MSc Lai Wei

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Themes: XG - Next Generation Sensing and Communication

Biography

Lai completed his Bachelor's degree in Applied Physics from Central South University in Changsha, China in 2021. Then he earned a Master's degree in Applied Physics from the faculty of Applied Science, Delft University of Technology (2023). His master thesis project is focused on Optics Metrology by developing new simulating and calculating methods to boost the sensitivity of Coherent Fourier Scatterometry, which was done in the Optics Research Group at TU Delft.

In August 2024, Lai joined TU Delft as a PhD candidate in the Electronics Components Technology and Materials (ECTM) group in the Department of Microelectronics. Currently he is working on advanced packaging of Photonics Integrated Circuits (PIC), cooperated with CITC (Chip Integration Technology Center), to develop the next generation packaging technology for Silicon Photonics chips.

Last updated: 28 Aug 2024