Department of Microelectronics
Faculty of Electrical Engineering, Mathematics, and Computer Science

Peng Guo

Publications

  1. A 125μm-Pitch-Matched Transceiver ASIC with Micro-Beamforming ADC and Multi-Level Signaling for 3-D Transfontanelle Ultrasonography
    Peng Guo; Fabian Fool; Zu-Yao Chang; Emile Noothout; Hendrik J. Vos; Johan G. Bosch; Nico de Jong; Martin D. Verweij; Michiel A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    pp. 1--14, 2024. early access. DOI: 10.1109/JSSC.2024.3355854

  2. A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7x23.4mm2 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer
    Nuriel N.M. Rozsa; Zhao Chen; Taehoon Kim; Peng Guo; Yannick Hopf; Jason Voorneveld; Djalma Simoes dos Santos; Emile Noothout; Zu-Yao Chang; Chao Chen; Vincent A. Henneken; Nico de Jong; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Michiel A. P. Pertijs;
    In Dig. Techn. Paper IEEE Symposium on VLSI Circuits (VLSI),
    2024. Accepted.

  3. A Pitch-matched Low-noise Analog Front-end with Accurate Continuous Time-gain Compensation for High-density Ultrasound Transducer Arrays
    Peng Guo; Zu-Yao Chang; Emile Noothout; Hendrik J. Vos; Johan G. Bosch; Nico de Jong; Martin D. Verweij; Michiel A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 6, pp. 1693--1705, June 2023. DOI: 10.1109/jssc.2022.3200160

  4. A 1.2 mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging
    Peng Guo; Fabian Fool; Zu-Yao Chang; Emile Noothout; Hendrik J. Vos; Johan G. Bosch; Nico de Jong; Martin D. Verweij; Michiel A. P. Pertijs;
    IEEE Journal of Solid-State Circuits,
    Volume 58, Issue 9, pp. 2607--2618, September 2023. DOI: 10.1109/jssc.2023.3271270

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