Department of Microelectronics
Faculty of Electrical Engineering, Mathematics, and Computer Science

MSc R. Sattari

Technician
Electronic Circuits and Architectures (ELCA), Department of Microelectronics

Expertise: Sensor and IC Design, Packaging Reliability, Electronic Components, Process Integration, IC Fabrication

Biography

Romina was born in Tehran, Iran, in 1993. She received her B.Sc. and M.Sc. degrees in Electrical Engineering from Sharif University of Technology, Tehran, Iran, in 2015 and 2017, respectively, with her M.Sc. thesis focusing on Indoor Positioning Systems.

In 2019, she joined the Electronic Components, Technology, and Materials (ECTM) group at TU Delft as a Ph.D. candidate. Her research focused on multi-domain reliability monitoring of semiconductor packages and modules, during which she designed and fabricated in-package sensors and chips for characterization and qualification of materials and semiconductor packages. She is scheduled to defend her Ph.D. on April 10, 2025.

Currently, Romina is an IC Design Support Specialist in the Microelectronics Department at TU Delft. In this role, she coordinates TSMC tapeouts in 40nm technology as a Cadence support specialist and contributes to PCB assembly, wire bonding, and laboratory operations.

Publications

  1. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
    R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

  2. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100771

  3. A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  4. In-situ reliability monitoring of power packages using a Thermal Test Chip
    H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
    In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2022. DOI: 10.1109/EuroSimE54907.2022.9758913

  5. Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
    R. Sattari; H. van Zeijl; GuoQi Zhang;
    In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
    2021. DOI: 10.23919/EMPC53418.2021.9584984

BibTeX support

Last updated: 14 Jan 2025

Romina Sattari