dr. Kim

Postdoc
Electronic Instrumentation (EI), Department of Microelectronics

Expertise: Ultrasound ASICs and data converters

Biography

Taehoon Kim received the B.S., M.S., and Ph.D. degrees in electrical and computer engineering from Seoul National University, Seoul, Korea, in 2009, 2012 and 2017, respectively.
From 2017 to 2018, he was with ASIC & IP development team in Samsung Electronics, Hwasung, Korea. From June 2018, he starts as a postdoc researcher in Electronic Instrumentation Lab, TU Delft. His research interests include front-end electronics for ultrasound medical imaging application.

Ultra-X-treme: Ultrafast Ultrasound Imaging for Extended Diagnosis and Treatment of Vascular Disease

The NWO Perspectief Programme Ultra-X-treme is a 4 Meuro programme in which 5 academic centers and 8 companies collaborate to develop patient-specific ultrasound-based techniques to diagnose and treat vascular disease

  1. Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3-D Carotid Artery Imaging
    T. Kim; F. Fool; D. Simoes dos Santos; Z. Y. Chang; E. Noothout; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
    Sensors,
    Volume 21, Issue 1, pp. 150, January 2021. DOI: 10.3390/s21010150
    Abstract: ... This paper presents an ultrasound transceiver application-specific integrated circuit (ASIC) directly integrated with an array of 12 × 80 piezoelectric transducer elements to enable next-generation ultrasound probes for 3D carotid artery imaging. The ASIC, implemented in a 0.18 µm high-voltage Bipolar-CMOS-DMOS (HV BCD) process, adopted a programmable switch matrix that allowed selected transducer elements in each row to be connected to a transmit and receive channel of an imaging system. This made the probe operate like an electronically translatable linear array, allowing large-aperture matrix arrays to be interfaced with a manageable number of system channels. This paper presents a second-generation ASIC that employed an improved switch design to minimize clock feedthrough and charge-injection effects of high-voltage metal–oxide–semiconductor field-effect transistors (HV MOSFETs), which in the first-generation ASIC caused parasitic transmissions and associated imaging artifacts. The proposed switch controller, implemented with cascaded non-overlapping clock generators, generated control signals with improved timing to mitigate the effects of these non-idealities. Both simulation results and electrical measurements showed a 20 dB reduction of the switching artifacts. In addition, an acoustic pulse-echo measurement successfully demonstrated a 20 dB reduction of imaging artifacts.

    document

  2. Sub-Orbital Flight Demonstration of a 183/540–600 GHz Hybrid CMOS-InP and CMOS-Schottky-MEMS Limb-Sounder
    A. Tang; M. M. Alonso-delPino; Y. Kim; Y. Zhang; T. Reck; C. Jung-Kubiak; D. Nemchick; L. Dyer; G. Virbila; G. Chattopadhyay; M.-C.F. Chang;
    IEEE Journal of Microwaves,
    Volume 1, Issue 2, pp. 560-573, 2021. DOI: 10.1109/JMW.2021.3060622
    document

  3. Experimental Investigation of the Effect of Subdicing on an Ultrasound Matrix Transducer
    D. Simoes dos Santos; F. Fool; T. Kim; E. Noothout; H. J. Vos; J. G. Bosch; M. A. P. Pertijs; M. D. Verweij; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    2021. accepted.

  4. A Scalable Cryo-CMOS Controller for the Wideband Frequency-Multiplexed Control of Spin Qubits and Transmons
    Van Dijk, Jeroen Petrus Gerardus; Patra, Bishnu; Subramanian, Sushil; Xue, Xiao; Samkharadze, Nodar; Corna, Andrea; Jeon, Charles; Sheikh, Farhana; Juarez-Hernandez, Esdras; Esparza, Brando Perez; Rampurawala, Huzaifa; Carlton, Brent R.; Ravikumar, Surej; Nieva, Carlos; Kim, Sungwon; Lee, Hyung-Jin; Sammak, Amir; Scappucci, Giordano; Veldhorst, Menno; Vandersypen, Lieven M. K.; Charbon, Edoardo; Pellerano, Stefano; Babaie, Masoud; Sebasti;
    IEEE Journal of Solid-State Circuits,
    Volume 55, Issue 11, pp. 2930-2946, 2020. DOI: 10.1109/JSSC.2020.3024678

  5. A 12×80 Element Ultrasound Transceiver ASIC With Enhanced Charge Injection Performance for 3-D Carotid Artery Imaging
    T. Kim; F. Fool; E. Kang; Z. Y. Chang; E. Noothout; J. G. Bosch; M. D. Verweij; N. de Jong; M. Pertijs;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2020. abstract.

