Dong Hu
Publications
- Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
Applied Thermal Engineering,
Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503 - Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
IEEE Transactions on Electron Devices,
Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066 - Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100810 - Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
Journal of Physics: Condensed Matter,
Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f - Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
In Proc. IEEE Nano,
pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705 - Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
Corrosion Science,
pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846 - Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
Journal of Physical Chemistry C,
2021.
document - Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
Jianwen Sun; Dong Hu; Zewen Liu; Luke Middelburg; Sten Vollebregt; Pasqualina M. Sarro; Guoqi Zhang;
Sensors and Actuators A: Physical,
Volume 314, pp. 112217, 2020.
document - Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
Results in Physics,
2020.
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