiao, J.; Zhang, P.; Yang, D.; GuoQi Zhang;
    Crystals,
    2018. DOI: https://doi.org/10.3390/cryst8110428

77. Study on the Degradation of Optical Silicone Exposed to Harsh Environments
    Yazdan Mehr, M.; van Driel, W.; De Buyl, F.; GuoQi Zhang;
    Materials,
    2018. DOI: https://doi.org/10.3390/ma11081305

78. The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene
    Yang, N.; Yang, D.; GuoQi Zhang; Chen, L.; Liu, D.; Cai, M.; Fan, X.;
    Sensors,
    2018. DOI: https://doi.org/10.3390/s18020422

79. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates
    Li, S.; Yang Liu; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
    Results in Physics,
    2018. DOI: https://doi.org/10.1016/j.rinp.2018.10.005

80. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
    Yang Liu; Li, S.; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
    Journal of Materials Science: Materials in Electronics,
    pp. 13167-13175, 2018. DOI: https://doi.org/10.1007/s10854-018-9440-2

81. Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study
    Yang, H.; Wang, Z.; Ye, H.; Zhang, K.; Chen, X.; GuoQi Zhang;
    Applied Surface Science,
    pp. 554-561, 2018. DOI: https://doi.org/10.1016/j.apsusc.2018.08.014

82. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting
    Yuan Gao; Jianfei Dong; Olindo Isabella; Rudi Santbergen; Hairen Tan; Miro Zeman; GuoQi Zhang;
    Applied Energy,
    Volume 228, pp. 1454-1472, 2018.

83. Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers
    Bo Sun; Fan, X.; van Driel, W. D. (ed.); GuoQi Zhang;
    Springer, , 2018. DOI: https://doi.org/10.1007/978-3-319-58175-0_16

84. LED-Based Luminaire Color Shift Acceleration and Prediction
    Lu, G.; van Driel, W. D. (ed.); Fan, X.; Fan, J.; GuoQi Zhang;
    Springer, , pp. 201-219, 2018. DOI: https://doi.org/10.1007/978-3-319-58175-0_9

85. Reliability and Lifetime Assessment of Optical Materials in LED-Based Products
    Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
    In Solid State Lighting Reliability Part 2,
    Springer, 2018.

86. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology
    Fengze Hou; Xueping Guo; Qidong Wang; Wenbo Wang; Tingyu Lin; Liqiang Cao; GuoQi Zhang; J.A. Ferreira;
    In Proc. IEEE Electronic Components and Technol. Conf. (ECTC),
    pp. 1365- 1370, 2018.

87. Designing a 100 [aF/nm] capacitive transducer
    L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; GuoQi Zhang; W. D. van Driel;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

88. Modeling of two-dimensional hyperbolic heat conduction in silicon-on-insulator transistor by equivalent RLC network
    Amir Mirza Gheytaghi; Huaiyu Ye; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    2018.

89. Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
    Z. Huang; R.H. Poelma; S. Vollebregt; M.H. Koelink; E. Boschman; R. Kropf; M. Gallouch; GuoQi Zhang;
    In IEEE Electronics System-Integration Technology Conference (ESTC),
    pp. 1-5, 2018.

90. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
    Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

91. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

92. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation
    Fan, J.; Hu, A.; Pecht, M.; Chen, W.; Fan, X.; Xu, D.; GuoQi Zhang;
    In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    IEEE, pp. pp. 1642-1648, 2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480748

93. SiC MOSFET Threshold-Voltage Instability under High Temperature Aging
    Liu, Y.; Chen, X.; Zhao, Z.; Li, Z.; Lu, C.; Zhang, J.; Ye, H.; Koh, S. W.; Wang, L.; GuoQi Zhang;
    In Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480781

94. Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
    Middelburg, L. M.; Mansouri, B. E.; Poelma, R.; GuoQi Zhang; Van Zeijl, H.; Wei, J.;
    In Proc. IEEE Sensors,
    2018. DOI: https://doi.org/10.1109/ICSENS.2018.8589630

