prof.dr.ir. R. Dekker

Parttime Professor
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Flexible electronics

Themes: Health and Wellbeing

Biography

TBD

ET4127 Themes in Biomedical Electronics

BioMEMS, biosensors, bioelectronics, ultrasound, microfluidics, wavefield imaging in monitoring, diagnosis and treatment

POSITION-II: innovation in smart medical instruments

Ultrasound Integrated Patch for Medical Diagnostics

In this project, we will develop flexible, programmable transducer modules for ultrasound body patches

Spatially specific peripheral nerve stimulation with focused ultrasound

Netherlands Organ-on-Chip Initiative

To develop new microphysiological platforms to better predict the effect of medicines, based on a combination of human stem cells and microtechnology.

Intelligent Catheters in Advanced Systems for Interventions (INCITE) – WP2 Imaging

InForMed: D4 - Steering deep brain stimulation probe (Chip-in-Tip)

Projects history

Sensors and Circuits on Catheters

How to bring highly miniaturized circuits, sensors and actuators to the tip of the catheters and other minimal invasive surgical instruments?

Smart Flexible Sensors for in-vivo Coronary Circulation Diagnostics

Combined pressure and flow sensor, so small that it can be positioned in the tip of the guide wire used in heart angioplasty surgery

Living Chip: Stretchable Multi-Electrode Array for drug screening with stem-cell-derived cardiomyocytes

Stem cell derived human cardiomyocytes are used to detect cardiotoxic side effects of newly developed drugs

  1. TOWARDS A SEMI-FLEXIBLE PARYLENE-BASED PLATFORM TECHNOLOGY FOR ACTIVE IMPLANTABLE MEDICAL DEVICES
    Nasim Bakhshaee Babaroud; Marta Kluba; Ronald Dekker; Wouter Serdijn; Vasiliki Giagka;
    In Book of Abstracts, 7th Dutch Biomedical Engineering Conf. (BME) 2019,
    Jan. 24-25 2019.
    document

  2. Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
    S. Kawasaki; V. Giagka; M. de Haas; M. Louwerse; V. Henneken; C. van Heesch; R. Dekker;
    In Proc. IEEE Conf. on Neural Eng. (NER) 2019,
    San Francisco, CA, USA, March 2019.
    Abstract: ... Vagus nerve stimulators currently on the market can treat epilepsy and depression. Recent clinical trials show the potential for vagus nerve stimulation (VNS) to treat epilepsy, autoimmune disease, and traumatic brain injury. As we explore the benefits of VNS, it is expected that more possibilities for a new treatment will emerge in the future. However, existing VNS relies on electrical stimulation, whose limited selectivity (due to its poor spatial resolution) does not allow for any control over which therapeutic effect to induce. We hypothesize that by localizing the stimulation to fascicular level within the vagus nerve with focused ultrasound (US), it is possible to induce selective therapeutic effects with less side effects. A geometrically curve US transducer array that is small enough to wrap around the vagus nerve was fabricated. An experiment was conducted in water, with 48 US elements curved in a 1 mm radius and excited at 15 MHz to test the focusing capabilities of the device. The results show that the geometrical curvature focused the US to an area with a width and height of 110 μm and 550 μm. This will be equivalent to only 2.1% of the cross section of the vagus nerve, showing the potential of focused US to stimulate individual neuronal fibers within the vagus nerve selectively.

    document

  3. Towards a Semi-Flexible Parylene-Based Platform Technology for Active Implantable Medical Devices
    Nasim Bakhshaee Babaroud; Marta Kluba; Ronald Dekker; Wouter Serdijn; Vasiliki Giagka;
    In Book of Abstracts, 2019 International Winterschool on Bioelectronics Conference (BioEl 2019),
    Kirchberg, Tirol, Austria, 16-23 March 2019.
    document

  4. Towards a semi-flexible parylene-based platform technology for active implantable medical devices
    N. Bakhshaee Babaroud; M. Kluba; R. Dekker; W. Serdijn; V. Giagka;
    In Book of Abstracts, SAFE 2019,
    Delft, the Netherlands, July 4-5 2019.
    document