  6. 3D High Frame Rate Imaging Scheme for Ultrasound Carotid Imaging
    M. Soozande; M. Mozzaffarzadeh; F. Fool; T. Kim; E. Kang; M. Pertijs; M. Verweij; H. J. Vos; J. G. Bosch; N. de Jong;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    September 2020. abstract.

  7. 19.1 A Scalable Cryo-CMOS 2-to-20GHz Digitally Intensive Controller for 4×32 Frequency Multiplexed Spin Qubits/Transmons in 22nm FinFET Technology for Quantum Computers
    Patra, Bishnu; van Dijk, Jeroen P. G.; Subramanian, Sushil; Corna, Andrea; Xue, Xiao; Jeon, Charles; Sheikh, Farhana; Juarez-Hernandez, Esdras; Esparza, Brando Perez; Rampurawala, Huzaifa; Carlton, Brent; Samkharadze, Nodar; Ravikumar, Surej; Nieva, Carlos; Kim, Sungwon; Lee, Hyung-Jin; Sammak, Amir; Scappucci, Giordano; Veldhorst, Menno; Vandersypen, Lieven M. K.; Babaie, Masoud; Sebastiano, Fabio; Charbon, Edoardo; Pellerano, Stefano;
    In 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
    pp. 304-306, 2020. DOI: 10.1109/ISSCC19947.2020.9063109

  8. A 5800 μm2 Resistor-based Temperature Sensor with a one-point Trimmed 3σ Inaccuracy of ±1.1 °C from −50 to 105 °C in 65 nm CMOS
    Y-T Lee; W. Choi; T. Kim; S. Song; K. Makinwa; Y. Chae;
    IEEE Solid-State Circuits Letters,
    Volume 2, pp. 67-70, 10 2019. DOI: 10.1109/LSSC.2019.2937441
    Abstract: ... This letter describes a compact resistor-based temperature sensor intended for the thermal monitoring of microprocessors and DRAMs. It consists of an RC poly phase filter (PPF) that is read out by a frequency-locked loop (FLL) based on a dual zero-crossing (ZC) detection scheme. The sensor, fabricated in 65-nm CMOS, occupies 5800 μm 2 and achieves moderate accuracy [±1.2 °C (3σ)] over a wide temperature range (-50 °C to 105 °C) after a one-point trim. This is 2x better than the previous compact resistor-based sensors. Operating from 0.85 to 1.3-V supplies, it consumes 32.5-μA and achieves 2.8-mK resolution in a 1-ms conversion time, which corresponds to a resolution FoM of 0.26 pJ·K 2.

  9. 3D high frame rate flow measurement using a prototype matrix transducer for carotid imaging
    F. Fool; H. J. Vos; M. Shabanimotlagh; T. Kim; E. Kang; M. Pertijs; N. de Jong; M. D. Verweij;
    In Proc. IEEE International Ultrasonics Symposium (IUS),
    IEEE, pp. 1-4, October 2019. (Accepted).

  10. A 5800 μm2 Resistor-based Temperature Sensor with a one-point Trimmed 3σ Inaccuracy of ±1.1 °C from −50 to 105 °C in 65 nm CMOS
    Y-T Lee; W. Choi; T. Kim; S. Song; K. Makinwa; Y. Chae;
    In Proc. European Solid-State Circuits Conference (ESSCIRC),
    9 2019. DOI: 10.1109/ESSCIRC.2019.8902650

  11. Demonstration of a 180 GHZ Full CMOS Spectrally Dispersed Heterodyne Radiometer with InP Lna for Remote Sensing
    D. J. Nemchick; B. Drouin; A. Tang; Y. Kim; T. J. Reck; M. Alonso-delPino; G. Chattopadhyay; Y. Zhang; M.C. Frank Chang;
    In 74th International Symposium on Molecular Spectroscopy,
    June 17-21 2019.

