MSc Tim Hosman

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Themes: Health and Wellbeing, XG - Next Generation Sensing and Communication

Biography

Tim Hosman is a PhD student in a collaborative project between Electronic Components, Technology and Materials (ECTM) and Electronic Circuits and Architectures (ELCA) and is focussing on implementing dielectric spectroscopy as a novel sensing technique for organs-on-chip applications. Tim is passionate about electronics with a positive societal impact, particularly medical microsystems. He received his MSc degree in Microelectronics in 2020 at the TU Delft, specialising in bioelectronics.

Tim has previously worked as an electronics design engineer in the Electronic Instrumentation (EI) group at the TUDelft, where he co-developed prototypes for portable ultrasound imaging. Namely, the ULIMPIA smart body patch and a transcranial ultrasound probe for CUBE.

For his graduation project, conducted at Fraunhofer IZM in Berlin, he worked on a high-density interconnect technology optimised for flexible implantable devices. His work involved manufacturing challenges in flip-chip bonding, transfer processes and TPU lamination, as well as theoretical challenges such as routing optimisation.

Before his MSc, Tim voluntarily dedicated a year as a Chief Electrical Engineer to Project MARCH in 2016-2017. This project is a team run by 31 students of the TU Delft that built an exoskeleton for people with paraplegia within a year, achieving second place in the Cybathlon Experience competition in 2017. Tim was the lead engineer of 4 electrical engineers and was foremost responsible for the entire concept, design and realisation of the exoskeleton’s electrical system.

Publications

Dielectric spectroscopy for non-invasive sensing of multi-layered organ-on-chip devices
T. Hosman; M. Spirito; M. Mastrangeli;
In XXXV Eurosensors Conference,
2023.
A Low-Power Reconfigurable Transceiver ASIC for a CMUT-based Wearable Ultrasound Patch
Mingliang Tan; Tim Hosman; Jae-Sung An; Zu-Yao Chang; Michiel Pertijs;
In Annual Workshop on Circuits, Systems and Signal Processing (ProRISC),
July 2021.
Towards a flexible brain implant with 10.000 independent channels
T. B. Hosman; W. Serdijn; and V. Giagka;
In Book of Abstracts, SAFE 2019,
Delft, the Netherlands, July 4-5 2019.
document
Towards a Microfabricated Flexible Graphene-Based Active Implant for Tissue Monitoring During Optogenetic Spinal Cord Stimulation
A.I. Velea; S. Vollebregt; T. Hosman; A. Pak; V. Giagka;
In Proceedings IEEE Nanotechnology Materials and Devices Conference (NMDC) 2019,
Stockholm, Sweden, Oct. 2019.

Abstract: ...
This work aims to develop a smart neural interface with transparent electrodes to allow for electrical monitoring of the site of interest during optogenetic stimulation of the spinal cord. In this paper, a microfabrication process for the wafer-level development of such a compact, active, transparent and flexible implant is presented. Graphene has been employed to form the transparent array of electrodes and tracks, on top of which chips have been bonded using flip-chip bonding techniques. To provide high flexibility, soft encapsulation, using polydimethylsiloxane (PDMS) has been used. Making use of the "Flex-to-Rigid" (F2R) technique, cm-size graphene-on-PDMS structures have been suspended and characterized using Raman spectroscopy to qualitatively evaluate the graphene layer, together with 2-point measurements to ensure the conductivity of the structure. In parallel, flip-chip bonding processes of chips on graphene structures were employed and the 2-point electrical measurement results have shown resistance values in the range of kΩ for the combined tracks and ball-bonds.

document
Towards a Microfabricated Flexible Graphene-Based Active Implant for Tissue Monitoring During Optogenetic Spinal Cord Stimulation
Andrada Iulia Velea; Sten Vollebregt; Tim Hosman; Anna Pak; Vasiliki Giagka;
In Proc. IEEE NMDC,
2019.

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Last updated: 9 Nov 2022