Rik Bokhorst
Rik Bokhorst graduated at the Section Terahertz Sensing (THZ) in September 2022. His/her next position was at Electrical Engineer at Global Factories (Netherlands).
MSc thesis: MMIC packaging using Flip-Chip technology at G band
Advisor(s): Nuria Llombart, Maria Alonso-delPino
Program: MSc Wireless Communication and Sensing