  12. A Compact Resistor-Based CMOS Temperature Sensor With an Inaccuracy of 0.12 °C (3σ) and a Resolution FoM of 0.43 pJ⋅K^2 in 65-nm CMOS
    W. Choi; Y. Lee; S. Kim; S. Lee; J. Jang; J. Chun; K. A. A. Makinwa; Y. Chae;
    IEEE Journal of Solid-State Circuits,
    Volume 53, Issue 12, pp. 3356-3367, 12 2018. DOI: 10.1109/JSSC.2018.2871622
    Abstract: ... This paper presents a compact resistor-based CMOS temperature sensor intended for dense thermal monitoring. It is based on an RC poly-phase filter (PPF), whose temperature-dependent phase shift is read out by a frequency-locked loop (FLL). The PPF's phase shift is determined by a zero-crossing (ZC) detector, allowing the rest of the FLL to be realized in an area-efficient manner. Implemented in a 65-nm CMOS technology, the sensor occupies only 7000 μm². It can operate from supply voltages as low as 0.85 V and consumes 68 μW. A sensor based on a PPF made from silicided p-poly resistors and metal-insulator-metal (MIM) capacitors achieves an inaccuracy of ±0.12 °C (3σ) from -40 °C to 85 °C and a resolution of 2.5 mK (rms) in a 1-ms conversion time. This corresponds to a resolution figure-of-merit (FoM) of 0.43 pJ·K².

  13. A Ku-Band CMOS FMCW Radar Transceiver for Snowpack Remote Sensing
    Y. Kim; T.J. Reck; M. Alonso-delPino; T.H. Painter; H.P. Marshall; E.H. Bair; J. Dozier; G. Chattopadhyay; K.N. Liou; M.C.F. Chang; A. Tang;
    IEEE Transactions on Microwave Theory and Techniques,
    Volume 66, Issue 5, pp. 2480-2494, May 2018.
    document

  14. A 0.53pJK2 7000μm2 resistor-based temperature sensor with an inaccuracy of ±0.35°C (3σ) in 65nm CMOS
    W. Choi; Y.T. Lee; S. Kim; S. Lee; J. Jang; J. Chun; K.A.A. Makinwa; Y. Chae;
    In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
    pp. 322-324, 2 2018. DOI: 10.1109/ISSCC.2018.8310314

  15. A 0.02mm2 Embedded Temperature Sensor with ±2°C Inaccuracy for Self-Refresh Control in 25nm Mobile DRAM
    Y.Y. Kim; W. Choi; J. Kim; S. Lee; S Lee; H. Kim; K.A.A. Makinwa; Y. Chae; TW Kim;
    In W Pribyl; F Dielacher; G Hueber (Ed.), Proc. European Solid-State Circuits Conference (ESSCIRC),
    IEEE, pp. 267-270, 2015.

  16. A 60nV/Hz 15-channel digital active electrode system for portable biopotential signal acquisition
    J. Xu; B. Busze; H. Kim; K.A.A. Makinwa; C. van Hoof; R.F. Yazicioglu;
    In LC Fujino; J Anderson; D Dunwell; V Gaudet; G Gulak; J Haslett; S Mirabbasi; K Pagiamtzis; KC. Smith (Ed.), Digest of Technical papers - 2014 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 424-425, 2014. Harvest Session 24. Integrated Biomedical Systems 24.7.

  17. Hybrid Polymer Microlens Arrays with High Numerical Apertures Fabricated Using Simple Ink-Jet Printing Technique
    J.Y. Kim; N.B. Brauer; V. Fakhfouri; D.L. Boiko andE. Charbon; G. Grutzner; J. Brugger;
    OSA Optical Materials Express,
    Volume 1, Issue 2, pp. 259-269, May 2011.
    document

  18. On the Mechanisms Governing Aluminum-Mediated Solid-Phase Epitaxy of Silicon
    Y. Civale; G. Vastola; L.K. Nanver; R. Mary-Joy; J.R. Kim;
    Journal of electronic materials,
    Volume 38, Issue 10, pp. 2052-2062, 2009.