  5. Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
    Kambiz Nanbakhsh; Marta Kluba; B. Pahl; F. Bourgeois; Ronald Dekker; Wouter Serdijn; V. Giagka;
    In Proc. 41st Int. Conf. of the IEEE Engineering in Medicine and Biology (EMBC) 2019,
    Berlin, Germany, IEEE, July 23-27 2019.
    document

  6. A Platform for Mechano(-Electrical) Characterization of Free-Standing Micron-Sized Structures and Interconnects
    Angel Savov; Shivani Savov; Salman Shafqat; Johan Hoefnagels; Marcus Louwerse; Ronald Stoute; Ronald Dekker;
    Micromachines,
    Volume 9, Issue 1, pp. 39, 2018.
    document

  7. Investigation of "Fur-like" Residues Post Dry Etching of Polyimide Using Aluminum Hard Etch Mask
    Shivani Joshi; Angel Savov; Salman Shafqat; Ronald Dekker;
    Materials Science in Semiconductor Processing,
    Volume 75, pp. 130-135, 2018.
    document

  8. A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly
    William.F Quirós-Solano; Nikolas Gaio; Cinzia Silvestri; Oscar M. J. A. Arik; Yusuf, B. Stassen; Andries van der Meer; Carlijn V.C. Bouten; Albert van den Berg; Ronald Dekker; P.M. Sarro;
    In 31th IEEE International Conference on Micro Electro Mechanical Systems (MEMS),
    pp. 318-321, 2018.

  9. A Multi Well Plate Organ-on-chip (Ooc) Device For In-vitro Cell Culture Stimulation And Monitoring
    N. Gaio; A. Waafi; M.L.H. Vlaming; E. Boschman; P. Dijkstra; P. Nacken; S.R. Braam; C. Boucsein; P.M. Sarro; R. Dekker;
    In 31th IEEE International Conference on Micro Electro Mechanical Systems (MEMS),
    2018.

  10. Novel Method for Adhesion between PI-PDMS Using Butyl Rubber for Large Area Flexible Body Patches
    Joshi, Shivani; Bagani, Rishab; Beckers, Lucas; Dekker, Ronald;
    In Proceedings of Eurosensors,
    pp. 307, 2017.

  11. Generic platform for the miniaturization of bioelectronic implants
    M. M. Kluba; J. W. Weekamp; M. Louwerse; V. Henneken; R. Dekker;
    In Design of Medical Devices Conference (DMD Europe),
    2017.

  12. Singe-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon
    M. Kluba; A. Arslan; R. Stoute; J. Muganda; R. Dekker;
    In Eurosensors,
    2017.
    document

  13. Next generation smart catheters
    R. Dekker;
    In Philips Research,
    2017.

  14. Towards the Next Generation Smart Catheters and implants
    R. Dekker;
    In Smart Systems Industry Summit,
    DSP Valley, 2017.
    document

  15. Towards the next generation of smart catheters and bioelectronics medicines
    R. Dekker;
    In Tyndall Technology Days 2017,
    2017.
    document

  16. Organ-on-Chip
    R. Dekker;
    In Professors in de theatre arena,
    Theatre de Veste, Technical University of Delft, 2017.
    document

  17. Next Generation smart catheters
    R. Dekker;
    In iMAPS,
    2017.

  18. A low-cost electrical read-out system for cell stiffness measurement using silicon based microfluidic device
    S. Kawasaki; M. M. Kluba; R. Dekker;
    In ICT.OPEN,
    2017.

  19. The Next Generation Smart Catheters
    R. Dekker;
    Maxwell, November 2017. "Maxwell" is a periodical of the Delft university of technology that is distributed amongst students and alumni.

  20. Cytostretch, an Organ-on-Chip Platform
    Gaio, N.; van Meer, B.; Quiros Solano, W.; Bergers, L.; van de Stolpe, A.; Mummery, C.; Sarro, P.M.; Dekker, R.;
    Micromachines,
    Volume 7, Issue 7, pp. 120, 2016.

  21. Fabrication and characterization of an Upside-down Carbon Nanotube (CNT) Microelectrode array (MEA)
    Gaio, N.; Silvestri, C.; van Meer, B.; Vollebregt, S.; Mummery, C.; Dekker, R.;
    IEEE Sensors Journal,
    Volume 16, Issue 24, pp. 8685, 2016.

