dr. Hao Zhang

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Jun 2019): Investigation of Pressure Assisted Nanosilver Sintering Process for Application in Power Electronics
Promotor: GuoQi Zhang, Willem van Driel

Expertise: Power electronic packaging, microelectronic packaging

Biography

Since October 2015, he has joined ECTM in TU Delft as a PhD student. His current work is focusing on nanosilver sintering process for interconnection in power electronics.

Publications

  1. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    2019. DOI: https://doi.org/10.1109/TCPMT.2018.2884032

  2. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
    Ruisheng Xu; Yang Liu; Hao Zhang; Zhao Li; Fenglian Sun; GuoQi Zhang;
    Journal of Electronic Materials,
    Volume 48, Issue 3, pp. 1758-1765, 2019. DOI: https://doi.org/10.1007/s11664-018-06865-1

  3. Stress analysis of pressure-assisted sintering for the double-side assembly of power module
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
    Soldering and Surface Mount Technology,
    2019. DOI: https://doi.org/10.1108/SSMT-01-2018-0005

  4. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
    Results in Physics,
    Volume 12, pp. 712-717, 2019. DOI: https://doi.org/10.1016/j.rinp.2018.12.026

  5. Investigation of Pressure Assisted Nanosilver Sintering Process for Application in Power Electronics
    Hao Zhang;
    PhD thesis, Delft University of Technology, 2019.
    document

  6. A new hermetic sealing method for ceramic package using nanosilver sintering technology
    Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 143-149, 2018.

  7. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
    IEEE Transactions on Device and Materials Reliability,
    Volume 18, Issue 2, pp. 240-246, 2018.

  8. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
    Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 8, Issue 7, pp. 1254-1262, 2018.

  9. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates
    Li, S.; Yang Liu; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
    Results in Physics,
    2018. DOI: https://doi.org/10.1016/j.rinp.2018.10.005

  10. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
    Yang Liu; Li, S.; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
    Journal of Materials Science: Materials in Electronics,
    pp. 13167-13175, 2018. DOI: https://doi.org/10.1007/s10854-018-9440-2

  11. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
    Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
    In 13th China International Forum on Solid State Lighting (SSLChina),
    2016.
    document

BibTeX support

Last updated: 25 Jun 2019

Hao Zhang

Alumnus