[2024-2025] Circuit readout of 3D Hall device

Integrated magnetic sensors are some of the most pervasive type of sensors. They are commonly employed in automotive applications to monitor power and speed, but also in industrial and consumer electronics for position sensing applications. Recently, our group fabricated a novel type of 3D magnetometer based on an inverted pyramid structure, displaying high sensitivity for the three magnetic field components. Now, the objective is to create a CMOS-integrated circuit to perform the sensor readout, implementing an innovative current spinning scheme developed by our group.

Assignment

In this project, you will:

1.     Design a processing circuit for current spinning and amplifying 3D Hall effect sensors (PCB/IC).

2.     Tapeout the circuit on a CMOS process (time/resource permitting)

3.     Package and test the chip with the 3D Hall effect device.

Requirements

Recommended Background (but not all is required - you can learn in the project!)

CMOS circuit design

Experience with Cadence

Semiconductor physics

Benchtop device testing

Interest in magnetic sensing applications!

Contact

Last modified: 2024-11-19