dr. Fan

Assistant Professor
Electronic Instrumentation (EI), Department of Microelectronics

PhD thesis (Dec 2013): Capacitively-Coupled Chopper Amplifiers
Promotor: Kofi Makinwa

Expertise: class D amplifiers, power management ICs and wireless sensor network

Themes: Autonomous sensor systems

Biography

Qinwen Fan received the B.Sc. degree in electronic science and technology from Nankai University in China in 2006 and the M.Sc. degree (cum laude) in microelectronics from Delft University of Technology, The Netherlands in 2008. She further continued as a PhD candidate in the same university and has received the degree in 2013. From August 2007 to August 2008, she was an intern at NXP Research Laboratories, Eindhoven, The Netherlands, where she designed a precision instrumentation amplifier for bio-medical purposes. From October 2012 to May 2015, she worked at Maxim Integrated Products in Delft, The Netherlands. From June 2015 to January 2017, she worked at Mellanox in Delft, the Netherlands. Since 2017, she rejoined the Delft University of Technology and is currently an Assistant Professor in the electronics and instrumentation laboratory. Her current research interests include: precision analog and mixed-signal readout IC; class D amplifier for audio applications; power management ICs; wireless sensor network for environmental sensing. Dr. Fan serves as a reviewer of the IEEE JOURNAL OF SOLID-STATE CIRCUITS.

EE4C08 Measurement and instrumentation

EE4C10 Analog Circuit Design Fundamentals

ET4382 Introduction to power conversion technology

This course teaches you how to design class D audio amplifiers, inductive and capacitive DC-DC converters in CMOS technology.

  1. A Reliability Prediction Methodology for LED Arrays
    Bo Sun; Jiajie Fan; Xuejun Fan; Kouchi Zhang; Guohao Zhang;
    IEEE Access,
    Volume 7, pp. 8127-8134, 2019.

  2. Degradation of optical materials in solid-state lighting systems
    M. Yazdan Mehr; A. Bahrami; W.D. van Driel; X.J. Fan; J. L. Davis; Kouchi Zhang;
    International Materials Reviews,
    2019.

  3. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; Kouchi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    2019.

  4. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; Kouchi Zhang;
    Results in Physics,
    Volume 12, pp. 712-717, 2019.

  5. Stress analysis of pressure-assisted sintering for the double-side assembly of power module
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; Kouchi Zhang; Fenglian Sun;
    Soldering and Surface Mount Technology,
    2019.

  6. General coupling model for electromigration and one-dimensional numerical solutions
    Zhen Cui; Xuejun Fan; Kouchi Zhang;
    Journal of Applied Physics,
    Volume 125, pp. 105101-1-9, 2019.

  7. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances
    Zuopeng Qu; Hongyu Tang; Huaiyu Ye; Xuejun Fan; Kouchi Zhang;
    In EurosimE,
    2019.

  8. Design Considerations for a Mems Coriolis Mass Flow Sensing System
    A.C. de Oliveira; T. Schut; J. Groenesteijn; Q. Fan; R.Wiegerink; K.A.A. Makinwa;
    In MFHS,
    2019.

  9. Thermal Management on IGBT Power Electronic Devices and Modules
    Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; Kouchi Zhang;
    IEEE Access,
    Volume 6, pp. 12868-12884, 2018.

  10. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating
    Liangbiao Chen; Jiang Zhou; Hsing-Wei Chu; Kouchi Zhang; Xuejun Fan;
    Applied Mechanics Reviews,
    Volume 70, Issue 2, pp. 020803-1-16, 2018.

  11. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
    Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 84, pp. 140-148, 2018.

  12. A new hermetic sealing method for ceramic package using nanosilver sintering technology
    Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 143-149, 2018.

  13. A stochastic process based reliability prediction method for LED driver
    Bo Sun; Xuejun Fan; Willem van Driel; Chengqiang Cui; Kouchi Zhang;
    Reliability Engineering and System Safety,
    Volume 178, pp. 140-146, 2018.

