dr. V.A. Henneken

1. A 2000-volumes/s 3-D Ultrasound Probe With Monolithically-Integrated 23 $\times$ 23-mm2 4096-Element CMUT Array
   Rozsa, Nuriel N. M.; Chen, Zhao; Kim, Taehoon; Guo, Peng; Hopf, Yannick M.; Voorneveld, Jason; dos Santos, Djalma Simoes; Noothout, Emile; Chang, Zu-Yao; Chen, Chao; Henneken, Vincent A.; de Jong, Nico; Vos, Hendrik J.; Bosch, Johan G.; Verweij, Martin D.; Pertijs, Michiel A. P.;
   IEEE Journal of Solid-State Circuits,
   pp. 1--14, 2025. early access. DOI: 10.1109/JSSC.2025.3534087
   
   Abstract: ...

   This article presents a 4096-element ultrasound probe for high volume-rate (HVR) cardiovascular imaging. The probe consists of two application-specific integrated circuits (ASICs), each of which interfaces with a 2048-element monolithically-integrated capacitive micro-machined ultrasound transducer (CMUT) array. The probe can image a 60∘ × 60∘ × 10-cm volume at 2000 volumes/s, the highest volume-rate with in-probe channel-count reduction reported to date. It uses 2 × 2 delay-and-sum micro-beamforming (μBF) and 2× time-division multiplexing (TDM) to achieve an 8× receive (RX) channel-count reduction. Equalization, trained using a pseudorandom bit-sequence generated on the chip, reduces TDM-induced crosstalk by 10 dB, enabling power-efficient scaling of the cable drivers. The ASICs also implement a novel transmit (TX) beamformer (BF) that operates as a programmable digital pipeline, which enables steering of arbitrary pulse-density modulated (PDM) waveforms. The TX BF drives element-level 65 V unipolar pulsers, which in turn drive the CMUT array. Both the TX BF and RX μBF are programmed with shift-registers (SRs) that can either be programmed in a row-column fashion for fast upload times, or daisy-chain fashion for a higher flexibility. The layout of the ASICs is matched to the 365-μm-pitch monolithically-integrated CMUT array. While operating, the RX and logic power consumption per element is 0.85 and 0.10 mW, respectively. TX power consumption is highly waveform dependent, but is nominally 0.34 mW. Compared to the prior art, the probe has the highest volume rate, and features among the largest imaging arrays (both in terms of element-count and aperture) with a high flexibility in defining the TX waveform. These properties make it a suitable option for applications requiring HVR imaging of a large region of interest.

2. A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7x23.4mm² 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer
   Nuriel M. Rozsa; Zhao Chen; Taehoon Kim; Peng Guo; Yannick Hopf; Jason Voorneveld; Djalma Simoes dos Santos; Emile Noothout; Zu-Yao Chang; Chao Chen; Vincent A. Henneken; Nico de Jong; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Michiel A. P. Pertijs;
   In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
   IEEE, pp. 1--2, June 2024. DOI: 10.1109/VLSITechnologyandCir46783.2024.10631363

3. A 3D Ultrasound Probe with Monolithically-Integrated 4096-Element CMUT Array Imaging 60° x 60° x 10cm at 2000 Volumes/s
   Nuriel N. M. Rozsa; Zhao Chen; Taehoon Kim; Peng Guo; Yannick Hopf; Jason Voorneveld; Djalma Simoes dos Santos; Emile Noothout; Zu-Yao Chang; Chao Chen; Vincent A. Henneken; Nico de Jong; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Michiel A. P. Pertijs;
   In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
   July 2024.

4. A 3D Ultrasound Probe with Monolithically-Integrated 4096-Element CMUT Array Imaging 60° x 60° x 10cm at 2000 Volumes/s
   Nuriel N. M. Rozsa; Zhao Chen; Taehoon Kim; Peng Guo; Yannick Hopf; Jason Voorneveld; Djalma Simoes dos Santos; Emile Noothout; Zu-Yao Chang; Chao Chen; Vincent A. Henneken; Nico de Jong; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Michiel A. P. Pertijs;
   In Proc. IEEE International Ultrasonics Symposium (IUS),
   IEEE, September 2024. abstract, Best Student Paper Award.

