Thermal management in 3d heterogeneous integration (ThermMan3D)
In recent years, an increasing interest in the thermal properties of materials, and nanomaterials in particular, has been recorded not only in fundamental science, but also for practical needs. This is due to fact that heat removal has become a significant bottleneck in the electronic industry breakthrough and three-dimensional (3D) electronic in particular. The objective of my research work is to explore novel thermal management solutions, based carbon related materials, in particular Carbon Nanotubes (CNTs) , to be integrated on a 3D wafer-level packaging.
For more information, see the project homepage.