95. The performance of sintered nanocopper interconnections for high temperature device
    Liu, Q.; Chen, X.; Zhu, J.; Zhang, H.; Zhang, J. S.; Zhang, J. G.; Wang, L.; Ye, H.; Koh, S. W.; GuoQi Zhang;
    In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    IEEE, 2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480591

96. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
    Zhen Cui; Yingying Zhang; Qun Yang; GuoQi Zhang; Xianping Chen;
    In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
    2018. DOI: https://doi.org/10.1109/EDTM.2018.8421434

97. Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs
    Wang, Z.; Fan, J.; Liu, J.; Hu, A.; Qian, C.; Fan, X.; GuoQi Zhang;
    In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    IEEE, pp. 525-530, 2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480566

98. Shining light on cardiac tachyarrhythmias
    Nyns E CA; Bingen B O; Bart C I; Kip A; Poelma R H; Volkers L; Plomp J J; Jangsangthong W; Engels M C; Schalij M J; GuoQi Zhang; de Vries A AF; Pijnappels D A;
    In Changing the Face of Modern Medicine: Stem Cell and Gene Therapy,
    2018. DOI: https://doi.org/10.1089/hum.2018.29077.abstracts

99. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor
    Prisacaru, A.; Sun, Y.; Gromala, P. J.; Han, B.; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE,
    IEEE, pp. 1-3, 2018. DOI: https://doi.org/10.1109/EuroSimE.2018.8369955

100. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
     Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
     Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.

101. First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer
     HC Luo; RS Meng; H Gao; X Sun; J Xiao; HY Ye; GuoQi Zhang; XP Chen;
     IEEE Electron Device Letters,
     Volume 38, Issue 8, pp. 1139-1142, 2017.

102. Color shift acceleration on mid-power LED packages
     Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
     
     Keywords: ...

     Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

103. Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors
     Maryam Yazdan Mehr; S. Vollebregt; W. D. van Driel; GuoQi Zhang;
     Journal of Electronic Materials,
     Volume 46, Issue 10, pp. 5866--5872, 2017. DOI: 10.1007/s11664-017-5592-8
     
     Keywords: ...

     graphene, Light-emitting diode, reliability, remote phosphor.

104. Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
     Yazdan Mehr, M.; M.R. Toroghinejad; F. Karimzadeh; van Driel, W.D.; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 78, pp. 143--147, 2017. DOI: 10.1016/j.microrel.2017.08.014
     
     Keywords: ...

     BPA-PC, LED-based products, Optics, Oxidation, Yellowing.

105. Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes
     Y Liu; H Fu; H Zhang; F Sun; X Wang; GuoQi Zhang;
     Journal of Materials Science: Materials in Electronics,
     Volume 28, Issue 24, pp. 19113-19120, 2017.

106. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
     Hongyu Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 78, pp. 197-204, 2017.

107. Phosphor–silicone interaction effects in high power white light emitting diode packages
     J Fan; M Zhang; X Luo; C Qian; X Fan; A Ji; GuoQi Zhang;
     Journal of Materials Science: Materials in Electronics,
     Volume 28, Issue 23, pp. 17557-17569, 2017.

108. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
     C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; GuoQi Zhang;
     Materials,
     Volume 10, Issue 10, pp. 1181, 2017.

109. Modeling nonlinear moisture diffusion in inhomogeneous media
     L Chen; J Zhou; H Chu; GuoQi Zhang; X Fan;
     Microelectronics Reliability,
     Volume 75, pp. 162-170, 2017.

110. Humidity sensor based on the ionic polymer metal composite
     E Esmaeli; M Ganjian; H Rastegar; M Kolahdouz; Z Kolahdouz; GuoQi Zhang;
     Sensors and Actuators B: Chemical,
     Volume 247, pp. 498-504, 2017.

111. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
     Sumit Sachdeva; Manjunath R. Venkatesh; Brahim El Mansouri; Jia Wei; Andre Bossche; Freek Kapteijn; GuoQi Zhang; Jorge Gascon; Louis C. P. M. de Smet; Ernst J. R. Sudhölter;
     Small,
     Volume 13, Issue 29, pp. 1604150, 2017.

112. Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process
     Zahra Kolahdouz; T Ma; H Abdy; M Kolahdouz; H van Zeijl; GuoQi Zhang;
     Sensors and Actuators A: Physical,
     Volume 263, pp. 622-632, 2017.

113. Hybrid plasmonics slot THz waveguide for subwavelength field confinement and crosstalk between two waveguides
     J Xiao; QQ Wei; DG Yang; P Zhang; N He; GuoQi Zhang; XP Chen;
     IEEE Journal of Selected Topics in Quantum Electronics,
     Volume 23, Issue 4, 2017.

114. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
     Fengze Hou; T Lin; L Cao; F Liu; J Li; X Fan; GuoQi Zhang;
     IEEE Transactions on Components, Packaging and Manufacturing Technology,
     Volume 7, Issue 10, pp. 1721-1728, 2017.

115. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
     J Fan; C Yu; C Qian; X Fan; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 74, pp. 179-185, 2017.

116. Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study
     FF Hu; Hongyu Tang; CJ Tan; HY Ye; XP Chen; GuoQi Zhang;
     IEEE Electron Device Letters,
     Volume 38, Issue 7, pp. 983-986, 2017.

117. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
     C Qian; Y Li; J Fan; X Fan; J Fu; L Zhao; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 74, pp. 173-178, 2017.

118. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
     Bo Sun; X Fan; L Li; H Ye; W van Driel; GuoQi Zhang;
     IEEE Transactions on Components and Packaging and Manufacturing Technology,
     Volume 7, Issue 7, pp. 1081-1088, 2017.

119. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
     Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; GuoQi Zhang;
     Reliability Engineering & System Safety,
     Volume 163, pp. 14-21, 2017.

120. Integrated virtual impactor enabled PM 2.5 sensor
     Mingzhi Dong; E Iervolino; F Santagata; G Zhang; GuoQi Zhang;
     IEEE Sensors Journal,
     Volume 17, Issue 9, pp. 2814-2821, 2017.

121. Sulfur Dioxide and Nitrogen Dioxide Gas Sensor Based on Arsenene: A First-Principle Study
     XP Chen; LM Wang; X Sun; RS Meng; J Xiao; HY Ye; GuoQi Zhang;
     IEEE Electron Device Letters,
     Volume 38, Issue 5, pp. 661-664, 2017.

122. Color shift modeling of light-emitting diode lamps in step-loaded stress testing
     M Cai; D Yang; J Huang; M Zhang; X Chen; C Liang; S Koh; GuoQi Zhang;
     IEEE Photonics Journal,
     Volume 9, Issue 1, pp. 1-14, 2017.

123. Monolithically integrated light feedback control circuit for blue/UV LED smart package
     Zahra K Esfahani; M Tohidian; H van Zeijl; M Kolahdouz; GuoQi Zhang;
     IEEE Photonics Journal,
     Volume 9, Issue 2, pp. 1-13, 2017.

124. Identification and robust control of the nonlinear photoelectrothermal dynamics of LED systems
     J Dong; GuoQi Zhang;
     IEEE Transactions on Industrial Electronics,
     Volume 64, Issue 3, pp. 2215-2225, 2017.

125. Prediction of lumen depreciation and color shift for phosphor-converted white light-emitting diodes based on a spectral power distribution analysis method
     C Qian; J Fan; X Fan; GuoQi Zhang;
     IEEE Access,
     Volume 5, pp. 24054-24061, 2017.

126. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
     Hongy Tang; HY Ye; XP Chen; C Qian; XJ Fan; GuoQi Zhang;
     IEEE Access,
     Volume 5, Issue 5, pp. 16459-16468, 2017.

127. Color shift failure prediction for phosphor-converted white LEDs by modeling features of spectral power distribution with a nonlinear filter approach
     J Fan; MG Mohamed; C Qian; X Fan; GuoQi Zhang; M Pecht;
     Materials 10,
     Volume 7, pp. 819, 2017.

128. High aspect ratio spiral resonators for process variation investigation and MEMS applications
     L. Middelburg; B. El Mansouri; H. van Zeijl; GuoQi Zhang; R. H. Poelma;
     In Proc. IEEE Sensors,
     2017.

