dr. Boyao Zhang
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics
Expertise: Wafer-lever nano copper interconnection
Since Febrary 2016, she has joined ECTM in TU Delft as a PhD student. Her current work is focusing on wafer-lever nano copper interconnection and application. Before 2016, she has obtained Master of Science in Materials Science and Engineering from University of California, San Diego, USA. In addition, she obtained Bachelor's degree in Materials Science and Engineering from Xi'an Jiaotong University, China.
- Low Temperature Sintering of Cu Nanoparticle Paste: Mechanism and die attach application
PhD thesis, Delft University Technology, 2020.
- MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
In 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE,
2019. DOI: https://doi.org/10.1109/TRANSDUCERS.2019.8808192
- 3D interconnect technology based on low temperature copper nanoparticle sintering
Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
In 17th International Conference on Electronic Packaging Technology (ICEPT),
Last updated: 23 Jun 2020