  14. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; Kouchi Zhang; Fenglian Sun;
    IEEE Transactions on Device and Materials Reliability,
    Volume 18, Issue 2, pp. 240-246, 2018.

  15. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
    Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; Kouchi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 8, Issue 7, pp. 1254-1262, 2018.

  16. The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene
    Yang, N., Yang, D., Zhang, G., Chen, L., Liu, D., Cai, M. & Fan, X.;
    Sensors,
    2018. DOI: https://doi.org/10.3390/s18020422

  17. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
    Zhen Cui; Xianping Chen; Xuejun Fan; Kouchi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  18. Capacitively-Coupled Chopper Instrumentation Amplifiers: An Overview
    Qinwen Fan; Kofi A. A. Makinwa;
    In Proc. IEEE Sensors,
    10 2018. DOI: 10.1109/ICSENS.2018.8589958

  19. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
    Bo Sun; Jiajie Fan; Xuejun Fan; Kouchi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  20. Fully Capacitive Coupled Input Choppers
    J. H. Huijsing; Q. Fan; K. A. A. Makinwa;
    Patent, US US10033369B2, July 2018. Assignee: Maxim Integrated Products Inc.

  21. Color shift acceleration on mid-power LED packages
    Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
    Keywords: ... Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

  22. Phosphor–silicone interaction effects in high power white light emitting diode packages
    J Fan; M Zhang; X Luo; C Qian; X Fan; A Ji; Kouchi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 28, Issue 23, pp. 17557-17569, 2017.

  23. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
    H Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 78, pp. 197-204, 2017.

  24. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
    C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; Kouchi Zhang;
    Materials,
    Volume 10, Issue 10, pp. 1181, 2017.

  25. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
    F Hou; T Lin; L Cao; F Liu; J Li; X Fan; Kouchi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 7, Issue 10, pp. 1721-1728, 2017.

  26. Modeling nonlinear moisture diffusion in inhomogeneous media
    L Chen; J Zhou; H Chu; Kouchi Zhang; X Fan;
    Microelectronics Reliability,
    Volume 75, pp. 162-170, 2017.

  27. Color shift failure prediction for phosphor-converted white LEDs by modeling features of spectral power distribution with a nonlinear filter approach
    J Fan; MG Mohamed; C Qian; X Fan; Kouchi Zhang; M Pecht;
    Materials 10,
    Volume 7, pp. 819, 2017.

  28. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
    J Fan; C Yu; C Qian; X Fan; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 74, pp. 179-185, 2017.

  29. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
    C Qian; Y Li; J Fan; X Fan; J Fu; L Zhao; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 74, pp. 173-178, 2017.

  30. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
    Bo Sun; X Fan; L Li; H Ye; W van Driel; Kouchi Zhang;
    IEEE Transactions on Components and Packaging and Manufacturing Technology,
    Volume 7, Issue 7, pp. 1081-1088, 2017.

  31. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
    Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; Kouchi Zhang;
    Reliability Engineering & System Safety,
    Volume 163, pp. 14-21, 2017.

  32. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
    HY Tang; HY Ye; XP Chen; C Qian; XJ Fan; Kouchi Zhang;
    IEEE Access,
    Volume 5, pp. 16459-16468, 2017.

  33. Prediction of lumen depreciation and color shift for phosphor-converted white light-emitting diodes based on a spectral power distribution analysis method
    C Qian; J Fan; X Fan; Kouchi Zhang;
    IEEE Access,
    Volume 5, pp. 24054-24061, 2017.

  34. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
    Hongyu Tang; Huaiyu Ye; X.P. Chen; C. Qian; X.J. Fan; Kouchi Zhang;
    IEEE Access,
    Volume 5, Issue 5, pp. 16459-16468, 2017.