129. An AlAs/germanene heterostructure with outstanding tunability of electronic properties
     C Tan; Q Yang; H Ye; X Chen; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

130. Smart Systems Integration in the era of Solid State Lighting
     GuoQi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M. R.Venkatesh; L. Middelburg; B. El Mansouri;
     In Smart System Integration conference (SSI),
     2017.

131. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity
     Cinzia Silvestri; Federico Marciano; Bruno Morana; Violeta Podranovic; Sten Vollebregt; GuoQi Zhang; Pasqualina M Sarro;
     In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
     pp. 266-269, 2017.

132. Optimization of reflow soldering process for white LED chip-scale-packages on substrate
     C Jiang; W Guo; J Fan; C Qian; X Fan; GuoQi Zhang;
     In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
     2017.

133. Luminous flux modeling for high power LED automotive headlamp module
     C Yu; J Fan; C Qian; X Fan; GuoQi Zhang;
     In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
     2017.

134. Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
     R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; GuoQi Zhang;
     In Proceedings of Eurosensors,
     pp. 463, 2017.

135. Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units
     A Prisacaru; A Palczynska; PJ Gromala; B Han; GuoQi Zhang;
     In Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,
     2017.

136. A PoF and statistics combined reliability prediction for LED arrays in lamps
     B Sun; X Fan; J Fan; C Qian; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

137. Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
     Y Zhang; K Zheng; X Chen; GuoQi Zhang; C Tan; Q Yang; J Jiang; H Ye;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

138. In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
     I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; GuoQi Zhang; X Fan;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

139. SnS monolayer as gas sensors: Insights from a first-principles investigation
     F Hu; C Tan; H Ye; X Chen; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

140. First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
     K Zheng; H Ye; GuoQi Zhang; Y Zhang; L Liu; J Jiang; Q Yang; C Tan; X Chen;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

141. Adsorption of gases on monolayer GeSe: A first principle study
     L Liu; Q Yang; H Ye; X Chen; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

142. The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
     Q Yang; C Tan; H Ye; X Chen; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

143. Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
     J Fan; C Xie; C Qian; X Fan; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

144. Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
     C Qian; LL Luo; JJ Fan; XQ Li; XJ Fan; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

145. Prognostics and health monitoring of electronic system: A review
     A Prisacaru; PJ Gromala; MB Jeronimo; B Han; GuoQi Zhang;
     In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
     2017.

146. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
     Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; GuoQi Zhang;
     In EurosimE,
     2017.

147. An accelerated test method of luminous flux depreciation for LED luminaires and lamps
     C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; GuoQi Zhang;
     Reliability Engineering and System Safety,
     Volume 147, pp. 84-92, 2016.

148. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
     Bo Sun; Xuejun Fan; Cheng Qian; GuoQi Zhang;
     IEEE Transactions on Industrial Electronics,
     pp. 99, 2016.

149. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
     Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; GuoQi Zhang;
     IEEE Electron Device Letters,
     Volume 37, Issue 4, 2016.

150. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
     Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
     IEEE Transactions on Electron Devices,
     Volume 63, pp. 2807-2814, 2016.

151. Silicon microfabrication based particulate matter sensor
     Mingzhi Dong; Elina Iervolino; Fabio Santagata; GuoQi Zhang;
     Sensors and Actuators A: Physical,
     Volume 247, pp. 115-124, 2016.

152. Output blue light evaluation for phosphor based smart white LED wafer level packages
     Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; GuoQi Zhang;
     Optics Express,
     Volume 24, Issue 4, pp. 174-177, 2016.

153. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
     A. M. Gheytaghi; S.H. Tabatabaie; H. Saffari; GuoQi Zhang;
     Micro and Nano Letters,
     Volume 11, Issue 8, pp. 412, 2016.

154. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
     Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
     Nanoscale,
     Volume 8, pp. 8266-8275, 2016.
     document

155. Stretchable Binary Fresnel Lens for Focus Tuning
     Xueming Li; Lei Wei; Ren� H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; GuoQi Zhang;
     Scientific Reports,
     Volume 6, pp. 25348, 2016.

156. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
     R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; GuoQi Zhang;
     Advanced Functional Materials,
     Volume 26, Issue 8, pp. 1233-1242, 2016.

157. A review of small heat pipes for electronics
     Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; GuoQi Zhang;
     Applied Thermal Engineering,
     Volume 96, pp. 1-17, 2016.

158. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
     Bo Sun; Xuejun Fan; van Driel, Willem; GuoQi Zhang;
     United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387
     
     Keywords: ...

     Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.

159. Lumen Decay Prediction in LED Lamps
     Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; GuoQi Zhang;
     United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391
     
     Keywords: ...

     Reliability, LED Lamp, Lumen Decay Prediction.

160. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
     Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
     In 13th China International Forum on Solid State Lighting (SSLChina),
     2016.
     document

161. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
     Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; GuoQi Zhang;
     In IEEE 66th Electronic Components and Technology Conference (ECTC),
     2016.
     document

162. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
     Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; GuoQi Zhang;
     In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
     2016.
     document

163. 3D interconnect technology based on low temperature copper nanoparticle sintering
     Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
     In 17th International Conference on Electronic Packaging Technology (ICEPT),
     2016.
     document

164. Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
     R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; GuoQi Zhang;
     In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
     pp. 1094-1097, 2016.

165. Solving the Nonlinear Heat Conduction in a Spherical Coordinate with Electrical Simulation
     A. M. Gheitaghy; H. Saffari; GuoQi Zhang;
     In 18th International Conference on Thermal Engineering,
     2016.

166. Thermal analysis and optimization of IGBT power electronic module based on layout model
     Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; GuoQi Zhang;
     In ICEPT,
     2016.

167. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
     R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; GuoQi Zhang;
     Journal of Micromechanics and Microengineering,
     Volume 25, Issue 5, pp. 055017, 2015.

168. Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints
     H. Wu; J. Dong; G. Qi; GuoQi Zhang;
     Journal of the Optical Society of America A,
     Volume 32, Issue 7, pp. 1262-1270, 2015.

169. Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
     Xian-Ping Chen; Ning Yang; Jun-Ke Jiang; Qiu-Hua Liang; Dao-Guo Yang; GuoQi Zhang;
     IEEE Electron Device Letters,
     Volume 36, Issue 6, 2015.

170. Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
     Chuen Yung; Xuejun Fan; GuoQi Zhang; Michael Pecht;
     IEEE Transactions on Device and Materials Reliability,
     Volume 15, Issue 4, pp. 576-587, 2015.

171. Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
     Jianlin Huang, D. S. Golubovic, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
     IEEE Transactions on Device and Materials Reliability,
     Volume 15, Issue 4, pp. 478-485, 2015.

172. Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
     F. Karegar; M. Kolahdouz; F. D. Nayeri; R. Soleimanzadeh; M. Hosseini; Z Kolahdouz; GuoQi Zhang;
     IEEE Photonics Technology Letters,
     Volume 27, Issue 13, pp. 1430-1433, 2015.

173. Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
     R. Soleimanzadeh; M. S. S. Mousavi; A. Mehrfar; Z. Kolahdouz; M. Kolahdouz; GuoQi Zhang;
     Journal of Crystal Growth,
     Volume 426, pp. 228-233, 2015.

174. Degradation modeling of mid-power white-light LEDs by using Wiener process
     Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
     Optics Express,
     Volume 23, pp. A966-A978, 2015.

175. Highly selective and responsive ultra-violet detection using an improved phototransistor
     R. Soleimanzadeh; M. Kolahdouz; M. A. Charsooghi; Z. Kolahdouz; GuoQi Zhang;
     Applied Physics Letters,
     Volume 106, Issue 23, pp. 231102, 2015.

176. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
     Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 55, Issue 2654-2662, 2015.

177. Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
     Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
     IEEE Transactions on Device and Materials Reliability,
     Volume 15, Issue 2, pp. 220-228, 2015.

178. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
     Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
     Optical Materials,
     Volume 49, pp. 79-84, 2015.

179. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
     Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
     Optical Materials,
     Volume 45, pp. 37-41, 2015.

