dr.ir. R.H. Poelma

1. Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
   Henry Antony Martin; Marcia Reintjes; Xiao Tang; Dave Reijs; Sander Dorrestein; Martien Kengen; Sebastien Libon; Edsger Smits; Marco Koelink; Rene Poelma; Willem Van Driel; GuoQi Zhang;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

2. High-Temperature Creep Properties of a Novel Solder Material and Its Thermal Fatigue Properties Under Potting Material
   Leiming Du; Guoqi Zhang; Xiujuan Zhao; Willem Van Driel; Rene Poelma;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

3. Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model
   Emile C. A. Nyns; Tianyi Jin; Magda S Fontes; Titus van den Heuvel; Vincent Portero; Catilin Ramsey; Cindy I. Bart; Katja Zeppenfeld; Martin J. Schalij; Thomas J. van Brakel; Arti A. Ramkisoensing; GuoQi Zhang; René H. Poelma; Balazs Ördög; Antoine A. F. de Vries; Daniël A. Pijnappels;
   Cardiovascular Research,
   September 2021. DOI: 10.1093/cvr/cvab294

4. Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated
   Amir Mirza Gheitaghy; René H. Poelma; Leandro Sacco; Sten Vollebregt; GuoQi Zhang;
   MDPI Nanomaterials,
   Volume 10, Issue 6, pp. 1189, 2020. DOI: 10.3390/nano10061189

5. High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
   Brahim El Mansouri; Luke M. Middelburg; Rene H. Poelma; GuoQi Zhang; Henk W. van Zeijl; Jia Wei; Hui Jiang; Johan G. Vogel; Willem D. van Driel;
   Microsystems & Nanoengineering,
   Volume 5, 2019.
   document

6. Continuous shock-free termination of atrial fibrillation by local optogenetic therapy and arrhythmia-triggered activation of an implanted light source
   E C A Nyns; R H Poelma; L Volkers; C I Bart; T J Van Brakel; K Zeppenfeld; M J Schalij; GuoQi Zhang; A A F De Vries; D A Pijnappels;
   European Heart Journal,
   Volume 40, Issue 1, 2019. DOI: 10.1093/eurheartj/ehz748.0090

7. An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation
   Emile C. A. Nyns; René H. Poelma; Linda Volkers; Jaap J. Plomp; Cindy I. Bart; Annemarie M. Kip; Thomas J. van Brakel; Katja Zeppenfeld; Martin J. Schalij; GuoQi Zhang; Antoine A. F. de Vries; Daniël A. Pijnappels;
   Science Translational Medicine,
   Volume 11, Issue 481, 2019. DOI: 10.1126/scitranslmed.aau6447

8. Compressive response of pristine and superconductor coated MWCNT pillars
   A. M. Gheytaghi; S. Vollebregt; R.H. Poelma; H. W. Zeijl; GuoQi Zhang;
   In IEEE MEMS,
   2019.

9. Carbon Nanotube Array: Scaffolding Material for Opto, Electro, Thermo, and Mechanical Systems
   Amir M. Gheytaghi; H. van Zeijl; S. Vollebregt; R.H. Poelma; C. Silvestri; R. Ishihara; G. Q. Zhang; P. M. Sarro;
   Innovative Materials,
   Volume 3, pp. 22-25, 2018.

10. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
    Cinzia Silvestri; Michele Riccio; René H. Poelma; Aleksandar Jovic; Bruno Morana; Sten Vollebregt; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
    Small,
    Volume 14, Issue 20, pp. 1800614, 2018. DOI: 10.1002/smll.201800614

11. Designing a 100 [aF/nm] capacitive transducer
    L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; GuoQi Zhang; W. D. van Driel;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

12. Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
    Z. Huang; R.H. Poelma; S. Vollebregt; M.H. Koelink; E. Boschman; R. Kropf; M. Gallouch; GuoQi Zhang;
    In IEEE Electronics System-Integration Technology Conference (ESTC),
    pp. 1-5, 2018.

13. Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
    Middelburg, L. M.; Mansouri, B. E.; Poelma, R.; GuoQi Zhang; Van Zeijl, H.; Wei, J.;
    In Proc. IEEE Sensors,
    2018. DOI: 10.1109/ICSENS.2018.8589630

14. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
    Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
    Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.