  19. Smart CMOS image sensor with high SBR and subpixel resolution for light-selection-based range finding
    J. Cheon; Y. Chae; D. Kim; S. Lim; I. Lee; K. Lee; D.J. Kim; G. Han;
    IEEE Electron Device Letters,
    Volume 56, Issue 11, pp. 2546-2555, 2009.

  20. A low-distortion, low-loss varactor phase-shifter based on a silicon-on-glass technology
    Kim, S.; Qureshi, J.H.; Buisman, K.; Larson, L.E.; de Vreede, L.C.N.;
    In 2008 IEEE Radio Frequency Integrated Circuits Symposium,
    pp. 175-178, 2008. DOI: 10.1109/RFIC.2008.4561412

  21. A Low-Loss Compact Linear Varactor Based Phase-Shifter
    J. H. Qureshi; S. Kim; K. Buisman; C. Huang; M. J. Pelk; A. Akhnoukh; L. E. Larson; L. K. Nanver; L. C. N. de Vreede;
    In Proc. IEEE RFIC (Radio Frequency Integrated Circuits) Symposium,
    Honolulu, Hawaii,USA, pp. 453-456, Jun. 2007.

  22. Field emission as transducer for sub-micron and nano resonators
    C.K. Yang; P.J. French; EW.J.M. van der Drift; J.R. Kim; P. Hadley;
    In S. Lee; M Esashi (Ed.), Proceedings of the 5th IEEE Conference on Sensors 2006,
    IEEE, pp. 1207-1210, 2007.

  23. A Low-Loss Compact Linear Varactor Based Phase-Shifter
    Qureshi, J.H.; Kim, S.; Buisman, K.; Huang, C.; Pelk, M. J.; Akhnoukh, A.; Larson, L.E.; Nanver, L. K.; de Vreede, L.C.N.;
    In 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium,
    pp. 453-456, 2007. DOI: 10.1109/RFIC.2007.380922

  24. Photoelectric device using PN diode and silicon integrated circuits (IC) comprising the smae photoelectric device
    B. Mheen; J. U-park; G. Ok Kim; Y. An im; H. Su kim;
    2007.

  25. Optical device including gate insulator with modulated thickness
    H. Su kim; B. Mheen; G. Ok Kim;
    2007.

  26. Characteristics of AlN/Ni(111) heterostructures and their application to epitaxial growth of GaN
    T.W. Kim; N. Matsuki; J. Ohta; H. Fujioka;
    Jpn. J. Appl. Phys,
    Volume 45, Issue 14, pp. L396-L398, Mar. 2006.

  27. Epitaxial growth of AlN on Cu(111) substrates using pulsed laser deposition
    S. Inoue; K. Okamoto; N. Matsuki; T.W. Kim; H. Fujioka;
    J. Cryst. Growth,
    Volume 289, Issue 2, pp. 574-577, Apr. 2006.

  28. Epitaxial growth of AlN on single-crystal Ni(111) substrates
    T.W. Kim; N. Matsuki���; J. Ohta; H. Fujioka;
    Appl. Phys. Lett,
    Volume 88, Issue 12, Mar. 2006.

  29. Characteristics of single-crystal AlN films grown on ferromagnetic metal substrates
    K. Okamoto; S. Inoue; N. Matsuki; T.-W. Kim; H. Fujioka; M. Oshima;
    Phys. Stat. Sol. (a),
    Volume 202, Issue 14, pp. R149-R151, Nov. 2005.

  30. Heteroepitaxitial growth of gallium nitride on muscovite mica plates by pulsed laser depo
    N. Matsuki; T.-W. Kim; J. Ohta; H. Fujioka;
    Solid State Commun,
    Volume 136, Issue 6, pp. 338-341, Nov. 2005.

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Last updated: 5 Jan 2022

Taehoon Kim

Alumnus
  • Left in 2021

MSc students