180. 3D system-in-package design using stacked silicon submount technology
     Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
     Microelectronics International,
     Volume 32, Issue 2, pp. 63-72, 2015.

181. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
     R. H. Poelma; GuoQi Zhang;
     In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
     Springer, 2015.

182. Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
     Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; GuoQi Zhang;
     In Transducers,
     pp. 2041-2044, 2015.

183. Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
     X. J. Fan; R. H. Poelma; L. Chen; GuoQi Zhang;
     In ASME International Mechanical Engineering Congress and Exposition,
     2015.

184. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
     Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 6-7, pp. 1338-1343, 2014.

185. Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
     Maryam Yazdan Mehr; W. D. van Driel; H. Udono; GuoQi Zhang;
     Optical Materials,
     Volume 37, pp. 155-159, 2014.

186. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
     Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
     Applied Thermal Engineering,
     Volume 63, Issue 2, pp. 588-597, 2014.

187. Thermal and mechanical effects of voids within flip chip soldering in LED packages
     Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; GuoQi Zhang; Fenglian Sun; Liangliang Luo;
     Microelectronics Reliability,
     Volume 54, Issue 9-10, pp. 2028-2033, 2014.

188. Reliability and optical properties of LED lens plates under high temperature stress
     Maryam Yazdan Mehr; van Driel, WD; Koh, SW; GuoQi Zhang;
     Microelectronics Reliability,
     2014.

189. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
     Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
     Advanced Functional Materials,
     Volume 24, Issue 36, pp. 5737-5744, 2014.
     document

190. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
     Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 1, pp. 138-142, 2014.

191. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
     Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 6-7, pp. 1355-1362, 2014.

192. Accelerated life time testing and optical degradation of remote phosphor plates
     Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 8, pp. 1544-1548, 2014.

193. Multi-physics reliability simulation for solid state lighting drivers
     Tarashioon, S; van Driel, WD; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 54, Issue 6-7, pp. 1212-1222, 2014.

194. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
     Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; GuoQi Zhang;
     Journal of Materials Science: Materials in Electronics,
     Volume 25, Issue 11, pp. 4954-4959, 2014.

195. Fracture toughness of Cu-EMC interfaces in pressurized steam
     Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; GuoQi Zhang;
     International Journal of Adhesion and Adhesives,
     Volume 49, pp. 73-79, 2014.

196. Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
     Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; GuoQi Zhang;
     In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
     Springer, 2014.

197. Reliability of LED-based Products is a Matter of Balancing Temperatures
     Maryam Yazdan Mehr; W.D. van Driel; GuoQi Zhang;
     In Therminic Conference,
     2014.

198. Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
     H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; GuoQi Zhang;
     In nanoFIS 2014 - Functional Integrated nanoSystems,,
     2014.

199. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
     Guangjun Lu; Yuan, C; Fan, X; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-3, 2014.

200. Numerical modeling of flexible actuator for dynamic lighting
     Teng Ma; Xueming Li; Jia Wei; GuoQi Zhang; P. M. Sarro;
     In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,
     2014.

201. A novel design of heatsink-less LED base fluorescent lamp retrofit
     Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; GuoQi Zhang;
     In ICEPT2014,
     2014.

202. Blue Selective Photodiodes for Optical Feedback in LED Wafer Level Packages
     Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. V. Zeijl; GuoQi Zhang;
     In Solid-State Device Research Conference (ESSDERC), 2014 Proceedings of the European,
     pp. 174-177, 2014.

203. High Accelerated Optical Remote Phosphor Aging Studies for LED Luminaire Applications
     W. D. v. Driel; Maryam Yazdan Mehr; GuoQi Zhang;
     In 11th China SSL conference,
     2014.

204. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
     C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; GuoQi Zhang; P.M. Sarro;
     In IEEE Sensors,
     pp. 827-830, 2014.
     document

205. Miniaturized particulate matter sensor for portable air quality monitoring devices
     Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; GuoQi Zhang;
     In IEEE Sensors,
     pp. 2151-2154, 2014.

206. Colour shift in remote phosphor based LED products
     Maryam Yazdan Mehr; Driel, WD van; GuoQi Zhang;
     In Proceedings - 64th Electronic Components and Technology Conference,
     pp. 1477-1481, 2014.

207. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
     Hongyu Tang; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; GuoQi Zhang;
     In Proceedings of the 15th International Conference on Electronic Packaging Technology,
     pp. 1198-1201, 2014.

208. Investigation of lumen degradation mechanisms of mid-power LED by HAST
     Jianlin Huang; Koh, SW; Xueming Li; GuoQi Zhang;
     In Proceedings of the 15th International Conference on Electronic Packaging Technology,
     pp. 1437-1441, 2014.

209. Reliability and accelerated test methods for plastic materials in LED-based products
     Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-5, 2014.

210. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
     Venkatesh, MR; Liu, P; van Zeijl, HW; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-6, 2014.

211. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
     Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-4, 2014.

212. Thermal performance of embedded heat pipe in high power density LED streetlight module
     Hongyu Tang; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-6, 2014.

213. High aspect ratio lithography for litho-defined wire bonding
     Esfahani, ZK; van Zeijl, HW; GuoQi Zhang;
     In Proceedings - 64th Electronic Components and Technology Conference,
     pp. 1556-1561, 2014.

214. CNT bundles growth on microhotplates for direct measurement of their thermal properties
     C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; GuoQi Zhang; P.M. Sarro;
     In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
     San Francisco, USA, Jan. 2014.
     document

215. Investigation of color shift of LEDs-based lighting products
     Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; GuoQi Zhang;
     In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
     pp. 1-5, 2014.

216. Novel system-in-package design and packaging solution for solid state lighting systems
     Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
     In Proceedings - 64th Electronic Components and Technology Conference,
     pp. 1192-1197, 2014.

217. Adapting LED lighting to compensate the influence of ambient light on the light color
     J.D.H. Wu; GuoQi Zhang;
     In 11th China SSL conference,
     2014.

218. Through-polymer via (TPV) and method to manufacture such a via
     H.W. van Zeijl; R.H. Poelma; GuoQi Zhang;
     Dutch patent, 2014.

219. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
     Maryam Yazdan Mehr; W. D. van Driel; K. M. B. Jansen; P. Deeben; M. Boutelje; GuoQi Zhang;
     Optical Materials,
     Volume 35, pp. 504-508, 2013.

220. Thermal Analysis of Remote Phosphor in LED Modules
     Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
     Journal of Semiconductors,
     Volume 34, Issue 5, pp. 053007-1-3, 2013.

221. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
     F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; GuoQi Zhang; P.M. Sarro;
     Journal of Micromechanics and Microengineering,
     2013.

222. Cause analysis on highly depreciated indoor LED product in CSA020
     Guangjun Lu; Yuan C; Hongyu Tang; Wong C; Fan XJ; GuoQi Zhang;
     In Proceedings of China Solid State Lighting Forum,
     2013.

223. Thermal Analysis for Silicon-based Integration of LED Systems
     Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
     In 10th China International Forum on Solid State Lighting,
     2013.

224. Validation of the methodology of lumen depreciation acceleration of LED lighting
     Guangjun Lu; Yuan C; Sun B; Li B; Fan XJ; GuoQi Zhang;
     In Proceedings of China Solid State Lighting Forum,
     2013.

225. Carbon Nanotube based heat-sink for solid state lighting
     F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; GuoQi Zhang; P.M. Sarro;
     In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
     pp. 1214-1217, Apr 2013. DOI 10.1109/NEMS.2013.6559937.

226. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
     X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; GuoQi Zhang;
     Sensors and Actuators B: Chemical,
     Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.

227. An approach to �Design for Reliability� in solid state lighting systems at high temperatures
     S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; GuoQi Zhang;
     Microelectronics Reliability,
     Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.

228. Effects of single vacancy defect position on the stability of carbon nanotubes
     R.H. Poelma; H. Sadeghian; S. Koh; GuoQi Zhang;
     Microelectronics Reliability Journal,
     Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.

229. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
     A. Khiat; R.H. Poelma; GuoQi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
     Microelectronic Engineering,
     Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.

230. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
     C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
     Journal of Applied Physics,
     Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.