  22. Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification
    Shivani Joshi; Antonie van Loona; Angel Savov; Ronald Dekker;
    MRS Advances,
    Volume 1, pp. 33-38, 2016.

  23. High Definition Flex-to-Rigid (HD F2R): an Interconnect Substrate Technology
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In ICT.OPEN,
    2016.

  24. CMOS compatible embedded microchannels
    R. Stoute; J.M. Muganda; S. Dahar; A. Arslan; R.J.M Henderikx; P.C.M. van Stiphout; J.M.J. den Toonder; R. Dekker;
    In 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences,
    2016.

  25. Intravascular Ultrasound at the Tip of a Guidewire: Concept and First Assembly Steps
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1563-1567, 2016.

  26. High Aspect Ratio Buried Channel Fabricated Using Two Step DRIE Process
    M. M. Kluba; A. Arslan; R. Dekker;
    In ICT.OPEN,
    2016.

  27. Flexible/Stretchable Ultrasound Body Patches
    Shivani Joshi; Sourush Yazdi; Vincent Henneken; Rene Sanders; Ronald Dekker;
    In ICT.OPEN Conference,
    2016.

  28. Flexible membrane sensor for opto-mechanical force transducer
    Ronald Stoute; James Muganda; Steven Beekmans; Davide Iannuzzi; Ronald Dekker;
    In 13th International Workshop on Nanomechanical Sensing,
    2016.

  29. Origami assembly platform for smart medical instruments
    R. Stoute; M. C. Louwerse; V. A. Henneken; R. Dekker;
    In 28th Conference of the international Society for Medical Innovation and Technology (iSMIT) / 4th Design of Medical Devices Conference,
    2016.
    document

  30. Towards the Next Generation of Smart Catheters
    R. Dekker;
    In SEMICON Europa,
    2016.

  31. Flex-to-Rigid, an assembly platform for the next generation smart catheters
    R. Dekker;
    In Forum BE-FLEXIBLE,
    Fraunhofer EMFT, 2016.

  32. Meet Dr. Frankenstein
    R. Dekker;
    Guest Lecture at École Polytechnique Fédérale de Lausanne, November 2016.
    document

  33. Silicon-Based Technology for Integrated Waveguides and mm-Wave Systems
    V. Jovanovic; G. Gentile; R. Dekker; P. de Graaf; L. C. N. de Vreede; L. K. Nanver; M. Spirito;
    IEEE Transactions on Electron Devices,
    Volume 62, Issue 10, pp. 3153-3159, Oct 2015.

  34. Conformable Body Patches for Ultrasound Applications
    S. Joshi; S. Yazadi; V. Henneken; R. Sanders; R. Dekker;
    In 17th IEEE Electronics Packaging Technology Conference,
    2015.

  35. Miniaturized Optical Data Link Assembly for 360 m Guidewires
    Stoute, Ronald; Louwerse, Marcus C.; van Rens, Jeannet; Henneken, Vincent A.; Dekker, Ronald;
    In ICT.OPEN Conference,
    pp. 46-51, 2015.
    document

  36. A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays
    A.Savov; A. H. Noor; R. Dekker;
    In Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International,,
    pp. 145-148, 2015.

  37. Upside-down Carbon Nanotube (CNT) Micro-electrode Array (MEA)
    N. Gaio; B. van Meer; C. Silvestri; Saeed Khoshfetrat Pakazad; S. Vollebregt; C.L. Mummery; R. Dekker;
    In IEEE Sensors Conference,
    2015.

  38. A novel stretchable micro-electrode array (SMEA) design for directional stretching of cells
    S Khoshfetrat Pakazad; A Savov; A van de Stolpe; R Dekker;
    Journal of Micromechanics and Microengineering,
    Volume 24, Issue 3, pp. 034003, 2014.

  39. A post processing approach for manufacturing high-density stretchable sensor arrays
    A. Savov; S. Khoshfetrat Pakazad; S. Joshi; V. Henneken; R. Dekker;
    In IEEE Sensors,
    pp. 1703-1705, 2014.

  40. Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures,
    Volume 31, Issue 2, pp. 021201-021201-6, Mar. 2013. DOI 10.1116/1.4788795.