  35. Capacitively-Coupled Chopper Operational Amplifiers
    Q. Fan; K.A.A. Makinwa; J.H. Huising;
    Springer, , 2017.

  36. Solid State Lighting Reliability Part 2: Components to Systems
    WD Van Driel; X Fan; Kouchi Zhang (Ed.);
    Springer, , 2017.

  37. Luminous flux modeling for high power LED automotive headlamp module
    C Yu; J Fan; C Qian; X Fan; Kouchi Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  38. Optimization of reflow soldering process for white LED chip-scale-packages on substrate
    C Jiang; W Guo; J Fan; C Qian; X Fan; Kouchi Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  39. Degradation mechanism analysis for phosphor/silicone composites aged under high temperature and high humidity condition
    X Luo; J Fan; M Zhang; C Qian; X Fan; G Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  40. A PoF and statistics combined reliability prediction for LED arrays in lamps
    B Sun; X Fan; J Fan; C Qian; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  41. In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
    I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; Kouchi Zhang; X Fan;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  42. Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
    J Fan; C Xie; C Qian; X Fan; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  43. Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
    C Qian; LL Luo; JJ Fan; XQ Li; XJ Fan; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  44. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
    Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; Kouchi Zhang;
    In EurosimE,
    2017.

  45. A High-Resolution Capacitance-to-Digital Converter based on Iterative Discharging
    Hao Fan;
    MSc thesis, Delft University of Technology, October 2017.
    document

  46. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
    Bo Sun; Xuejun Fan; Cheng Qian; Kouchi Zhang;
    IEEE Transactions on Industrial Electronics,
    pp. 99, 2016.

  47. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 63, pp. 2807-2814, 2016.

  48. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
    R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; Kouchi Zhang;
    Advanced Functional Materials,
    Volume 26, Issue 8, pp. 1233-1242, 2016.

  49. A review of small heat pipes for electronics
    Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; Kouchi Zhang;
    Applied Thermal Engineering,
    Volume 96, pp. 1-17, 2016.

  50. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires
    G Lu; van Driel, WD; Xuejun Fan; Yazdan Mehr, M; Jiajie Fan; Cheng Qian; KMB Jansen; GQ Zhang;
    Optical Materials,
    Volume 54, pp. 282--287, 2016. harvest. DOI: 10.1016/j.optmat.2016.02.023
    Keywords: ... Colour shift, PMMA, Solid state lighting, LED-based luminaire, Infrared absorption spectroscopy.

  51. Advances in Low-Offset Opamps
    Q. Fan; J.H. Huising; K.A.A. Makinwa;
    Switzerland: Springer, , 2016.

  52. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
    Bo Sun; Xuejun Fan; van Driel, Willem; Kouchi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387
    Keywords: ... Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.

  53. Lumen Decay Prediction in LED Lamps
    Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; Kouchi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391
    Keywords: ... Reliability, LED Lamp, Lumen Decay Prediction.

  54. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
    Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
    In 13th China International Forum on Solid State Lighting (SSLChina),
    2016.
    document

  55. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
    Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; Kouchi Zhang;
    In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2016.
    document

  56. Thermal analysis and optimization of IGBT power electronic module based on layout model
    Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; Kouchi Zhang;
    In ICEPT,
    2016.

  57. Fast-Settling Capacitive-Coupled Amplifiers
    J.H. Huijsing; Q. Fan; K.A.A. Makinwa; D. Fu; J. Wu; L. Zhou;
    Patent, 9,294,049, March 22 2016.

  58. Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
    Chuen Yung; Xuejun Fan; Kouchi Zhang; Michael Pecht;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 576-587, 2015.

  59. Degradation modeling of mid-power white-light LEDs by using Wiener process
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    Optics Express,
    Volume 23, pp. A966-A978, 2015.

  60. Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
    Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 2, pp. 220-228, 2015.

  61. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 49, pp. 79-84, 2015.