231. Analytical large deflection method for carbon nanotube young�s modulus determination
     N. Tolou; A. Khiat; GuoQi Zhang; J.L. Herder;
     International Journal of Nonlinear Sciences and Numerical Simulation,
     Volume 12, Issue 1-8, pp. 51-58, Feb. 2012. DOI 10.1515/ijnsns.2011.300.

232. Diagnosing lumen depreciation in LED lighting systems: An estimation approach
     J. Dong; A. Pandharipande; W. van Driel; GuoQi Zhang;
     IEEE Transactions on Signal Processing,
     Volume 60, Issue 7, pp. 3796-3808, Jul. 2012. DOI 10.1109/TSP.2012.2192114.

233. The mechanical properties modeling of nano-scale materials by molecular dynamics
     C. Yuan; W.D. Driel; R.H Poelma; GuoQi Zhang;
     In Molecular Modeling and Multiscaling for Electronic Material Applications,
     Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.

234. Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
     S. Koh; A. Saxena; W.D. van Driel; GuoQi Zhang; R. Tummala;
     In Molecular Modeling and Multiscaling for Electronic Material Applications,
     Springer, 2012. DOI 10.1007/978-1-4614-1728-6_5.

235. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
     J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; GuoQi Zhang;
     In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
     Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

236. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
     D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; GuoQi Zhang;
     In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.

237. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
     J. Wei; C. Yue; GuoQi Zhang; J.F. Dijksman; P.M. Sarro;
     In Proc. 11th IEEE Sensors Conference,
     Taipei, Taiwan, pp. 2172-2175, Oct 2012.

238. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
     F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; GuoQi Zhang; P.M. Sarro;
     In Proc. 11th IEEE Sensors Conference,
     Taipei, Taiwan, pp. 668-671, Oct 2012.

239. Thermal and moisture degradation in SSL system
     S. Koh; W.D. van Driel; GuoQi Zhang;
     In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Lisbon, Portugal, pp. 1-6, Apr. 2012. DOI 10.1109/ESimE.2012.6191806.

240. System approach for reliability of low-power power electronics: How to break down into their constructed parts
     S. Tarashioon; W.D. van Driel; GuoQi Zhang;
     In 7th International Conference on Integrated Power Electronics Systems (CIPS 2012),
     Nuremberg, Germany, pp. 1-5, Mar. 2012.

241. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
     H. Ye; S. Koh; J. Wei; H.W. van Zeijl; GuoQi Zhang;
     In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

242. Establishment of the mesoscale parameters for epoxy-copper interfacial separation
     C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
     In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.

243. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
     X. Chen; C. Yuan; C. Wong; GuoQi Zhang;
     In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
     Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.

244. Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
     X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; GuoQi Zhang;
     Molecular Simulation,
     Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.

245. A review of passive thermal management of LED module
     H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; GuoQi Zhang;
     Journal of Semiconductors,
     Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.

246. A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
     R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; GuoQi Zhang;
     Journal of Micromechanics and Microengineering,
     Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.

247. Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
     X.P. Chen; C.A. Yuan; C.K.. Wong; GuoQi Zhang;
     Journal of Molecular Modeling,
     pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.

248. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
     X.P. Chen; C.K.Y. Wong; C.A. Yuan; GuoQi Zhang;
     In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
     Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.

249. Thermal analysis of HB LED packages and advanced materials
     H. Ye; A.W.J. Gielen; H.W. vanZeijl; GuoQi Zhang;
     In ChinaSSL 2012, China,
     2011.

250. Buckling analysis of carbon nanotubes and the influence of defect position
     R.H. Poelma; H. Sadeghian; S.W. Koh; GuoQi Zhang;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.

251. Co-design of wafer level thin film package assembly
     J.J.M. Zaal; F. Santagata; W.D. van Driel; GuoQi Zhang; J.F. Creemer; P.M. Sarro;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
     document

252. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
     H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; GuoQi Zhang;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845.

253. Degradation of epoxy lens materials in LED systems
     S. Koh; W.D. van Driel; GuoQi Zhang;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850.

254. Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
     C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; GuoQi Zhang;
     In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
     Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

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