5. 25.8 Gb/s Submillimeter Optical Data Link Module for Smart Catheters
   Jian Li; Chenhui Li; Vincent Henneken; Marcus Louwerse; Jeannet Van Rens; Paul Dijkstra; Oded Raz; Ronald Dekker;
   Journal of Lightwave Technology,
   Volume 40, Issue 8, pp. 2456-2464, 2022. DOI: 10.1109/JLT.2021.3137981

6. Embedded High-Density Trench Capacitors for Smart Catheters
   Jian Li; Jeroen Naaborg; Marcus Louwerse; Vincent Henneken; Carlo Eugeni; Ronald Dekker;
   In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
   pp. 1-5, Sep. 2020. DOI: 10.1109/ESTC48849.2020.9229800

7. Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
   S. Kawasaki; V. Giagka; M. de Haas; M. Louwerse; V. Henneken; C. van Heesch; R. Dekker;
   In Proc. IEEE Conf. on Neural Eng. (NER) 2019,
   San Francisco, CA, USA, March 2019.
   
   Abstract: ...

   Vagus nerve stimulators currently on the market can treat epilepsy and depression. Recent clinical trials show the potential for vagus nerve stimulation (VNS) to treat epilepsy, autoimmune disease, and traumatic brain injury. As we explore the benefits of VNS, it is expected that more possibilities for a new treatment will emerge in the future. However, existing VNS relies on electrical stimulation, whose limited selectivity (due to its poor spatial resolution) does not allow for any control over which therapeutic effect to induce. We hypothesize that by localizing the stimulation to fascicular level within the vagus nerve with focused ultrasound (US), it is possible to induce selective therapeutic effects with less side effects. A geometrically curve US transducer array that is small enough to wrap around the vagus nerve was fabricated. An experiment was conducted in water, with 48 US elements curved in a 1 mm radius and excited at 15 MHz to test the focusing capabilities of the device. The results show that the geometrical curvature focused the US to an area with a width and height of 110 μm and 550 μm. This will be equivalent to only 2.1% of the cross section of the vagus nerve, showing the potential of focused US to stimulate individual neuronal fibers within the vagus nerve selectively.
   
   document

8. Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
   Kawasaki, S.; Giagka, V.; de Haas, M.; Louwerse, M.; Henneken, V.; van Heesch, C.; Dekker, R.;
   In 9th International IEEE/EMBS Conference on Neural Engineering. IEEE,
   2019. DOI: 10.1109/NER.2019.8717064

9. Generic platform for the miniaturization of bioelectronic implants
   M. M. Kluba; J. W. Weekamp; M. Louwerse; V. Henneken; R. Dekker;
   In Design of Medical Devices Conference (DMD Europe),
   2017.

10. High Definition Flex-to-Rigid (HD F2R): an Interconnect Substrate Technology
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In ICT.OPEN,
    2016.

11. Intravascular Ultrasound at the Tip of a Guidewire: Concept and First Assembly Steps
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1563-1567, 2016.

12. Flexible/Stretchable Ultrasound Body Patches
    Shivani Joshi; Sourush Yazdi; Vincent Henneken; Rene Sanders; Ronald Dekker;
    In ICT.OPEN Conference,
    2016.

13. Origami assembly platform for smart medical instruments
    R. Stoute; M. C. Louwerse; V. A. Henneken; R. Dekker;
    In 28th Conference of the international Society for Medical Innovation and Technology (iSMIT) / 4th Design of Medical Devices Conference,
    2016.
    document

14. Conformable Body Patches for Ultrasound Applications
    S. Joshi; S. Yazadi; V. Henneken; R. Sanders; R. Dekker;
    In 17th IEEE Electronics Packaging Technology Conference,
    2015.