  41. Silicon-Filled Rectangular Waveguides and Frequency Scanning Antennas for mm-Wave Integrated Systems
    G. Gentile; V. Jovanovic; M. J. Pelk; L. Jiang; R. Dekker; P. de Graaf; B. Rejaei; L. C. N. de Vreede; L. K. Nanver; M. Spirito;
    IEEE Transactions on Antennas and Propagation,
    Volume 61, Issue 12, pp. 5893-5901, Dec 2013.

  42. A manufacturable platform for in vito electrophysiological studies under mechanical stimulation
    S. Khoshferat Pakazad; A. Savov; R. Dekker;
    In Proceedings of the 17th international conference on miniaturized systems for chemistry and life sciences,
    pp. 1412-1414, 2013.

  43. A novel SMEA design for directional stretching of cells
    S. Khoshferat Pakazad; A. Savov and. A. van der Stolpe; R. Dekker;
    In Proceedings of the 2013 International Conference on Microtechnologies in Medicine,
    pp. 6-7, 2013.

  44. Ultra-flexible devices for 360 _m diameter guidewires
    B. Mimoun; V. Henneken; P.M. Sarro; R. Dekker;
    In 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2012),
    Paris, France, IEEE, pp. 472-475, Jan. 2012. ISBN: 978-978-1-4673-0325-5, DOI 10.1109/MEMSYS.2012.6170227.

  45. Thermal flow sensors on flexible substrates for minimally invasive medical instruments
    B. Mimoun; A. van der Horst; D. van der Voort; M. Rutten; R. Dekker; F. van de Vosse;
    In Proc. of IEEE Sensors Conference 2012,
    Taipei, Taiwan, pp. 1-4, Oct. 2012 2012. DOI 10.1109/ICSENS.2012.6411429.

  46. Living chips and Chips for the living
    R. Dekker; S. Braam; V. Henneken; A. van der Horst; S. Khoshfetrat Pakazad; M. Louwerse; B. van Meer; B. Mimoun; A. Savov; A. van de Stolpe;
    In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2012),
    Portland, Oregon, USA, pp. 1-9, Sep. 2012. DOI 10.1109/BCTM.2012.6352653.

  47. A platform for manufacturable stretchable micro-electrode arrays
    S. Khoshfetrat Pakazad; A. Savov; S.R. Braam; R. Dekker;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 817-820, Sep 2012. DOI 10.1016/j.proeng.2012.09.272.

  48. Flexible multipolar cuff microelectrode for FES of sacral nerve roots
    F. Rodrigues; B. Mimoun; M. Bartek; P.M. Mendes; R. Dekker;
    In Proc. 17th Annual International FES Society Conference (IFESS 2012),
    Banff, Alberta, Canada, pp. 1-4, Sept. 2012.

  49. Residue-free plasma etching of polyimide coatings
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    In International Conference on Electronics Packaging 2012 (ICEP),
    Tokyo, Japan, pp. 265-269, Apr. 2012.

  50. Silicon integrated waveguide technology for mm-wave frequency scanning array
    G. Gentile; M. Spirito; L. C. N. de Vreede; B. Rejaei; R. Dekker; P. de Graaf;
    In 2012 7th European Microwave Integrated Circuit Conference,
    pp. 234-237, Oct 2012.

  51. Atomic-scale electron-beam sculpting of near-defect-free graphene nanostructures
    B. Song; G.F. Schneider; Q. Xu; G. Pandraud; C. Dekker; H.W. Zandbergen;
    Nano Letters,
    Volume 11, Issue 6, pp. 2247-2250, 2011. DOI 10.1021/nl200369r.

  52. A novel SOI-MEMS micro-swing time-accelerometer operating in two time-based transduction modes for high sensitivity and extended range
    V. Rajaraman; B.S. Hau; L.A. Rocha; R.A. Dias; K.A.A. Makinwa; R. Dekker;
    In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    Beijing, China, pp. 2066-2069, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969225.

