Department of Microelectronics
Faculty of Electrical Engineering, Mathematics, and Computer Science

MSc Jian Li

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Themes: Health and Wellbeing

POSITION-II: innovation in smart medical instruments

  1. Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication
    Kluba, Marta Maria; Li, Jian; Parkkinen, Katja; Louwerse, Marcus; Snijder, Jaap; Dekker, Ronald;
    Micromachines 2021, 12(4), 414;,
    Volume 12, Issue 4, 2021. DOI: 10.3390/mi12040414
    document

  2. Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration
    Pan Liu; Jian Li; Henk van Zeijl; GuoQi Zhang;
    In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
    United States, IEEE, pp. 817--823, 06 2020. DOI: 10.1109/ECTC32862.2020.00133

  3. Embedded High-Density Trench Capacitors for Smart Catheters
    Jian Li; Jeroen Naaborg; Marcus Louwerse; Vincent Henneken; Carlo Eugeni; Ronald Dekker;
    In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
    pp. 1-5, Sep. 2020. DOI: 10.1109/ESTC48849.2020.9229800

BibTeX support

Last updated: 3 Aug 2018

Jian Li

MSc students