15. Miniaturized Optical Data Link Assembly for 360 �m Guidewires
    Stoute, Ronald; Louwerse, Marcus C.; van Rens, Jeannet; Henneken, Vincent A.; Dekker, Ronald;
    In ICT.OPEN Conference,
    pp. 46-51, 2015.
    document

16. A post processing approach for manufacturing high-density stretchable sensor arrays
    A. Savov; S. Khoshfetrat Pakazad; S. Joshi; V. Henneken; R. Dekker;
    In IEEE Sensors,
    pp. 1703-1705, 2014.

17. Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures,
    Volume 31, Issue 2, pp. 021201-021201-6, Mar. 2013. DOI 10.1116/1.4788795.

18. Flex-to-Rigid (F2R): A Generic Platform for the Fabrication and Assembly of Flexible Sensors for Minimally Invasive Instruments
    Benjamin Mimoun; Vincent Henneken; Arjen van der Horst; Ronald Dekker;
    IEEE Sensors Journal,
    Volume 13, Issue 10, 2013. DOI: 10.1109/JSEN.2013.2252613

19. Ultra-flexible devices for 360 _m diameter guidewires
    B. Mimoun; V. Henneken; P.M. Sarro; R. Dekker;
    In 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2012),
    Paris, France, IEEE, pp. 472-475, Jan. 2012. ISBN: 978-978-1-4673-0325-5, DOI 10.1109/MEMSYS.2012.6170227.

20. Living chips and Chips for the living
    R. Dekker; S. Braam; V. Henneken; A. van der Horst; S. Khoshfetrat Pakazad; M. Louwerse; B. van Meer; B. Mimoun; A. Savov; A. van de Stolpe;
    In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2012),
    Portland, Oregon, USA, pp. 1-9, Sep. 2012. DOI 10.1109/BCTM.2012.6352653.

21. Residue-free plasma etching of polyimide coatings
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    In International Conference on Electronics Packaging 2012 (ICEP),
    Tokyo, Japan, pp. 265-269, Apr. 2012.

22. Ultra-flexible devices for smart invasive medical instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

23. Flex-to-Rigid (F2R): A Novel Ultra-Flexible Technology for Smart Invasive Medical Instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In Stretchable Electronics and Conformal Biointerfaces,
    Mater. Res. Soc. Symp. Proc. Volume 1271E, 2010.

24. Release and Mounting of Partially Flexible Devices Inside and Around Tubes for Smart Invasive Medical Applications
    B. Mimoun; V. Henneken; R. Dekker;
    In Proc. of 12th Electronic Packaging and Technology Conference 2010 (EPTC 2010),
    Singapore, IEEE, pp. 7-12, 2010. ISBN 978-1-4244-8561-1.

25. In-package MEMS-based thermal actuators for micro-assembly
    V. Henneken; M. Tichem; P.M.Sarro;
    J. Micromech and Microeng.,
    Volume 16, Issue 6, pp. 107-115, 2006.

26. In-package MEMS-based thermal actuators for micro-assembly
    V.A. Henneken; M. Tichem; P.M. Sarro;
    J. Micromech. Microeng.,
    Volume 16, pp. S107-S115, 2006.

27. Improved thermal U-beam actuators for micro-assembly
    V. Henneken; M. Tichem; P.M. Sarro;
    In P.Enoksson (Ed.), Proc. Eurosensors XX,
    Goteborg, Sweden, Sept. 2006.
    document

28. In-package MEMS-based thermal actuators for micro-assembly
    V. Henneken; M. Tichem; P.M. Sarro;
    In Proc. MME,
    2005.

29. Design of in-package MST-based actuators for micro-assembly
    V. Henneken; S. van der Bedem; M. Tichem; B. Karpuschewski; P.M. Sarro;
    In Proc SAFE & Prorisc 2004,
    Veldhoven, pp. 747-752, Nov. 2004. ISBN 90-73461-43X.

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