  62. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
    Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 45, pp. 37-41, 2015.

  63. Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
    X. J. Fan; R. H. Poelma; L. Chen; Kouchi Zhang;
    In ASME International Mechanical Engineering Congress and Exposition,
    2015.

  64. A 110dB SNR ADC with ±30V input common-mode range and 8¿V Offset for current sensing applications
    L. Xu; B. Gönen; Q. Fan; J.H. Huijsing; K.A.A. Makinwa;
    In M Romdhane; LC Fujino; J Anderson (Ed.), Proceedings of the 2015 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 89-91, 2015. Harvest Session 5.2.

  65. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
    Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, Kouchi;
    Advanced Functional Materials,
    Volume 24, Issue 36, pp. 5737-5744, 2014.
    document

  66. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
    Guangjun Lu; Yuan, C; Fan, X; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-3, 2014.

  67. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
    Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-4, 2014.

  68. Measurement and analysis of current noise in chopper amplifiers
    J. Xu; Q. Fan; J.H. Huijsing; C. van Hoof; R.F. Yazicioglu; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 48, Issue 7, pp. 1575-1584, 2013. Harvest.

  69. A multi-path chopper-stabilized capacitively coupled operational amplifier with 20V-input-common-mode range and 3μV offset
    Q. Fan; J.H. Huijsing; K.A.A. Makinwa;
    In A Chandrakasan (Ed.), Digest of Technical Papers - 2013 IEEE International Solid-State Circuits Conference (ISSCC 2013),
    IEEE, pp. 176-177, 2013. Harvest Session 10.

  70. Capacitively coupled chopper amplifiers
    Q. Fan;
    PhD thesis, Delft University of Technology, 2013. Onder embargo; staat niet in de IR van de Bibliotheek.

  71. A 21 nV/√ Hz chopper-stabilized multi-path current-feedback instrumentation amplifier with 2 μ v offset
    Q. Fan; J.H. Huijsing; K.A.A. Makinwa;
    IEEE Journal of Solid State Circuits,
    Volume 47, Issue 2, pp. 464-475, February 2012. Harvest Article number: 6112184.

  72. Solid State Lighting Reliability: Components to Systems
    W.D. van Driel; X.J. Fan;
    Springer, , Aug. 2012. DOI 10.1007/978-1-4614-3067-4.

  73. Measurement and analysis of input current noise in chopper amplifiers
    J. Xu; Q. Fan; J.H. Huijsing; C. van Hoof; R.F. Yazicioglu; K.A.A. Makinwa;
    In Y. Deval; J-B Begueret; D Belot (Ed.), Proceedings 2012 38th European Solid-State Circuit Conference,
    IEEE, pp. 81-84, 2012.

  74. A capacitively coupled chopper instrumentation amplifier with a ±30V common-mode range, 160dB CMRR and 5μV offset
    Q. Fan; J.H. Huijsing; K.A.A. Makinwa;
    In L Fujino (Ed.), Digest of Technical Papers - 2012 IEEE International Solid-state Circuits Conference,
    IEEE, pp. 374-375, 2012. Harvest Article number: 6177045.

  75. A capacitively-coupled chopper operational amplifier with 3μV Offset and outside-the-rail capability
    Q. Fan; J.H. Huijsing; K.A.A. Makinwa;
    In Y. Deval; J-B Begueret; D Belot (Ed.), Proceedings 2012 38th European Solid-State Circuit Conference,
    IEEE, pp. 73-76, 2012.

  76. Synergistic toughening of epoxy-copper interface using a thiol-based coupling layer
    C.K.Y. Wong; S.Y.Y. Leung; H. Fan; M.M.F. Yuen;
    Journal of Adhesion Science and Technology,
    Volume 25, Issue 16, pp. 2081-2099, 2011. DOI 10.1163/016942410X544875.

