MSc Y. Hopf
Electronic Instrumentation (EI), Department of Microelectronics
Expertise: Ultrasound ASICs, SAR Analog to digital converters
Yannick Hopf was born in Seligenstadt, Germany in 1991. He received his B.Sc. and M.Sc. qualification in electrical engineering with specialization in integrated systems from Technische Universität Darmstadt, Germany, in 2014 and 2017 respectively. His performance was honoured with the price for best degree in his year.
Since June 2018, Mr. Hopf is a Ph.D. candidate at the Electronic Instrumentation Laboratory of TU Delft where he works towards enabling 3D intra-cardiac echography from the tip of a catheter. His current research interests include high voltage circuit design and ultrasound ASICs.
3D Intra-Cardiac Echography
In this project, novel transducers, integrated electronics and visualization methods will be developed that will enable real-time 3D ultrasound imaging at the tip of a catheter
- A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes
Y. Hopf; B. Ossenkoppele; M. Soozande; E. Noothout; Z. Y. Chang; C. Chen; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
February 2022. Accepted.
- Feasibility of High Frame Rate 3-D Intracardiac Echography using Fan-Beam Transmissions
M. Soozande; B. Ossenkoppele; Y. Hopf; M. A. P. Pertijs; M. D. Verweij; H. J. Vos; J. G. Bosch; N. de Jong;
In Proc. IEEE International Ultrasonics Symposium (IUS),
IEEE, pp. 1-4, October 2019. (Accepted).
Last updated: 5 Jun 2018