News

Yannick Hopf receives SSCS Predoctoral Achievement Award

• Monday, 6 March 2023

At the 2023 International Solid-State Circuit Conference (ISSCC), Yannick Hopf was awarded a Predoctoral Achievement Award from the IEEE Solid-State Circuit Society (SSCS). ISSCC is the leading conference for solid-state circuits and took place on 19 – 23 February. The Predoctoral Achievement Award is the highest honor the society bestows upon student members and awarded to promising graduate students based on their academic record.

In the course of his PhD, Yannick has worked on ASICs for 3D ultrasound imaging of the heart. Two prototypes have been successfully developed and evaluated for the use in intra-cardiac catheters. The work has led to innovations in several circuit blocks as well as on the system level. The final design is the first to combine high-voltage transmitters, analog front-ends, micro-beamforming, digitization, datalinks and transducers, enabling high-frame-rate 3D imaging.

Yannick works at the Smart Ultrasound group at the Electronic Instrumentation Laboratory, under supervision of Dr. Ir. Michiel Pertijs, in close collaboration with the Acoustical Wavefield Imaging group at the Faculty of Applied Sciences, and the Biomedical Engineering group at Erasmus MC. Yannick's work is part of the 3D-ICE project.

IEEE SPS Student Scholarship Program

• Thursday, 2 March 2023

The IEEE Signal Processing Society (SPS) awards scholarships of up to a total of US$7,000 for up to three years of consecutive support to students who have expressed interest and commitment to pursuing signal processing education and real-world career experiences.

Students and graduate students from all 10 IEEE Regions are encouraged to apply!

This is not a full scholarship but rather a supplementary fund in order to support the signal processing field.  Apply before 30 June 2023.

Prof. Kofi Makinwa top contributor ' chip olympics', ISSCC

• Tuesday, 21 February 2023

At the 70^th anniversary of the International Solid-State Circuits Conference (ISSCC), often known as the “chip Olympics”, Prof. Kofi Makinwa is recognized as its top contributor. Since 2002, he has had a total of 77 papers accepted, and this year, he and his students contributed 8 papers – the best result ever for the TU Delft.

About ISCC

The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts.

Sensors and CMOS Interface Electronics (SCIE) Course

• Wednesday, 8 February 2023

Would you like to learn about smart sensors and interface circuits? Register for our course “Sensors and CMOS Interface Electronics”, co-organized by TU Delft and MEAD Education. See: Sensors and CMOS Interface Electronics

The course will take place online, on 8 days between March 27 and April 6, with two lectures per day timed conveniently for participation from anywhere on the globe.

Topics include smart-sensor design, calibration techniques, references, offset-cancellation, analog-to-digital conversion, instrumentation amplifiers and energy harvesting. Moreover, the course features lectures by experts in the field dedicated to smart inertial sensors, magnetic sensors, temperature sensors, image sensors, ultrasonic sensors, capacitive sensors, and implantable medical devices.

Kick-off AGRARSENSE project

• Wednesday, 1 February 2023

A new project takes agricultural and forestry related productivity to the next level. The consortium, which includes TUDelft, will develop European state-of-the-art technologies in electronic components and systems for future needs, building European resilience in critical sectors and strongly contribute to sustainability targets and climate change mitigation.

Adequate food and its security is a global challenge, impacted by rapidly compounding effects of climate change, supply chains, human labour shortage and political and military aggression to name a few. We need transparent and improved productivity of agriculture and forestry and easy access to state-of-the-art technological innovation and automation. Also, more sustainable fertilizers and irrigation use is additionally key to saving the climate. Hence, European resilience calls for efficient technological solutions ranging from hardware to holistic data management.

Focus on food security, improved productivity of agriculture and forestry

The AGRARSENSE project, launched in January 2023, responds to these needs by developing technologies for seven different use cases that represent seven different angles on today’s European agriculture and forestry: Greenhouses, vertical farming, precision viticulture, agriculture robotics, forestry machinery and optimal soil management and fertilization as well as agriculture related water management. The electronics components and systems related technology R&D includes e.g., plant, soil, and water sensors and related integration, as well as software, connectivity, and data management solutions. Safety, security, and reliability R&D as well as autonomous movement and robotics platforms pave the way to full commercial utilization of the project outcomes.
 

AGRARSENSE brings together a total of 52 partners from 15 EU countries

Within the Dutch-led Greenhouse use case and with the other European partners, the TUDelft will focus on two technology development activities. One is the development of a 2D material-based VOC sensor that aims at sniffing out plant diseases to enable better prediction of crop health. This research, led by Sten Vollebregt, will focus both on the development of the sensor platform and the packaging of the sensor to result in a reliable demonstrator. The second activity, led by Qinwen Fan, will focus on developing power-efficient electronic drivers that will be used in, among others, greenhouse robotics.