dr. Dong Hu

1. Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation
   Xu Liu; Shaogang Wang; Dong Hu; Chenshan Gao; Qianming Huang; Huaiyu Ye; Paddy French; Guoqi Zhang;
   In IEEE 74th Electronic Components and Technology Conference (ECTC),
   Denver, Colorado, IEEE, IEEE, May 2024.

2. Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation
   Xu Liu; Shaogang Wang; Dong Hu; Chenshan Gao; Qianming Huang; Huaiyu Ye; Paddy French; Guoqi Zhang;
   In IEEE 74th Electronic Components and Technology Conference (ECTC) in Denver, Colorado, from May 28 to May 31, 2024,
   2024.

3. Nanoparticles sintering technology for power electronics modules and beyond
   Dong Hu;
   PhD thesis, Delft University Technology, 2024.

4. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
   R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
   Applied Thermal Engineering,
   Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

5. Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
   Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
   IEEE Transactions on Electron Devices,
   Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066

6. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
   Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
   In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2023. DOI: 10.1109/EuroSimE56861.2023.10100810

7. Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
   Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

8. Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
   Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
   Journal of Physics: Condensed Matter,
   Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f

9. Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
   Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
   In Proc. IEEE Nano,
   pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705

10. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
    Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    Corrosion Science,
    pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

11. Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
    Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
    Journal of Physical Chemistry C,
    2021.
    document

12. Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
    Jianwen Sun; Dong Hu; Zewen Liu; Luke Middelburg; Sten Vollebregt; Pasqualina M. Sarro; Guoqi Zhang;
    Sensors and Actuators A: Physical,
    Volume 314, pp. 112217, 2020.
    document

13. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

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