dr. Pan Liu

1. Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
   Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

2. Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration
   Pan Liu; Jian Li; Henk van Zeijl; GuoQi Zhang;
   In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
   United States, IEEE, pp. 817--823, 06 2020. DOI: 10.1109/ECTC32862.2020.00133

3. Multi-functional LED Module Integration and Miniaturization for Solid State Lighting Applications
   Pan Liu;
   PhD thesis, Delft University of Technology, 2019.
   document

4. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
   R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; GuoQi Zhang;
   Journal of Micromechanics and Microengineering,
   Volume 25, Issue 5, pp. 055017, 2015.

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