[2020] Influence of system integration and soft encapsulation on a wirelessly powered neural interface

The next generation of Active Implantable Medical Devices (AIMDs), namely electroceuticals, include low-cost miniaturized devices that employ flexible and soft encapsulation materials to house their electronic components. This approach requires the use of wireless power transfer (WPT) to enable telemetry applications and closed-loop operation and thus, more effective therapy to the patients. More specifically, focusing on deep implants we using ultrasound for the WPT.

However, the approach of soft encapsulation imposes additional constraints on the WPT link. More specifically, the WPT will be affected by the conductive and dielectric properties of the materials and the media surrounding the transducers (i.e substrate, coating materials, ASIC, body fluid). In addition, the electrical connection of the transducer to the load and substrate will also alter the mechanics of the system.

Assignment

In this master thesis project, the student will investigate the aforementioned influence of the system integration and packaging on the WPT. After defining different approaches and fabricating/ modeling representative test structures, the student will define design methods to mitigate these constraints, while maintaining the reliability and biocompatibility of the device, towards the realization of electroceuticals.

Requirements

Interested students should contact Dr. Vasiliki Giagka by sending an email expressing their interest in the project. The email should also contain the following: CV, list of courses you have attended so far and grades obtained, courses you are planning to take in the future, and more importantly a motivation letter explaining why you are interested in the project.

Contact

Last modified: 2022-02-11