dr. Boyao Zhang

Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Apr 2020): Low temperature sintering of copper nanoparticles
Promotor: GuoQi Zhang

Expertise: Wafer-lever nano copper interconnection


Since Febrary 2016, she has joined ECTM in TU Delft as a PhD student. Her current work is focusing on wafer-lever nano copper interconnection and application. Before 2016, she has obtained Master of Science in Materials Science and Engineering from University of California, San Diego, USA. In addition, she obtained Bachelor's degree in Materials Science and Engineering from Xi'an Jiaotong University, China.


  1. In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics
    Zhang, Boyao; Damian, Andrei; Zijl, Jurrian; van Zeijl, Henk; Zhang, Yu; Fan, Jiajie; Zhang, Guoqi;
    Journal of Materials Science: Materials in Electronics,
    Volume 32, Issue 4, pp. 4544-4555, Feb 2021. DOI: 10.1007/s10854-020-05196-4

  2. Low Temperature Sintering of Cu Nanoparticle Paste: Mechanism and die attach application
    Boyao Zhang;
    PhD thesis, Delft University Technology, 2020.

  3. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
    Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
    In 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE,
    2019. DOI: 10.1109/TRANSDUCERS.2019.8808192

  4. 3D interconnect technology based on low temperature copper nanoparticle sintering
    Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
    In 17th International Conference on Electronic Packaging Technology (ICEPT),

BibTeX support

Last updated: 5 Jan 2021

Boyao Zhang

  • Left in 2020
  • Now: imec