Department of Microelectronics
Faculty of Electrical Engineering, Mathematics, and Computer Science

Boyao Zhang

Publications

  1. Low Temperature Sintering of Cu Nanoparticle Paste: Mechanism and die attach application
    Boyao Zhang;
    PhD thesis, Delft University Technology, 2020.
    document

  2. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
    Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
    In 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE,
    2019. DOI: 10.1109/TRANSDUCERS.2019.8808192

  3. 3D interconnect technology based on low temperature copper nanoparticle sintering
    Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
    In 17th International Conference on Electronic Packaging Technology (ICEPT),
    2016.
    document

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