  77. A 1.8 µW 60 nV/√Hz Capacitively-Coupled Chopper Instrumentation Amplifier in 65 nm CMOS for Wireless Sensor Nodes
    Qinwen Fan; Fabio Sebastiano; Johan H. Huijsing; Kofi A.A. Makinwa;
    {IEEE} J. Solid-State Circuits,
    Volume 46, Issue 7, pp. 1534 - 1543, July 2011. DOI: 10.1109/JSSC.2011.2143610
    Keywords: ... CMOS integrated circuits;choppers (circuits);instrumentation amplifiers;wireless sensor networks;CMOS technology;CMRR;DC servo loop;PSRR;biopotential sensing;capacitively-coupled chopper instrumentation amplifier;chopping ripple;current 1.8 muA;electrode offset suppression;low-power precision instrumentation amplifier;noise efficiency factor;positive feedback loop;power 1.8 muW;rail-to-rail input common-mode range;ripple reduction loop;size 65 nm;voltage 1 V;wireless sensor nodes;Capacitors;Choppers;Impedance;Noise;Sensors;Topology;Wireless sensor networks;Bio-signal sensing;chopping;high power efficiency;low offset;low power;precision amplifier;wireless sensor nodes.

    Abstract: ... This paper presents a low-power precision instrumentation amplifier intended for use in wireless sensor nodes. It employs a capacitively-coupled chopper topology to achieve a rail-to-rail input common-mode range as well as high power efficiency. A positive feedback loop is employed to boost its input impedance, while a ripple reduction loop suppresses the chopping ripple. To facilitate bio-potential sensing, an optional DC servo loop may be employed to suppress electrode offset. The IA achieves 1 µV offset, 0.16% gain inaccuracy, 134 dB CMRR, 120 dB PSRR and a noise efficiency factor of 3.3. The instrumentation amplifier was implemented in a 65 nm CMOS technology. It occupies only 0.1 mm² chip area (0.2 mm² with the DC servo loop) and consumes 1.8 µA current (2.1 µA with the DC servo loop) from a 1 V supply.

  78. Input characteristics of a chopped multi-path current feedback instrumentation amplifier
    Q. Fan; J.H. Huijsing; K.A.A. Makinwa;
    In {De Venuto}, D; L Benini (Ed.), 4th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI),
    IEEE, pp. 61-66, 2011.

  79. LPCVD amorphous SiCx for freestanding electron transparent windows
    B. Morana; J.F. Creemer; F. Santagata; C.C. Fan; H.T.M. Pham; G. Pandraud; F.D. Tichelaar; P.M. Sarro;
    In Y. Suzuki; Man Wong (Ed.), Proceedings of IEEE MEMS 2010 Conference,
    Wanchai, Hong Kong, IEEE, pp. 572-575), 2010.

  80. Molecular design of reliable epoxy-copper interface using molecular dynamic simulation
    C. K. Y. Wong; H. Fan; G. Zhang; M. Yuen;
    In Proceedings of International Conference of Thermal, Mechanical & Multi-Physics Simulation, and Experiments Microelectronics and Microsystems (EuroSimE),
    France, pp. 1-7, 2010.

  81. A 21nV/¿Hz chopper-stabilized multipath current-feedback instrumentation amplifier with 2µV offset
    Q. Fan; J.H. Huijsing; K.A.A. Makinwa;
    In H Hidaka; B. Nauta (Ed.), Digest of Technical Papers - 2010 IEEE International Solid-State Circuits Conference,
    IEEE, pp. 80-81, 2010.

  82. A 1.8µW 1-µV-offset capacitively-coupled chopper instrumentation amplifier in 65nm CMOS
    Qinwen Fan; Fabio Sebastiano; Johan H. Huijsing; Kofi A.A. Makinwa;
    In Proc. European Solid-State Circuits Conference,
    Sevilla, Spain, pp. 170 - 173, September14--16 2010. DOI: 10.1109/ESSCIRC.2010.5619902
    Keywords: ... CMOS integrated circuits;instrumentation amplifiers;CMOS;input impedance;noise efficiency factor;positive feedback loop;precision capacitively-coupled chopper instrumentation amplifier;rail-to-rail DC common-mode input range;ripple reduction loop;size 65 nm;Accuracy;Choppers;Impedance;Instruments;Noise;Resistors;Topology.