15. High aspect ratio spiral resonators for process variation investigation and MEMS applications
    L. Middelburg; B. El Mansouri; H. van Zeijl; GuoQi Zhang; R. H. Poelma;
    In Proc. IEEE Sensors,
    2017.

16. Prognostics \& health management for LED-based applications
    W.D. van Driel; B. Jacobs; D. Schenkelaars; M. Klompenhouwer; R. Poelma; B. El Mansouri; L.M. Middelburg;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

17. Smart Systems Integration in the era of Solid State Lighting
    GuoQi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M.R. Venkatesh; L. Middelburg; B. El Mansouri;
    In Smart System Integration conference (SSI),
    2017.

18. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
    Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
    Nanoscale,
    Volume 8, pp. 8266-8275, 2016.
    document

19. Stretchable Binary Fresnel Lens for Focus Tuning
    Xueming Li; Lei Wei; Ren� H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; GuoQi Zhang;
    Scientific Reports,
    Volume 6, pp. 25348, 2016.

20. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
    R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; GuoQi Zhang;
    Advanced Functional Materials,
    Volume 26, Issue 8, pp. 1233-1242, 2016.

21. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
    Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; GuoQi Zhang;
    In IEEE 66th Electronic Components and Technology Conference (ECTC),
    2016.
    document

22. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
    Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; GuoQi Zhang;
    In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2016.
    document

23. 3D interconnect technology based on low temperature copper nanoparticle sintering
    Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
    In 17th International Conference on Electronic Packaging Technology (ICEPT),
    2016.
    document

24. Multi-scale Material and Technology for Heterogeneous Integration
    Rene Poelma;
    PhD thesis, Delft University of Technology, 2016.

25. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
    R. H. Poelma; GuoQi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
    Springer, 2015.

26. Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
    Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; GuoQi Zhang;
    In Transducers,
    pp. 2041-2044, 2015.

27. Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
    X. J. Fan; R. H. Poelma; L. Chen; GuoQi Zhang;
    In ASME International Mechanical Engineering Congress and Exposition,
    2015.

28. Stiction-Induced Sealing of Surface Micromachined Channels
    B Morana; RH Poelma; G Fiorentino; J Wei; JF Creemer; PM Sarro;
    Journal of Microelectromechanical Systems,
    Volume 23, Issue 2, pp. 459-470, 2014.
    document

29. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
    Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
    Advanced Functional Materials,
    Volume 24, Issue 36, pp. 5737-5744, 2014.
    document

30. Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
    Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; GuoQi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
    Springer, 2014.

31. Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
    H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; GuoQi Zhang;
    In nanoFIS 2014 - Functional Integrated nanoSystems,,
    2014.

32. Through-polymer via (TPV) and method to manufacture such a via
    H.W. van Zeijl; R.H. Poelma; GuoQi Zhang;
    Dutch patent, 2014.

33. Effects of single vacancy defect position on the stability of carbon nanotubes
    R.H. Poelma; H. Sadeghian Marnani; S.W. Koh; G.Q. Zhang;
    Microelectronics Reliability,
    Volume 52, Issue 7, pp. 1279-1284, 2012. harvest Betreft: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011), Linz, Austria.

34. Effects of single vacancy defect position on the stability of carbon nanotubes
    R.H. Poelma; H. Sadeghian; S. Koh; GuoQi Zhang;
    Microelectronics Reliability Journal,
    Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.

35. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    Journal of Applied Physics,
    Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.

36. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
    A. Khiat; R.H. Poelma; GuoQi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
    Microelectronic Engineering,
    Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.

37. The mechanical properties modeling of nano-scale materials by molecular dynamics
    C. Yuan; W.D. Driel; R.H Poelma; GuoQi Zhang;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.

38. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; GuoQi Zhang; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 668-671, Oct 2012.

39. Establishment of the mesoscale parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.

40. A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
    R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; GuoQi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.

41. Buckling analysis of carbon nanotubes and the influence of defect position
    R.H. Poelma; H. Sadeghian; S.W. Koh; GuoQi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.

42. Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

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