MSc Ibrahim

PhD student
Electronic Circuits and Architectures (ELCA), Department of Microelectronics

Themes: XG - Next Generation Sensing and Communication

Biography

Tariq Ibrahim, born in 1996, is from Cairo, Egypt. He received his B.Sc. degree with distinction in Electrical Engineering from Ain Shams University, Egypt, in 2019. He then worked for a year as an RFIC designer at GOODIX in Cairo, Egypt, until September 2020. He received his MSc degree (cum laude) in Electrical Engineering in the Microelectronics track from Delft University of Technology, the Netherlands, in 2022.

He is currently pursuing his Ph.D. degree with the ELCA group at Delft University of Technology, the Netherlands. His broad research interests span radio-frequency (RF) integrated circuitry with a special focus on efficient linearization techniques for digital transmitters (DTX).

Publications

  1. System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K.C. Yung; Zhou Jing; Xuejun Fan; Willem van Driel; Guoqi Zhang;
    Measurement,
    Volume 176, pp. 109191, 2021. DOI: 10.1016/j.measurement.2021.109191
    document

  2. Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K. C. Yung; Alexandru Prisacaru; Willem D. van Driel; Xuejun Fan; GuoQi Zhang;
    Laser and Photonics Reviews,
    Volume 14, Issue 12, Dec 2020. DOI: 10.1002/lpor.202000254
    document

  3. Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network
    Zhou Jing; Jie Liu; Mesfin Seid Ibrahim; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 41, Issue 12, pp. 1817-1820, 2020. DOI: 10.1109/LED.2020.3034567

  4. Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process
    Jing, Z.; Ibrahim, M. S.; Fan, J.; Fan, X.; GuoQi Zhang;
    In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE,
    2019. DOI: 10.1109/EuroSimE.2019.8724571

BibTeX support

Last updated: 10 Oct 2022

Tariq Ibrahim