    Abstract: ... This paper describes a precision capacitively-coupled chopper instrumentation amplifier (CCIA). It achieves 1µV offset, 134dB CMRR, 120dB PSRR, 0.16% gain accuracy and a noise efficiency factor (NEF) of 3.1, which is more than 3x better than state-of-the-art. It has a rail-to-rail DC common-mode (CM) input range. Furthermore, a positive feedback loop (PFL) is used to boost the input impedance, and a ripple reduction loop (RRL) is used to reduce the ripple associated with chopping. The CCIA occupies only 0.1mm² in a 65nm CMOS technology. It can operate from a 1V supply, from which it draws only 1.8µA.

  83. A 2.1 µW Area-Efficient Capacitively-Coupled Chopper Instrumentation Amplifier for ECG Applications in 65 nm CMOS
    Qinwen Fan; Fabio Sebastiano; Johan H. Huijsing; Kofi A.A. Makinwa;
    In Proc. Asian Solid-State Circuits Conference,
    Beijing, China, pp. 1 - 4, November8--10 2010. DOI: 10.1109/ASSCC.2010.5716624
    Keywords: ... CMOS integrated circuits;amplifiers;biomedical electrodes;choppers (circuits);electrocardiography;CMOS technology;DC servo loop;ECG application;area efficient chopper instrumentation amplifier;capacitive feedback network;capacitively coupled chopper instrumentation amplifier;electrocardiography;electrode-tissue interface;power 2.1 muW;switched capacitor integrator;Choppers;DSL;Earth Observing System;Electrocardiography;Impedance;Instruments;Noise.

    Abstract: ... This paper describes a capacitively-coupled chopper instrumentation amplifier for use in electrocardiography (ECG). The amplifier's gain is accurately defined by a capacitive feedback network, while a DC servo loop rejects the DC offset generated by the electrode-tissue interface. The high-pass corner frequency established by the servo loop is realized by an area-efficient switched-capacitor integrator. Additional feedback loops are employed to boost the amplifier's input-impedance to 80 MΩ and to suppress the chopper ripple. Implemented in a 65 nm CMOS technology, the amplifier draws 2.1 µA from a 1 V supply and occupies 0.2 mm².

  84. Very thin SiC membranes for micromachined vacuum sensors
    H.T.M. Pham; C. Fan; G. Pandraud; J.F. Creemer; N.M. van der Pers; P. Visser; C. Kwakernaak;
    In Proceedings of IEEE sensors 2008,
    Lecce, Italy, pp. 1143-1146, 2009.

  85. Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation
    C. K. Y. Wong; H. Fan; M. M. F. Yuen;
    IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies,
    Volume 31, pp. 297-308, 2008.

  86. Very thin SiC membranes for micromachines vacuum sensors
    H.T.M. Pham; C. Fan; G. Pandraud; J.F. Creemer; N.M. van der Pers; P. Visser; K. Kwakernaak; P.M. Sarro;
    In s.n. (Ed.), Proceedings of IEEE sensors 2008,
    IEEE Sensors, pp. 1143-1146, 2008.

  87. A chopper instrumentation amplifier for biopotential applications
    Q. Fan;
    PhD thesis, Delft University of Technology, 2008.

  88. Investigation of adhesion properties of Cu-EMC interface by molecular dynamic simulation
    C. K. Y. Wong; H. Fan; M. M. F. Yuen;
    In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Micro-Electronics and Micro-Systems-EuroSimE 2005,
    Berlin, pp. 31-35, 2005.
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