dr. Jing Zhang

1. Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
   Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

2. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
   Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
   In 13th China International Forum on Solid State Lighting (SSLChina),
   2016.
   document

3. Fast Qualification of Solder Reliability in Solid-state Lightning System
   Jing Zhang;
   PhD thesis, Delft University of Technology, 2015.
   document

BibTeX support