MSc Hong Wah Chan

1. Ultra-thin corrugated metamaterial film as large-area transmission dynode
   H.W. Chan; V. Prodanović; A.M.M.G. Theulings; T. ten Bruggencate; C.W. Hagen; P.M. Sarro; H. v.d. Graaf;
   Journal of Instrumentation,
   Volume 17, pp. P09027, 2022. DOI: 10.1088/1748-0221/17/09/P09027

2. A 2D Ultrasound Transducer with Front-End ASIC and Low Cable Count for 3D Forward-Looking Intravascular Imaging: Performance and Characterization
   J. Janjic; M. Tan; E. Noothout; C. Chen; Z. Chan; Z. Y. Chang; R. H. S. H. Beurskens; G. van Soest; A. F. W. van der Steen; M. D. Verweij; M. A. P. Pertijs; N. de Jong;
   IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control,
   Volume 65, Issue 10, pp. 1832--1844, October 2018. Featured Cover Article. DOI: 10.1109/TUFFC.2018.2859824
   
   Abstract: ...

   Intravascular ultrasound is an imaging modality used to visualize atherosclerosis from within the inner lumen of human arteries. Complex lesions like chronic total occlusions require forward-looking intravascular ultrasound (FL-IVUS), instead of the conventional side-looking geometry. Volumetric imaging can be achieved with 2D array transducers, which present major challenges in reducing cable count and device integration. In this work we present an 80-element lead zirconium titanate (PZT) matrix ultrasound transducer for FL-IVUS imaging with a front-end application-specific integrated circuit (ASIC) requiring only 4 cables. After investigating optimal transducer designs we fabricated the matrix transducer consisting of 16 transmit (TX) and 64 receive (RX) elements arranged on top of an ASIC having an outer diameter of 1.5 mm and a central hole of 0.5 mm for a guidewire. We modeled the transducer using finite element analysis and compared the simulation results to the values obtained through acoustic measurements. The TX elements showed uniform behavior with a center frequency of 14 MHz, a -3 dB bandwidth of 44 % and a transmit sensitivity of 0.4 kPa/V at 6 mm. The RX elements showed center frequency and bandwidth similar to the TX elements, with an estimated receive sensitivity of 3.7 μV/Pa. We successfully acquired a 3D FL image of three spherical reflectors in water using delay-and-sum beamforming and the coherence factor method. Full synthetic aperture acquisition can be achieved with frame rates on the order of 100 Hz. The acoustic characterization and the initial imaging results show the potential of the proposed transducer to achieve 3D FL-IVUS imaging.

3. Effect of thermal annealing and chemical treatments on secondary electron emission properties of atomic layer deposited MgO
   Violeta Prodanovic; Hong Wah Chan; Anil U. Mane; Jeffrey W. Elam; Matthias M. Minjauw; Christophe Detavernier; Harry van der Graaf; Pasqualina M. Sarro;
   Journal of Vacuum Science and Technology A,
   Volume 36, Issue 6, pp. 06A102-1-9, 2018.
   document

4. Ultra-thin Alumina and Silicon Nitride MEMS Fabricated Membranes for the Electron Multiplication
   Violeta Prodanović; Hong Wah Chan; W A van der Graaf; Lina Sarro;
   Nanotechnology,
   Volume 29, pp. 155703, 2018.
   document

5. Ultra-thin ALD MGO membranes as mems transmission dynodes in a timed photon counter
   Violeta Prodanovic; Hong Wah Chan; Anil U Mane; Jeffrey W Elam; Harry VD Graaf; Pasqualina M Sarro;
   In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
   pp. 740-743, 2017.

6. Potential applications of electron emission membranes in medicine
   Yevgen Bilevych; Stefan E. Brunner; Hong Wah Chan; Edoardo Charbon; Harry van der Graaf; Cornelis W. Hagen; Gert Nützelf; Serge D. Pintof; Violeta Prodanović; Daan Rotman; Fabio Santagata; Lina Sarro; Dennis R. Schaar;
   Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment,
   Volume 809, pp. 171-174, 2016.

7. The Tynode: A new vacuum electron multiplier
   Harry van der Graaf; Hassan Akhtar; Neil Budko; Hong Wah Chan; Cornelis W. Hagen; Conny C.T. Hansson; Gert Nützel; Serge D. Pinto; Violeta Prodanović; Behrouz Raftari; Pasqualina M. Sarro; John Sinsheimer; John Smedle;
   Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment,
   2016.
   document

8. Optimization of Silicon-rich Silicon Nitride Films for Electron Multiplication in Timed Photon Counters
   V. Prodanovic; H.W. Chan; J. Smedley; A. Theulings; S. Tao; H.v.d. Graaf; P.M. Sarro;
   In Procedia Engineering 120: EUROSENSORS 2015,
   pp. 1111-1114, 2015.

9. The Tipsy Single Soft Photon Detector and the Trixy Ultrafast Tracking Detector
   H. van der Graaf; M.A. Bakker; H.W. Chan; E. Charbon; F. Santagata; P.M. Sarro; D.R. Schaart;
   IOP Journal of Instrumentation,
   Volume 8, Issue 1, pp. C01036, January 2013.
   document

10. Silicon VLSI catches the millimeter wave
    J. R. Long; W. L. Chan; Y. Zhao; M. Spirito;
    IEEE Communications Magazine,
    Volume 49, Issue 10, pp. 182-189, Oct 2011.

11. A 60GHz-band 2 #x00D7;2 phased-array transmitter in 65nm CMOS
    W. L. Chan; J. R. Long; M. Spirito; J. J. Pekarik;
    In 2010 IEEE International Solid-State Circuits Conference - (ISSCC),
    pp. 42-43, Feb 2010.

12. A 60GHz-band 1V 11.5dBm power amplifier with 11% PAE in 65nm CMOS
    W. L. Chan; J. R. Long; M. Spirito; J. J. Pekarik;
    In 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers,
    pp. 380-381,381a, Feb 2009.

13. Activities in ace wp 2.3-1 on wideband and multiband radiators
    M Bonnedal; E Angelopoulos; E Antonio; P Balling; K Chan; R Erickson; IE Lager; W Sorgel; E Ubeda; A Yarovoy;
    H Lacoste; L Ouwehand (Ed.);
    ESA, , pp. 1--6, 2006.

14. Study on thermal interface material with carbon nanotubes and carbon black in high-brightness LED packaging with flip-chip technology
    K. Zhang; G. W. Xiao; C. K. Y. Wong; H. W. Gu; M. M. F. Yuen; P. C. H. Chan; B. Xu;
    In Proceedings-Electronic Components and Technology Conference,
    Lake Buena Vista, FL, pp. 60-65, 2005.

15. Monolithic Spiral Inductors fabricated using a VLSI Cu-Damascene Interconnect Technology and Low-Loss Substrates
    J.N. Burghartz; D.C. Edelstein; K.A. Jenkins; C. Jahnes; C. Uzoh; E.J. O Sullivan; K.K. Chan; M. Soyuer; P. Roper; S. Cordes;
    In IEEE International Electron Devices Meeting (IEDM),
    pp. 99-102, 1996.

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