Department of Microelectronics
Faculty of Electrical Engineering, Mathematics, and Computer Science

Jiajie Fan

Publications

  1. Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
    Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
    Journal of the Mechanics and Physics of Solids,
    Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257

  2. Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
    Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
    Journal of the Mechanics and Physics of Solids,
    Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256

  3. Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
    Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066

  4. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
    Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100810

  5. Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating
    Zhuorui Tang; Jing Tian; Chaobin Mao; Nan Zhang; Jiyu Huang; Jiajie Fan; Guoqi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100813

  6. Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
    Minzhen Wen; Baotong Guo; Shanghuan Chen; Xiao Hu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100750

  7. Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
    Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  8. Thermal-Mechanical-Electrical Co-Design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-Objective Optimization Algorithm
    Wei Chen; Xuyang Yan; Jiajie Fan; Mesfin S. Ibrahim; Jing Jiang; Xuejun Fan; Guoqi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  9. Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
    Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
    Journal of Physics: Condensed Matter,
    Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f

  10. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
    Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    Corrosion Science,
    pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

  11. Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network
    Qian, Yichen; Hou, Fengze; Fan, Jiajie; Lv, Quanya; Fan, Xuejun; Zhang, Guoqi;
    IEEE Transactions on Electron Devices,
    Volume 68, Issue 7, pp. 3460-3467, 2021. DOI: 10.1109/TED.2021.3077209

  12. System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K.C. Yung; Zhou Jing; Xuejun Fan; Willem van Driel; Guoqi Zhang;
    Measurement,
    Volume 176, pp. 109191, 2021. DOI: 10.1016/j.measurement.2021.109191
    document

  13. Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model
    Fan, Jiajie; Gu, Tijian; Wang, Ping; Cai, Wei; Fan, Xuejun; Zhang, Guoqi;
    In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    pp. 1-4, 2021. DOI: 10.1109/EuroSimE52062.2021.9410807

  14. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
    Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; GuoQi Zhang;
    IEEE Transactions on Power Electronics,
    Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117

  15. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
    Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
    Applied Surface Science,
    2020. DOI: 10.1016/j.apsusc.2020.145251

  16. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

  17. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model
    Jiajie Fan; Wei Chen; Weiyi Yuan; Xuejun Fan; Guoqi Zhang;
    Opt. Express,
    Volume 28, Issue 9, pp. 13921--13937, Apr 2020. DOI: 10.1364/OE.387660
    document

  18. Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging
    Jiajie Fan; D. Xu; H. Zhang; C. Qian; X. Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 10, Issue 7, pp. 1101-1109, July 2020. DOI: 10.1109/TCPMT.2020.2995634

  19. Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K. C. Yung; Alexandru Prisacaru; Willem D. van Driel; Xuejun Fan; GuoQi Zhang;
    Laser and Photonics Reviews,
    Volume 14, Issue 12, Dec 2020. DOI: 10.1002/lpor.202000254
    document

  20. Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode
    Jiajie Fan; Yutong Li; Irena Fryc; Cheng Qian; Xuejun Fan; GuoQi Zhang;
    IEEE Photonics Journal,
    Volume 12, Issue 1, pp. 1-18, Feb 2020. DOI: 10.1109/JPHOT.2019.2962818

  21. Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network
    Zhou Jing; Jie Liu; Mesfin Seid Ibrahim; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 41, Issue 12, pp. 1817-1820, 2020. DOI: 10.1109/LED.2020.3034567

  22. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
    Jiajie Fan; Ling Zhou; Zhen Cui; Shanghuan Chen; Xuejun Fan; GuoQi Zhang;
    Journal of Luminescence,
    Volume 219, pp. 116874, 2019. DOI: 10.1016/j.jlumin.2019.116874
    document

  23. A Reliability Prediction Methodology for LED Arrays
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang; Guohao Zhang;
    IEEE Access,
    Volume 7, pp. 8127-8134, 2019.

  24. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    2019. DOI: 10.1109/TCPMT.2018.2884032

  25. Thermal Management on IGBT Power Electronic Devices and Modules
    Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; GuoQi Zhang;
    IEEE Access,
    Volume 6, pp. 12868-12884, 2018.

  26. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
    Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 84, pp. 140-148, 2018.

  27. A new hermetic sealing method for ceramic package using nanosilver sintering technology
    Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 143-149, 2018.

  28. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
    Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 8, Issue 7, pp. 1254-1262, 2018.

  29. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  30. Color shift acceleration on mid-power LED packages
    Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
    Keywords: ... Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

  31. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires
    G Lu; van Driel, WD; Xuejun Fan; Yazdan Mehr, M; Jiajie Fan; Cheng Qian; KMB Jansen; GQ Zhang;
    Optical Materials,
    Volume 54, pp. 282--287, 2016. harvest. DOI: 10.1016/j.optmat.2016.02.023
    Keywords: ... Colour shift, PMMA, Solid state lighting, LED-based luminaire, Infrared absorption spectroscopy.

  32. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
    Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
    In 13th China International Forum on Solid State Lighting (SSLChina),
    2016.
    document

  33. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
    Optical Materials,
    Volume 49, pp. 79-84, 2015.

  34. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
    Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
    Optical Materials,
    Volume 45, pp. 37-41, 2015.

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