  53. A stretchable micro-electrode array for in vitro electrophysiology
    S. Khoshfetrat Pakazad; A. Metodiev Savov; A. van de Stolpe; S. Braam; B. van Meer; R. Dekker;
    In Proc. 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2011),
    Cancun, Mexico, IEEE, pp. 829-832, Jan. 2011. ISBN 978-1-4244-9633-4; DOI 10.1109/MEMSYS.2011.5734553.

  54. Millimeter-wave integrated waveguides on silicon
    G. Gentile; R. Dekker; P. de Graaf; M. Spirito; L.C.N. de Vreede; B. Rejaei;
    In Proc. 2011 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems (SiRF 2011),
    Phoenix, AZ, pp. 37-40, Jan. 2011. ISBN 978-1-4244-8060-9; DOI 10.1109/SIRF.2011.5719314.

  55. Ultra-flexible devices for smart invasive medical instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

  56. FleXss: A standalone Matlab-based graphical user interface (GUI) for stress-strain analytical modeling of multilayered structures with applied bending
    B. Mimoun; A. Vieira da Silva; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.
    document

  57. Living chips-Chips for the living
    R. Dekker; B. Mimoun; S. Pakazaad;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.
    document

  58. A novel soi-mems "micro-swing" time-accelerometer operating in two time-based transduction modes for high sensitivity and extended range
    V. Rajaraman; B.S. Hau; L.A. Rocha; R.A. Dias; K.A.A. Makinwa; R. Dekker;
    In M. Bao; L-S Fan (Ed.), 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    IEEE, pp. 2066-2069, 2011.

  59. Millimeter-wave integrated waveguides on silicon
    G. Gentile; R. Dekker; P. de Graaf; M. Spirito; L. C. N. de Vreede; B. Rejaei;
    In 2011 IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems,
    pp. 37-40, Jan 2011.

  60. Silicon Filled Integrated Waveguides
    G. Gentile; R. Dekker; P. de Graaf; M. Spirito; M. J. Pelk; L. C. N. de Vreede; B. Rejaei Salmassi;
    IEEE Microwave and Wireless Components Letters,
    Volume 20, Issue 10, pp. 536-538, Oct 2010.

  61. Flex-to-Rigid (F2R): A Novel Ultra-Flexible Technology for Smart Invasive Medical Instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In Stretchable Electronics and Conformal Biointerfaces,
    Mater. Res. Soc. Symp. Proc. Volume 1271E, 2010.

  62. FleSS: a Matlab Based Graphical User Interface for Stress Strain Analytical Modeling of Multilayered Structures with Applied Bending
    A. Vieira da Silva; B. Mimoun; R. Dekker;
    In Proc. of 13th Workshop on Semiconductors Advances for Future Electronics and Sensors 2010 (SAFE 2010),
    Veldhoven, The Netherlands, STW, pp. 175-179, 2010. ISBN 978-90-73461-67-3).

  63. Release and Mounting of Partially Flexible Devices Inside and Around Tubes for Smart Invasive Medical Applications
    B. Mimoun; V. Henneken; R. Dekker;
    In Proc. of 12th Electronic Packaging and Technology Conference 2010 (EPTC 2010),
    Singapore, IEEE, pp. 7-12, 2010. ISBN 978-1-4244-8561-1.

  64. High-aspect-ratio through-wafer parylene beams for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; P. de Graaf; R. Dekker;
    Sensors and actuators a-physical,
    Volume 156, Issue 1, pp. 257-264, 2009. ISSN 0924-4247.

  65. Stretchable array of ISFET devices for applications in biomedical imagers.
    T. Zoumpoulidis; T. Prodomakis; K. Michelakis; H.W. van Zeijl; M. Bartek; C. Toumazou; R. Dekker;
    In S.C. Mukhopadhyay (Ed.), Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, IEEE, pp. 7-12, 2009. ISBN 978-1-4244-5335-1).

  66. Parylene-embedded metal interconnects for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. International Conference on Electronics Packaging (ICEP 2009),
    Kyoto, Japan, JIEP, IEEE, pp. 611-615, 2009.

