Online Thermal Reliability Monitoring During Power Cycling Test by SiC TTC

The thermal characteristic evaluation and reliability of WBG devices remain important issues in harsh conditions. Power cycling at high temperatures causes crack or delamination failure especially at the die-attached bonded interface in long term.

We designed a modular SiC TTC to mimic the behaviour of WBG power modules with high thermal conductively. The fabricated TTC can be used in power cycling tests to examine the thermal reliability by monitoring changes in the internal thermal resistance.

Assignment

The student will perform the assignment at ECTM:

• Duration: ~9 months.
• Location: EKL cleanrooms and other facilities.

The expected activities to be carried out by the student are:

• Preparing the high power electrical setup.
• Power cycling test using LabVIEW and recording temperature data.
• Thermal reliability investigation by monitoring thermal resistances.

Requirements

You are an ambitious student looking for a challenging thesis project on a sensor characterization and optimization problem. You have a physics, mechanics, or microelectronics background and an interest in hands-on experiences and electronic measurement setups. Experience with running scripts in LabVIEW or other automated measurement software is highly recommended. Good communication skills in English and a pro-active attitude are expected.

Contact

Last modified: 2022-04-11