Agenda

32nd Workshop on Advances in Analog Circuit Design

32nd Workshop on Advances in Analog Circuit Design


The aim of the Workshop on Advances in Analog Circuit Design (AACD) is to bring together a large group of people working at the frontiers of analog circuit design, to study and discuss possibilities and future developments.

The workshop lasts three days and runs yearly since 1992, covering every year three specific topics in the field on analog design (one topic per day).

This year the 32nd edition of the AACD workshop will take place in Pavia, Italy, from April 9th to April 11th, 2024 and will cover the following topics:

AACD is recognized as Ph. D. School. For Ph. D. Students that need a final exam for gaining ECTS, a test will be organized online a few weeks after the Workshop.

Additional information ...

Overview of Conferences

Agenda

ME colloquium

Francesco Fioranelli

Radar & More: Research Activities Overview

In this talk Francesco will introduce and summarize the main research activities performed at the Microwave Sensing Signals & Systems (MS3) Group, in the area of radar systems/applications and radar signal processing.

Thije Rooijers

Dynamic Offset Compensated Amplifiers with Sub-pA Input Current and Low Distortion

Dynamic offset compensation techniques are widely used to achieve low offset, offset drift and 1/f noise. However, they also introduce input current and distortion. This work will present dynamic offset compensated amplifier with sub-pA input current and low intermodulation distortion.

PhD Thesis Defence

Ignacio Roldan

Angle Estimation and Target Detection with Automotive Radar. Machine Learning and Compressive Sensing Approaches

PhD Thesis Defense

Aybüke Erol

Modelling Spatiotemporal Variability of Brain Responses in Functional Ultrasound

PhD Thesis Defence

Shanliang Deng

Interactive Optoelectronics Platform for Optogenetic Applications

PhD Thesis Defence

Tworit Dash

On Doppler Processing for Fast Scanning Weather Radars

PhD Thesis Defence

Romina Sattari

Multi-domain reliability monitoring of semiconductor packaging in harsh environments