  67. Fabrication of Stretchable PDMS Membrane as Substrate Material for Multi-Electrode Array Devices
    R. Li; A. van Bogaard; R. Dekker;
    In Proc. of SAFE 2009,
    Veldhoven, The Netherlands, pp. 91-94, 2009.
    document

  68. Mechanical study of silicon nitride layers on thin flexible substrates under bending
    B. Mimoun; O. Gourhant; R. Dekker;
    In Proc. of 12th Workshop on Semiconductors Advances for Future Electronics and Sensors 2009 (SAFE 2009),
    Veldhoven, The Netherlands: STW (ISBN: 978-90-73461-62-8)-Best Flash Presentation Award, pp. 95-98, 2009.

  69. Biocompatible encapsulation of CMOS based chemical sensors
    T. Prodomakis; K. Michelakis; T. Zoumpoulidis; R. Dekker; C. Toumazou;
    In Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, pp. 791-794, 2009.

  70. Large-area silicon electronics using stretchable metal interconnect
    S. Sosin; T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. 59th Electronic Components & Technology Conference (ECTC 2009),
    San Diego, CA, pp. 1059-1064, 2009.

  71. Mechanical study of silicon nitride layers on thin flexible substrates under bending
    B. Mimoun; O. Gourhant; R. Dekker;
    In 2nd International Workshop on Flexible & Stretchable Electronics 2009,
    Ghent, Belgium, 2009.
    document

  72. Front-to back-side overlay optimization after wafer bonding for 3D integration
    L. Marinier; W. van Noort; R. Pellens; B. Sutedja; R. Dekker; H. W. van Zeijl;
    In Proc. 31st International Conference on Micro- and Nano-Engineering 2005,
    Vienna, Austria, Sep. 2005.
    document

  73. A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process - Part I: The Conflict Electrical Versus Thermal Isolation
    L.K. Nanver; N. Nenadovic; V. d Alessandro; H. H. Schellevis; W. van Zeijl; R. Dekker; D.B. de Mooij; V. Zieren; J.W. Slotboom;
    IEEE Trans. on Electron Devices,
    Volume 51, Issue 1, pp. 42-50, Jan. 2004.

  74. Self-assembly experiments with PNA-derivatized cart nanotubes
    R.C. den Dulk; K.A. Williams; P.T.M. Veenhuizen; M. de Koning; M. Overhand; C. Dekker;
    In H Okabayashi; PS Ho; S Shingubara (Ed.), AIP Conference proceedings 2004,
    AIP, pp. 25-30, 2004.

  75. Substrate Transfer Technology
    R. Dekker;
    PhD thesis, Delft University of Technology, Jun. 2004. ISBN 90-74445-61-6; Promotors: prof. J.W. Slotboom, prof. J.N. Burghartz.

  76. Substrate Transfer for RF Technologies
    R. Dekker; P.G.M. Baltus; H.G.R. Maas;
    IEEE Transactions on Electron Devices,
    Volume 50, Issue 3, pp. 747-757, Mar. 2003.

  77. Bio-functional carbon nanotubes
    K.A. Williams; R.C. den Dulk; I. Heller; J. Kong; H.A. Heering; P.T.M. Veenhuizen; M. de Koning; M. Overhand; SG Lemay; C. Dekker;
    conference, 2003.

  78. Design and characterization of integrated passive elements on high ohmic silicon
    E. Valletta; J. van Beek; A. Den Dekker; N. Pulsford; H.F.F. Jos; L.C.N. de Vreede; L.K. Nanver; J.N. Burghartz;
    In 2003 IEEE MTT-S International Microwave Symposium,
    Philadelphia, PA, USA, pp. 1235 -1238, Jun. 2003.

  79. 7781af6e4ower added efficiency surface-mounted bipolar power transistors for low-voltage wireless applications
    R. Dekker; D.M.H. Hartskeer; H.G.R. Maas; F. Van Rijs; J.W. Slotboom;
    BCTM,
    pp. 191-194, 2000.

  80. Ultra-low-temperature low-ohmic contacts for SOA applications
    L.K. Nanver; H.W. van Zeijl; H. Schellevis; R.J.M. Mallee; J. Slabbekoorn; R. Dekker; J.W. Slotboom;
    In 1999 Bipolar/BiCMOS Circuits and Technology Meeting,
    Minneapolis, pp. 137-140, Sept. 1999. ISBN 0-7803-5712-4.

BibTeX support

Last updated: 25 Oct 2017