Department of Microelectronics
Faculty of Electrical Engineering, Mathematics, and Computer Science

MSc Sattari

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Electronic Components, Microelectronics, Thermomechanical Reliability Test chip, Process Integration Fabrication, Power SiP

Themes: Autonomous sensor systems, Health and Wellbeing

Biography

Romina was born in Tehran, Iran in 1993. She received the B.Sc. and M.Sc. degrees in Electrical Engineering from Sharif University of Technology, Tehran, Iran, in 2015 and 2017, respectively. She worked on Indoor Positioning Systems as her thesis work. In 2019, she joined the Electronic Components, Technology, and Materials (ECTM) group at TU Delft, where she is now working as a Ph.D. candidate. Her main research topics are the design and fabrication of a fully thermomechanical reliability test chip, power SiP, and optogenetic system engineering.

Publications

  1. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
    R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

  2. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100771

  3. A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  4. In-situ reliability monitoring of power packages using a Thermal Test Chip
    H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
    In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2022. DOI: 10.1109/EuroSimE54907.2022.9758913

  5. Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
    R. Sattari; H. van Zeijl; GuoQi Zhang;
    In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
    2021. DOI: 10.23919/EMPC53418.2021.9584984

BibTeX support

Last updated: 24 Nov 2023

Romina Sattari

MSc students

MSc project proposals