dr. Dong Hu

1. Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation
   Xu Liu; Shaogang Wang; Dong Hu; Chenshan Gao; Qianming Huang; Huaiyu Ye; Paddy French; Guoqi Zhang;
   In IEEE 74th Electronic Components and Technology Conference (ECTC),
   Denver, Colorado, IEEE, IEEE, May 2024.

2. Nanoparticles sintering technology for power electronics modules and beyond
   Dong Hu;
   PhD thesis, Delft University Technology, 2024.

3. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
   R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
   Applied Thermal Engineering,
   Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

4. Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
   Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
   IEEE Transactions on Electron Devices,
   Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066

5. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
   Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
   In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2023. DOI: 10.1109/EuroSimE56861.2023.10100810

6. Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
   Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

7. Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
   Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
   Journal of Physics: Condensed Matter,
   Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f

8. Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
   Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
   In Proc. IEEE Nano,
   pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705

9. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
   Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
   Corrosion Science,
   pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

10. Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
    Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
    Journal of Physical Chemistry C,
    2021.
    document

11. Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
    Jianwen Sun; Dong Hu; Zewen Liu; Luke Middelburg; Sten Vollebregt; Pasqualina M. Sarro; Guoqi Zhang;
    Sensors and Actuators A: Physical,
    Volume 314, pp. 112217, 2020.
    document

12. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

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